公开(公告)号：WO2010105157A3

公开(公告)日：2012-02-23

申请号：PCT/US2010027141

申请日：2010-03-12

Applicant: TESSERA INC ,  HABA BELGACEM ,  MARCUCCI BRIAN

Inventor： HABA BELGACEM ,  MARCUCCI BRIAN

IPC: H01L23/49 ,  H01L23/31 ,  H01L23/552 ,  H01L23/66

CPC classification number: H01L23/552 ,  H01L23/3121 ,  H01L23/3192 ,  H01L23/66 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2223/6611 ,  H01L2223/6622 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45565 ,  H01L2224/45599 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48464 ,  H01L2224/48471 ,  H01L2224/48505 ,  H01L2224/48599 ,  H01L2224/48799 ,  H01L2224/49052 ,  H01L2224/49095 ,  H01L2224/49175 ,  H01L2224/49176 ,  H01L2224/85045 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/20752 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/4569 ,  H01L2224/05644 ,  H01L2224/45184 ,  H01L2224/05647 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/00012 ,  H01L2924/00011

Abstract: A microelectronic assembly can include a microelectronic device (310) having device contacts (312) exposed at a surface (328) thereof and an interconnection element having element contacts (340) and having a face adjacent to the microelectronic device. Conductive elements (365), e.g., wirebonds connect the device contacts with the element contacts and have portions extending in runs above the surface of the microelectronic device. A conductive layer (360) has a conductive surface (375) disposed at at least a substantially uniform distance above or below the plurality of the runs of the conductive elements. In some cases, the conductive material (360) can have first and second dimensions (326, 336) in first and second horizontal directions which are smaller than first and second corresponding dimensions (324, 334) of the microelectronic device. The conductive material (360) is connectable to a source of reference potential so as to achieve a desired impedance for the conductive elements.

Abstract translation: 微电子组件可以包括具有在其表面（328）处暴露的器件触点（312）的微电子器件（310）和具有元件触点（340）并具有与微电子器件相邻的面的互连元件。 导电元件（365），例如，引线将器件触点与元件触点连接，并且具有在微电子器件的表面上方延伸的部分。 导电层（360）具有导电表面（375），该导电表面设置在多个导电元件的行程之上或之下至少基本均匀的距离处。 在一些情况下，导电材料（360）可以在第一和第二水平方向上具有小于微电子器件的第一和第二对应尺寸（324,334）的第一和第二尺寸（326,336）。 导电材料（360）可连接到参考电位源，以便实现导电元件所需的阻抗。

公开(公告)号：WO2010105152A3

公开(公告)日：2011-10-27

申请号：PCT/US2010027135

申请日：2010-03-12

Applicant: TESSERA INC ,  HABA BELGACEM ,  MARCUCCI BRIAN

Inventor： HABA BELGACEM ,  MARCUCCI BRIAN

IPC: H01L23/49 ,  H01L23/66

CPC classification number: B81B7/0006 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2223/6611 ,  H01L2224/06136 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/4809 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48464 ,  H01L2224/48471 ,  H01L2224/49052 ,  H01L2224/49174 ,  H01L2224/49176 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1579 ,  H01L2924/19107 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00011 ,  H01L2224/4554

Abstract: A microelectronic assembly can include a microelectronic device, e.g., semiconductor chip (910), connected together with an interconnection element (930), e.g., substrate, the latter having signal contacts (990) and reference contacts (980). The reference contacts can be connectable to a source of reference potential such as ground or a voltage source other than ground such as a voltage source used for power. Signal conductors, e.g., signal wirebonds (965) can be connected to device contacts (912) exposed at a surface of the microelectronic device (910). Reference conductors, e.g., reference wirebonds (975) can be provided, at least one of which can be connected with two reference contacts (980) of the interconnection element (930). The reference wirebond (975) can have a run which extends at an at least substantially uniform spacing from a signal conductor, e.g., signal wirebond (965) that is connected to the microelectronic device over at least a substantial portion of the length of the signal conductor. In such manner a desired impedance may be achieved for the signal conductor.

Abstract translation: 微电子组件可以包括与互连元件（930）例如衬底连接在一起的微电子器件，例如半导体芯片（910），衬底具有信号触点（990）和参考触点（980）。 参考触点可以连接到参考电位源，例如接地或除接地之外的电压源，例如用于电源的电压源。 诸如信号引线键（965）的信号导体可以连接到暴露在微电子器件（910）的表面处的器件触点（912）。 可以提供参考导体，例如参考导线键（975），其中的至少一个可以与互连元件（930）的两个参考触点（980）连接。 参考引线键（975）可以​​具有以与信号导体至少基本均匀的间隔延伸的行程，例如在信号长度的至少大部分上连接到微电子器件的信号引线键（965） 导体。 以这种方式，可以为信号导体实现期望的阻抗。

公开(公告)号：WO2012074570A3

公开(公告)日：2012-09-27

申请号：PCT/US2011029394

申请日：2011-03-22

Applicant: TESSERA INC ,  OGANESIAN VAGE ,  HABA BELGACEM ,  MOHAMMED ILYAS ,  MITCHELL CRAIG ,  SAVALIA PIYUSH

Inventor： OGANESIAN VAGE ,  HABA BELGACEM ,  MOHAMMED ILYAS ,  MITCHELL CRAIG ,  SAVALIA PIYUSH

IPC: H01L21/60 ,  H01L23/48 ,  H01L23/498

CPC classification number: H01L23/481 ,  H01L21/76802 ,  H01L21/76805 ,  H01L21/76877 ,  H01L21/76898 ,  H01L21/78 ,  H01L23/145 ,  H01L23/147 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/89 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/13009 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/83 ,  H01L2224/9202 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2224/05552 ,  H01L2924/00

Abstract: A microelectronic assembly 100 is provided which includes a first element 110 consisting essentially of at least one of semiconductor or inorganic dielectric material having a surface 103 facing and attached to a major surface 104 of a microelectronic element 102 at which a plurality of conductive pads 106 are exposed, the microelectronic element 102 having active semiconductor devices therein. A first opening 111 extends from an exposed surface 118 of the first element 110 towards the surface 103 attached to the microelectronic element 102, and a second opening 113 extends from the first opening 111 to a first one of the conductive pads 106, wherein where the first and second openings meet, interior surfaces 121, 123 of the first and second openings extend at different angles relative to the major surface 104 of the microelectronic element 102. A conductive element 114 extends within the first and second openings 111, 113 and contacts the at least one conductive pad 106.

Abstract translation: 提供微电子组件100，其包括第一元件110，第一元件110基本上由至少一种半导体或无机介电材料组成，该第一元件110具有面对并连接到微电子元件102的主表面104的表面103，在微电子元件102的主表面104处，多个导电垫106 其中微电子元件102具有有源半导体器件。 第一开口111从第一元件110的暴露表面118朝向附接到微电子元件102的表面103延伸，并且第二开口113从第一开口111延伸到导电垫106中的第一个，其中， 第一和第二开口相遇，第一和第二开口的内表面121,123相对于微电子元件102的主表面104以不同的角度延伸。导电元件114在第一和第二开口111,113内延伸并接触 至少一个导电垫106。

公开(公告)号：WO2010104610A8

公开(公告)日：2011-11-17

申请号：PCT/US2010000777

申请日：2010-03-12

Applicant: TESSERA INC ,  KRIMAN MOSHE ,  AVSIAN OSHER ,  HABA BELGACEM ,  HUMPSTON GILES ,  BURSHTYN DMITRI

Inventor： KRIMAN MOSHE ,  AVSIAN OSHER ,  HABA BELGACEM ,  HUMPSTON GILES ,  BURSHTYN DMITRI

IPC: H01L21/98 ,  H01L21/768 ,  H01L23/48 ,  H01L25/065

CPC classification number: H01L25/0657 ,  H01L21/76805 ,  H01L23/481 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/0401 ,  H01L2224/13024 ,  H01L2224/24145 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2924/1461 ,  H01L2924/00

Abstract: A stacked microelectronic assembly is provided which includes first and second stacked microelectronic elements (101, 102). Each of the first and second microelectronic elements can include a conductive layer (610) extending along a face (608) of such microelectronic element. At least one of the first and second microelectronic elements can include a recess (618) extending from the rear surface towards the front surface, and a conductive via (605) extending from the recess through the bond pad (603) and electrically connected to the bond pad, with a conductive layer (610) connected to the via and extending along a rear face (608) of the microelectronic element (101, 102) towards an edge (620) of the microelectronic element. A plurality of leads (224) can extend from the conductive layers (610) of the first and second microelectronic elements and a plurality of terminals (616) of the assembly can be electrically connected with the leads.

Abstract translation: 提供堆叠的微电子组件，其包括第一和第二堆叠的微电子元件（101,102）。 第一和第二微电子元件中的每一个可以包括沿着这种微电子元件的面（608）延伸的导电层（610）。 第一和第二微电子元件中的至少一个可以包括从后表面朝向前表面延伸的凹槽（618），以及从凹部穿过接合焊盘（603）延伸并电连接到 接合焊盘，其中导电层（610）连接到通孔并且沿着微电子元件（101,102）的后表面（608）朝着微电子元件的边缘（620）延伸。 多个引线（224）可以从第一和第二微电子元件的导电层（610）延伸，并且组件的多个端子（616）可以与引线电连接。

公开(公告)号：WO2005065238A3

公开(公告)日：2009-03-26

申请号：PCT/US2004043049

申请日：2004-12-21

Applicant: TESSERA INC ,  DAMBERG PHILIP ,  HABA BELGACEM ,  TUCKERMAN DAVID B ,  KANG TECK-GYU

Inventor： DAMBERG PHILIP ,  HABA BELGACEM ,  TUCKERMAN DAVID B ,  KANG TECK-GYU

IPC: H01L23/48 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L23/498 ,  H01L23/52 ,  H01L29/40 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34

CPC classification number: H01L23/4985 ,  H01L23/49811 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K1/118 ,  H05K3/326 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/10674 ,  H01L2924/00

Abstract: A microelectronic package (20) includes a microelectronic element (22) having faces and contacts (26), a flexible substrate (30) overlying and spaced from a first face (24) of the microelectronic element (22), and a plurality of conductive terminals (42) exposed at a surface of the flexible substrate. The conductive terminals (42) are electrically interconnected with the microelectronic element (22) and the flexible substrate (30) includes a gap (50) extending at least partially around at least one of the conductive terminals (42). In certain embodiments, the package includes a support layer, such as a compliant layer (48), disposed between the first face (24) of the microelectronic element (22) and the flexible substrate (30). In other embodiments, the support layer includes at least one opening that is at least partially aligned with one of the conductive terminals.

Abstract translation: 微电子封装（20）包括具有面和触点（26）的微电子元件（22），覆盖并与微电子元件（22）的第一面（24）隔开的柔性衬底（30），以及多个导电 端子（42）暴露在柔性基板的表面。 导电端子（42）与微电子元件（22）电互连，并且柔性基板（30）包括至少部分地围绕至少一个导电端子（42）延伸的间隙（50）。 在某些实施例中，封装包括设置在微电子元件（22）的第一面（24）和柔性基板（30）之间的支撑层，例如顺应层（48）。 在其他实施例中，支撑层包括至少一个与导电端子之一至少部分对准的开口。

公开(公告)号：WO2006091793A8

公开(公告)日：2007-10-04

申请号：PCT/US2006006554

申请日：2006-02-23

Applicant: TESSERA INC ,  HABA BELGACEM

Inventor： HABA BELGACEM

IPC: H01L23/485 ,  H01L21/60

CPC classification number: H01L24/16 ,  G01R31/2896 ,  H01L23/3114 ,  H01L23/3171 ,  H01L23/525 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/0231 ,  H01L2224/0233 ,  H01L2224/0236 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/0554 ,  H01L2224/1132 ,  H01L2224/1147 ,  H01L2224/13016 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2224/29099

Abstract: A microelectronic assembly includes a microelectronic element (20), such as a semiconductor wafer or semiconductor chip, having a first surface (22) and contacts (24) accessible at the first surface (22), and a compliant layer (26) overlying the first surface of the microelectronic element, the compliant layer (26) having openings in substantial alignment with the contacts (24) of the microelectronic element. The assembly desirably includes conductive posts (38) overlying the compliant layer (26) and projecting away from the first surface (22) of the microelectronic element (20), the conductive posts (38) being electrically interconnected with the contacts (24) of the microelectronic element (20) by elongated, electrically conductive elements extending between the contacts (24) and the conductive posts (38).

Abstract translation: 微电子组件包括具有在第一表面（22）可接近的第一表面（22）和触点（24）的微电子元件（20），例如半导体晶片或半导体芯片，以及柔性层（26），其覆盖 微电子元件的第一表面，顺应层（26）具有与微电子元件的触点（24）基本对准的开口。 组件理想地包括覆盖顺应层（26）并远离微电子元件（20）的第一表面（22）突出的导电柱（38），导电柱（38）与触点（24）电互连 所述微电子元件（20）由在所述触头（24）和所述导电柱（38）之间延伸的细长的导电元件。

公开(公告)号：WO2007075727A3

公开(公告)日：2007-08-23

申请号：PCT/US2006048499

申请日：2006-12-20

Applicant: TESSERA INC ,  HABA BELGACEM ,  KANG TECK-GYU ,  MOHAMMED ILYAS ,  CHAU ELLIS

Inventor： HABA BELGACEM ,  KANG TECK-GYU ,  MOHAMMED ILYAS ,  CHAU ELLIS

IPC: H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L25/10

CPC classification number: H01L21/565 ,  G01R31/2886 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/49805 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/49894 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/0652 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of making a microelectronic assembly includes providing a microelectronic package having a substrate 400, a microelectronic element 410 overlying the substrate 400 and at least two conductive elements 418 projecting from a surface 402 of the substrate 400, the at least two conductive elements 418 having surfaces 434 remote from the surface 402 of the substrate 400. The method includes compressing the at least two conductive elements 418 so that the remote surfaces 434 thereof lie in a common plane, and after the compressing step, providing an encapsulant material 430 around the at least two conductive elements 418 for supporting the microelectronic package and so that the remote surfaces 434 of the at least two conductive elements 418 remain accessible at an exterior surface of the encapsulant material 430.

Abstract translation: 制造微电子组件的方法包括提供具有衬底400的微电子封装，覆盖衬底400的微电子元件410和从衬底400的表面402突出的至少两个导电元件418，所述至少两个导电元件418具有 表面434远离衬底400的表面402.该方法包括压缩至少两个导电元件418，使得它们的远端表面434位于公共平面中，并且在压缩步骤之后，围绕着该位置提供密封材料430 至少两个用于支撑微电子封装的导电元件418，并且使得至少两个导电元件418的远端表面434在密封剂材料430的外表面保持可访问。

公开(公告)号：WO2006020744A3

公开(公告)日：2006-06-08

申请号：PCT/US2005028492

申请日：2005-08-11

Applicant: TESSERA INC ,  HABA BELGACEM ,  BEROZ MASUD ,  URBISH GLENN ,  TUCKERMAN DAVID B

Inventor： HABA BELGACEM ,  BEROZ MASUD ,  URBISH GLENN ,  TUCKERMAN DAVID B

IPC: B81B7/00

CPC classification number: B81B7/007 ,  H03H3/02 ,  H03H9/0547 ,  H03H9/059 ,  H03H9/1057 ,  H03H9/1092

Abstract: As disclosed herein, structures and methods are provided for forming capped chips. As provided by the disclosed method, a metal base pattern (26) is formed on a chip (8) insulated from wiring (11) of the chip, and a cap (42) is formed including a metal. The cap (42) is joined to the metal base pattern (26) on the chip to form the capped chip (48). In one embodiment, a front surface (9) of the chip is exposed which extends from a contact (14) or (16) of the chip to an edge (13) of the chip (8). In another embodiment, a conductive connection is formed to the contact (14) or (16), the conductive connection extending from the contact to a terminal (46) at an exposed plane (49) above the front surface (9) of the chip (8).

Abstract translation: 如本文所公开的，提供了用于形成加盖芯片的结构和方法。 如所公开的方法所示，在与芯片的布线（11）绝缘的芯片（8）上形成金属基底图案（26），并且形成包括金属的帽（42）。 帽（42）连接到芯片上的金属基底图案（26）以形成封盖芯片（48）。 在一个实施例中，芯片的前表面（9）暴露，其从芯片的接触件（14）或（16）延伸到芯片（8）的边缘（13）。 在另一个实施例中，导电连接形成于接触件（14）或（16），导电连接件在芯片的前表面（9）上方的暴露平面（49）处从接触件延伸到端子（46） （8）。

公开(公告)号：WO2005086532A3

公开(公告)日：2006-01-26

申请号：PCT/US2005006565

申请日：2005-03-01

Applicant: TESSERA INC ,  HUMPSTON GILES ,  OSBORN PHILIP R ,  THOMPSON JESSE BURL ,  KUBOTA YOICHI ,  TSENG CHUNG-CHUAN ,  BURTZLAFF ROBERT ,  HABA BELGACEM ,  TUCKERMAN DAVID B ,  WARNER MICHAEL

Inventor： HUMPSTON GILES ,  OSBORN PHILIP R ,  THOMPSON JESSE BURL ,  KUBOTA YOICHI ,  TSENG CHUNG-CHUAN ,  BURTZLAFF ROBERT ,  HABA BELGACEM ,  TUCKERMAN DAVID B ,  WARNER MICHAEL

IPC: B81B7/00 ,  H01L23/495 ,  H04R19/00 ,  H04R19/04

CPC classification number: B81B7/0077 ,  B81B2201/0257 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05568 ,  H01L2224/05624 ,  H01L2224/16 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10155 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/19041 ,  H01L2924/3025 ,  H04R19/005 ,  H01L2924/00 ,  H01L2924/00014

Abstract: Various embodiments of packaged chips and ways of fabricating them are disclosed herein. One such packaged chip disclosed herein includes a chip having a front face, a rear face opposite the front face, and a device at one of the front and rear faces, the device being operable as transducer of at least one of acoustic energy and electromagnetic energy, and the chip including a plurality of bond pads exposed to one of the front and rear faces. The packaged chip includes a package element having a dielectric element and a metal layer disposed on the dielectric element, the package element having an inner surface facing the chop and an outer surface facing away from the chip. The metal layer includes a plurality of contacts exposed at at least one of the inner and outer surfaces, the contacts conductively connected to the bond pads. The metal layer further includes a first opening for passage of the at least one of acoustic energy and electromagnetic energy in a direction of at least one of the said device and from said device.

Abstract translation: 本文公开了封装芯片的各种实施例及其制造方法。 本文公开的一种这样的封装芯片包括具有前表面，与正面相对的后表面的芯片和在前表面和后表面中的一个处的器件，该器件可操作为声能和电磁能中的至少一个的换能器 并且所述芯片包括暴露于所述前表面和后表面中的一个的多个接合焊盘。 封装芯片包括具有介电元件和设置在电介质元件上的金属层的封装元件，封装元件具有面向斩波的内表面和背离芯片的外表面。 金属层包括暴露在内表面和外表面中的至少一个的多个触点，触点导电地连接到接合焊盘。 金属层还包括第一开口，用于沿着所述装置和所述装置中的至少一个的方向通过声能和电磁能中的至少一个。

公开(公告)号：WO2012037216A3

公开(公告)日：2012-06-07

申请号：PCT/US2011051552

申请日：2011-09-14

Applicant: TESSERA INC ,  OGANESIAN VAGE ,  HABA BELGACEM ,  MOHAMMED ILYAS ,  MITCHELL CRAIG ,  SAVALIA PIYUSH

Inventor： OGANESIAN VAGE ,  HABA BELGACEM ,  MOHAMMED ILYAS ,  MITCHELL CRAIG ,  SAVALIA PIYUSH

IPC: H01L21/768 ,  H01L23/48 ,  H01L25/065

CPC classification number: H01L23/481 ,  H01L21/76898 ,  H01L23/50 ,  H01L24/03 ,  H01L24/05 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/06181 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06544 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A method of fabricating a semiconductor assembly 10 can include providing a semiconductor element 20 having a front surface 21, a rear surface 22, and a plurality of conductive pads 50, forming at least one hole 40 extending at least through a respective one of the conductive pads 50 by processing applied to the respective conductive pad 50 from above the front surface 21, forming an opening 30 extending from the rear surface 22 at least partially through a thickness of the semiconductor element 20, such that the at least one hole 30 and the opening 40 meet at a location between the front and rear surfaces, and forming at least one conductive element 60, 80 exposed at the rear surface 22 for electrical connection to an external device, the at least one conductive element extending within the at least one hole 30 and at least into the opening 40, the conductive element being electrically connected with the respective conductive pad 50.

Abstract translation: 制造半导体组件10的方法可以包括提供具有前表面21，后表面22和多个导电焊盘50的半导体元件20，形成至少一个孔40，所述至少一个孔40至少延伸穿过相应的一个导电 通过处理从前表面21上方施加到相应的导电焊盘50的焊盘50形成从后表面22至少部分地延伸穿过半导体元件20的厚度的开口30，使得至少一个孔30和 开口40在前表面和后表面之间的位置汇合，并且形成暴露在后表面22处用于电连接到外部装置的至少一个导电元件60,80，所述至少一个导电元件在至少一个孔 并且至少进入开口40中，导电元件与相应的导电垫50电连接。