公开(公告)号：WO2008130335A3

公开(公告)日：2009-01-08

申请号：PCT/US2006023160

申请日：2006-06-15

Applicant: REACTIVE NANOTECHNOLOGIES INC ,  WEIHS TIMOTHY P ,  BESNOIN ETIENNE ,  VINCENT RAMZI ,  VALLIAPPAN SOMASUNDARAM ,  HEIAN ELLEN ,  VAN HEERDEN DAVID ,  RUDE TIMOTHY RYAN ,  KNIO OMAR ,  SPRAKER RONALD ,  LIN YUPING

Inventor： WEIHS TIMOTHY P ,  BESNOIN ETIENNE ,  VINCENT RAMZI ,  VALLIAPPAN SOMASUNDARAM ,  HEIAN ELLEN ,  VAN HEERDEN DAVID ,  RUDE TIMOTHY RYAN ,  KNIO OMAR ,  SPRAKER RONALD ,  LIN YUPING

IPC: B21D33/00

CPC classification number: C22C30/00 ,  C06B21/00 ,  C06B45/12 ,  C22C5/04 ,  C22C19/00 ,  F42B3/18 ,  F42B39/14 ,  Y10T29/30 ,  Y10T29/302 ,  Y10T29/49002 ,  Y10T29/49227 ,  Y10T428/12493 ,  Y10T428/12632

Abstract: Applicants have discovered that electrostatic discharge (ESD) may, in some circumstances, result in current densities sufficient to ignite unprotected reactive composite materials. They have further discovered that a reactive composite material (RCM) can be protected from ESD ignition without adversely affecting the desirable properties of the RCM by the application of conducting and/or insulating materials at appropriate locations on the RCM. Thus ESD-protected RCM structures can be designed for such sensitive applications as ignition of propellants, generation of light bursts, and structural materials for equipment that may require controlled self-destruction.

Abstract translation: 申请人已经发现，在某些情况下，静电放电（ESD）可以导致足够的电流密度来点燃未受保护的反应性复合材料。 他们进一步发现，通过在RCM的适当位置施加导电和/或绝缘材料，可以保护反应性复合材料（RCM）免于ESD点火，而不会对RCM的期望性能产生不利影响。 因此，ESD保护的RCM结构可以设计用于诸如点燃推进剂，产生光爆炸以及可能需要受控自我破坏的设备的结构材料等敏感应用。

公开(公告)号：WO2007127931A2

公开(公告)日：2007-11-08

申请号：PCT/US2007/067653

申请日：2007-04-27

Applicant: REACTIVE NANOTECHNOLOGIES, INC. ,  VAN HEERDEN, David, P. ,  RUDE, Timothy, Ryan ,  NEWSON, Jesse, E. ,  HE, Zhaojuan ,  BESNOIN, Etienne ,  VINCENT, Ramzi ,  WEIHS, Timothy, P.

Inventor： VAN HEERDEN, David, P. ,  RUDE, Timothy, Ryan ,  NEWSON, Jesse, E. ,  HE, Zhaojuan ,  BESNOIN, Etienne ,  VINCENT, Ramzi ,  WEIHS, Timothy, P.

IPC: H01L23/48

CPC classification number: H01L24/29 ,  B23K1/0006 ,  H01L24/16 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/16 ,  H01L2224/27013 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/73253 ,  H01L2224/83051 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099

Abstract: The present inventors have observed that in some applications of reactive composite joining there is escape of a portion of the molten joining material through the edges of the joining regions. Such escape is not only a waste of expensive material (e.g. gold or indium) but also a reduction from the optimal thickness of the joining regions. In some applications, such escape also presents risk of short circuits or even fire. In this invention, two approaches are taken toward preventing damage to surroundings by the escape of molten joining material. First, escape may be prevented by trapping or containing the molten material near the joint, using barriers, dams, or similar means. Second, escape may be reduced by adjusting parameters within the joint, such as solder composition, joining pressure, or RCM thickness.

Abstract translation: 本发明人已经观察到，在反应性复合物接合的一些应用中，熔融接合材料的一部分通过接合区域的边缘逸出。 这种逃逸不仅浪费昂贵的材料（例如金或铟），而且还减少了接合区域的最佳厚度。 在某些应用中，这种逃生也存在短路或甚至火灾的风险。 在本发明中，采取两种途径来防止熔融接合材料的逸出对周围环境的损害。 首先，可以通过使用屏障，水坝或类似手段在接头附近捕获或容纳熔融材料来防止逃逸。 其次，通过调节接头内的参数，例如焊料组成，接合压力或RCM厚度，可以减少泄漏。

公开(公告)号：WO2007123530A1

公开(公告)日：2007-11-01

申请号：PCT/US2006/015387

申请日：2006-04-25

Applicant: REACTIVE NANOTECHNOLOGIES, INC ,  DUCKHAM, Alan ,  NEWSON, Jesse, E. ,  BROWN, Michael, V. ,  RUDE, Timothy, Ryan ,  KNIO, Omar, M. ,  HEIAN, Ellen, M. ,  SUBRAMANIAN, Jai, S.

Inventor： DUCKHAM, Alan ,  NEWSON, Jesse, E. ,  BROWN, Michael, V. ,  RUDE, Timothy, Ryan ,  KNIO, Omar, M. ,  HEIAN, Ellen, M. ,  SUBRAMANIAN, Jai, S.

IPC: B23K20/08 ,  B23K31/02

CPC classification number: B23K20/16 ,  B23K20/165 ,  B23K2203/10 ,  B23K2203/12 ,  B23K2203/14 ,  C06B45/14

Abstract: A method for joining component bodies (10A, 10B) of material over bonding regions of large dimensions by disposing a plurality of substantially contiguous sheets (12) of reactive composite materials between the bodies and adjacent sheets of fusible material (14A, 14B). The contiguous sheets (12) of the reactive composite material are operatively connected by an ignitable bridging material (22) so that an igniting reaction in one sheet (12) will cause an igniting reaction in the other. An application of uniform pressure and an ignition of one or more of the contiguous sheets (12) of reactive composite material causes an exothermic thermal reaction to propagate through the bonding region, fusing any adjacent sheets of fusible material (14A, 14B) and forming a bond between the component bodies (10A, 10B).

Abstract translation: 一种用于通过在本体和相邻的可熔材料片（14A，14B）之间设置多个基本上邻接的反应性复合材料片（12），从而在大尺寸的接合区域上接合材料的组分体（10A，10B）的方法。 反应性复合材料的邻接片材（12）通过可点燃的桥接材料（22）可操作地连接，使得一片（12）中的点燃反应将在另一片材中引起点燃反应。 施加均匀的压力和一个或多个邻接的反应性复合材料片（12）的点燃引起放热热反应传播通过接合区域，熔化任何相邻的可熔材料片（14A，14B）并形成 组件主体（10A，10B）之间的连接。

公开(公告)号：WO2007127931A3

公开(公告)日：2008-03-13

申请号：PCT/US2007067653

申请日：2007-04-27

Applicant: REACTIVE NANOTECHNOLOGIES INC ,  VAN HEERDEN DAVID P ,  RUDE TIMOTHY RYAN ,  NEWSON JESSE E ,  HE ZHAOJUAN ,  BESNOIN ETIENNE ,  VINCENT RAMZI ,  WEIHS TIMOTHY P

Inventor： VAN HEERDEN DAVID P ,  RUDE TIMOTHY RYAN ,  NEWSON JESSE E ,  HE ZHAOJUAN ,  BESNOIN ETIENNE ,  VINCENT RAMZI ,  WEIHS TIMOTHY P

IPC: B23K31/00

CPC classification number: H01L24/29 ,  B23K1/0006 ,  H01L24/16 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/16 ,  H01L2224/27013 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/73253 ,  H01L2224/83051 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099

Abstract: The present inventors have observed that in some applications of reactive composite joining there is escape of a portion of the molten joining material through the edges of the joining regions. Such escape is not only a waste of expensive material (e.g. gold or indium) but also a reduction from the optimal thickness of the joining regions. In some applications, such escape also presents risk of short circuits or even fire. In this invention, two approaches are taken toward preventing damage to surroundings by the escape of molten joining material. First, escape may be prevented by trapping or containing the molten material near the joint, using barriers, dams, or similar means. Second, escape may be reduced by adjusting parameters within the joint, such as solder composition, joining pressure, or RCM thickness.

Abstract translation: 本发明人已经观察到，在反应性复合物接合的一些应用中，熔融接合材料的一部分通过接合区域的边缘逸出。 这种逃逸不仅浪费昂贵的材料（例如金或铟），而且还减少了接合区域的最佳厚度。 在某些应用中，这种逃生也存在短路或甚至火灾的风险。 在本发明中，采取两种途径来防止熔融接合材料的逸出对周围环境的损害。 首先，可以通过使用屏障，水坝或类似手段在接头附近捕获或容纳熔融材料来防止逃逸。 其次，通过调节接头内的参数，例如焊料组成，接合压力或RCM厚度，可以减少泄漏。

公开(公告)号：WO2009029804A3

公开(公告)日：2009-04-30

申请号：PCT/US2008074809

申请日：2008-08-29

Applicant: REACTIVE NANOTECHNOLOGIES INC ,  VAN HEERDEN DAVID ,  RUDE TIMOTHY RYAN ,  VINCENT RAMZI

Inventor： VAN HEERDEN DAVID ,  RUDE TIMOTHY RYAN ,  VINCENT RAMZI

IPC: H05K1/18

CPC classification number: H01L24/83 ,  H01L24/33 ,  H01L31/02002 ,  H01L33/62 ,  H01L2224/33104 ,  H01L2224/335 ,  H01L2224/80359 ,  H01L2224/83024 ,  H01L2224/83095 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83232 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K1/0203 ,  H05K1/056 ,  H05K3/341 ,  H05K3/3421 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2201/10106 ,  H05K2201/10689 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10969 ,  H05K2203/0278 ,  H05K2203/0405 ,  H05K2203/1163 ,  Y02P70/613 ,  Y10S362/80 ,  H01L2924/00

Abstract: A method for bonding an LED assembly (71) or other electronic package (31) to a substrate PCB containing a heat-sink (52), which utilizes layers of reactive multilayer foil (51) disposed between contacts (32, 34) of the electronic package 31 and the associated contact pads (55) on the supporting substrate PCB. By initiating an exothermic reaction in the reactive multilayer foil (51), together with an application of pressure, sufficient heat is generated between the contacts (32, 34) and the associated contact pads (55) to melt adjacent bonding material (54) to obtain good electrically and thermally conductive bonds between the contacts 32, 34 and contact pads (55) without thermally damaging the electronic package (31), heat-sensitive components (35) associated with the electronic package (31), or other the supporting substrate PCB.

Abstract translation: 一种用于将LED组件（71）或其他电子封装（31）结合到包含散热器（52）的基板PCB的方法，所述散热器利用设置在所述散热器（52）的触点（32,34）之间的反应性多层箔 电子封装31和支撑衬底PCB上的相关接触垫（55）。 通过在反应性多层箔（51）中引发放热反应并施加压力，在接触部（32,34）和相关联的接触垫（55）之间产生足够的热量以将相邻的接合材料（54）熔化成 （31），与电子封装（31）相关的热敏组件（35）或其它支撑衬底（31）上获得良好的导电性和导热性的接触32,34和接触垫（55） PCB。

公开(公告)号：WO2009029804A2

公开(公告)日：2009-03-05

申请号：PCT/US2008/074809

申请日：2008-08-29

Applicant: REACTIVE NANOTECHNOLOGIES, INC. ,  VAN HEERDEN, David ,  RUDE, Timothy, Ryan ,  VINCENT, Ramzi

Inventor： VAN HEERDEN, David ,  RUDE, Timothy, Ryan ,  VINCENT, Ramzi

IPC: H05K1/18

CPC classification number: H01L24/83 ,  H01L24/33 ,  H01L31/02002 ,  H01L33/62 ,  H01L2224/33104 ,  H01L2224/335 ,  H01L2224/80359 ,  H01L2224/83024 ,  H01L2224/83095 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83232 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K1/0203 ,  H05K1/056 ,  H05K3/341 ,  H05K3/3421 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2201/10106 ,  H05K2201/10689 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10969 ,  H05K2203/0278 ,  H05K2203/0405 ,  H05K2203/1163 ,  Y02P70/613 ,  Y10S362/80 ,  H01L2924/00

Abstract: A method for bonding an LED assembly (71) or other electronic package (31) to a substrate PCB containing a heat-sink (52), which utilizes layers of reactive multilayer foil (51) disposed between contacts (32, 34) of the electronic package 31 and the associated contact pads (55) on the supporting substrate PCB. By initiating an exothermic reaction in the reactive multilayer foil (51), together with an application of pressure, sufficient heat is generated between the contacts (32, 34) and the associated contact pads (55) to melt adjacent bonding material (54) to obtain good electrically and thermally conductive bonds between the contacts 32, 34 and contact pads (55) without thermally damaging the electronic package (31), heat-sensitive components (35) associated with the electronic package (31), or other the supporting substrate PCB.

Abstract translation: 一种用于将LED组件（71）或其它电子封装（31）接合到包含散热器（52）的基板PCB的方法，所述基板PCB利用设置在所述散热器（52）的触点（32,34）之间的反应性多层箔（51） 电子封装31和支撑基板PCB上的相关接触焊盘（55）。 通过在反应性多层箔（51）中引发放热反应以及施加压力，在触头（32,34）和相关联的接触垫（55）之间产生足够的热量以将相邻的接合材料（54）熔化成 在电子封装（31），与电子封装（31）相关联的热敏元件（35）或其他支撑衬底（31）之间，在触头32,34和接触焊盘（55）之间获得良好的导电和导热接合， PCB。

公开(公告)号：WO2008130335A2

公开(公告)日：2008-10-30

申请号：PCT/US2006/023160

申请日：2006-06-15

Applicant: REACTIVE NANOTECHNOLOGIES, INC. ,  WEIHS, Timothy, P. ,  BESNOIN, Etienne ,  VINCENT, Ramzi ,  VALLIAPPAN, Somasundaram ,  HEIAN, Ellen ,  VAN HEERDEN, David ,  RUDE, Timothy, Ryan ,  KNIO, Omar ,  SPRAKER, Ronald ,  LIN, Yuping

Inventor： WEIHS, Timothy, P. ,  BESNOIN, Etienne ,  VINCENT, Ramzi ,  VALLIAPPAN, Somasundaram ,  HEIAN, Ellen ,  VAN HEERDEN, David ,  RUDE, Timothy, Ryan ,  KNIO, Omar ,  SPRAKER, Ronald ,  LIN, Yuping

IPC: B32B3/00

CPC classification number: C22C30/00 ,  C06B21/00 ,  C06B45/12 ,  C22C5/04 ,  C22C19/00 ,  F42B3/18 ,  F42B39/14 ,  Y10T29/30 ,  Y10T29/302 ,  Y10T29/49002 ,  Y10T29/49227 ,  Y10T428/12493 ,  Y10T428/12632

Abstract: Applicants have discovered that electrostatic discharge (ESD) may, in some circumstances, result in current densities sufficient to ignite unprotected reactive composite materials. They have further discovered that a reactive composite material (RCM) can be protected from ESD ignition without adversely affecting the desirable properties of the RCM by the application of conducting and/or insulating materials at appropriate locations on the RCM. Thus ESD-protected RCM structures can be designed for such sensitive applications as ignition of propellants, generation of light bursts, and structural materials for equipment that may require controlled self-destruction.

Abstract translation: 申请人已经发现，在某些情况下，静电放电（ESD）可以导致足够的电流密度来点燃未受保护的反应性复合材料。 他们进一步发现，通过在RCM的适当位置施加导电和/或绝缘材料，可以保护反应性复合材料（RCM）免于ESD点火，而不会对RCM的期望性能产生不利影响。 因此，ESD保护的RCM结构可以设计用于诸如点燃推进剂，产生光爆炸以及可能需要受控自我破坏的设备的结构材料等敏感应用。