公开(公告)号：WO2009002852A3

公开(公告)日：2008-12-31

申请号：PCT/US2008/067695

申请日：2008-06-20

Applicant: REACTIVE NANOTECHNOLOGIES, INC. ,  WEIHS, Timothy, P. ,  DUCKHAM, Alan ,  NEWSON, Jesse, E. ,  LUNKING, David

Inventor： WEIHS, Timothy, P. ,  DUCKHAM, Alan ,  NEWSON, Jesse, E. ,  LUNKING, David

IPC: B23K20/08 ,  B23K20/12 ,  B32B15/00

Abstract: A method for bonding components with a reactive multilayer foil, wherein during bonding, the components are held at a temperature or temperature gradient chosen to reduce thermal stress in the resulting bonded product.

Abstract translation: 一种用于将组件与反应性多层箔粘合的方法，其中在粘合期间，所述组件保持在选定的温度或温度梯度下以降低所得粘合产品中的热应力。

公开(公告)号：WO2009002852A2

公开(公告)日：2008-12-31

申请号：PCT/US2008067695

申请日：2008-06-20

Applicant: REACTIVE NANOTECHNOLOGIES INC ,  WEIHS TIMOTHY P ,  DUCKHAM ALAN ,  NEWSON JESSE E ,  LUNKING DAVID

Inventor： WEIHS TIMOTHY P ,  DUCKHAM ALAN ,  NEWSON JESSE E ,  LUNKING DAVID

IPC: B23K20/08 ,  B23K20/12 ,  B32B15/00

CPC classification number: C23C14/3407 ,  Y10T428/12493

Abstract: A method for bonding components with a reactive multilayer foil, wherein during bonding, the components are held at a temperature or temperature gradient chosen to reduce thermal stress in the resulting bonded product.

Abstract translation: 用于将组分与反应性多层箔结合的方法，其中在粘合期间，将组分保持在选择的温度或温度梯度以降低所得结合产物中的热应力。

公开(公告)号：WO2008097212A2

公开(公告)日：2008-08-14

申请号：PCT/US2006/024438

申请日：2006-06-22

Applicant: REACTIVE NANOTECHNOLOGIES, INC. ,  WEIHS, Timothy, P. ,  LUNKING, David, M. ,  HEIAN, Ellen, M. ,  XUN, Yuwei ,  BOWMAN, Richard ,  CATIG, Gary ,  VAN HEERDEN, David ,  VALLIAPAN, Somasundaram ,  KNIO, Omar ,  GRZYB, Joseph

Inventor： WEIHS, Timothy, P. ,  LUNKING, David, M. ,  HEIAN, Ellen, M. ,  XUN, Yuwei ,  BOWMAN, Richard ,  CATIG, Gary ,  VAN HEERDEN, David ,  VALLIAPAN, Somasundaram ,  KNIO, Omar ,  GRZYB, Joseph

IPC: B32B3/00

CPC classification number: C06C15/00 ,  F41J2/02 ,  F42B4/26 ,  F42B12/42

Abstract: A reactive composite structure (RCS) having selected energetic and mechanical properties, and methods of making reactive composite structures (RCSs) enabling the construction of complex parts and components by machining and forming of reactive composite materials (RCMs) without compromising the energetic or mechanical properties of the resulting reactive composite structure (RCS).

Abstract translation: 具有选择的能量和机械性能的反应性复合结构（RCS）以及制造反应性复合结构（RCS）的方法，其能够通过机械加工和形成反应性复合材料（RCM）来构建复杂部件和部件，而不损害能量或机械性能 的所得反应性复合结构（RCS）。

公开(公告)号：WO2007127931A3

公开(公告)日：2008-03-13

申请号：PCT/US2007067653

申请日：2007-04-27

Applicant: REACTIVE NANOTECHNOLOGIES INC ,  VAN HEERDEN DAVID P ,  RUDE TIMOTHY RYAN ,  NEWSON JESSE E ,  HE ZHAOJUAN ,  BESNOIN ETIENNE ,  VINCENT RAMZI ,  WEIHS TIMOTHY P

Inventor： VAN HEERDEN DAVID P ,  RUDE TIMOTHY RYAN ,  NEWSON JESSE E ,  HE ZHAOJUAN ,  BESNOIN ETIENNE ,  VINCENT RAMZI ,  WEIHS TIMOTHY P

IPC: B23K31/00

CPC classification number: H01L24/29 ,  B23K1/0006 ,  H01L24/16 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/16 ,  H01L2224/27013 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/73253 ,  H01L2224/83051 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099

Abstract: The present inventors have observed that in some applications of reactive composite joining there is escape of a portion of the molten joining material through the edges of the joining regions. Such escape is not only a waste of expensive material (e.g. gold or indium) but also a reduction from the optimal thickness of the joining regions. In some applications, such escape also presents risk of short circuits or even fire. In this invention, two approaches are taken toward preventing damage to surroundings by the escape of molten joining material. First, escape may be prevented by trapping or containing the molten material near the joint, using barriers, dams, or similar means. Second, escape may be reduced by adjusting parameters within the joint, such as solder composition, joining pressure, or RCM thickness.

Abstract translation: 本发明人已经观察到，在反应性复合物接合的一些应用中，熔融接合材料的一部分通过接合区域的边缘逸出。 这种逃逸不仅浪费昂贵的材料（例如金或铟），而且还减少了接合区域的最佳厚度。 在某些应用中，这种逃生也存在短路或甚至火灾的风险。 在本发明中，采取两种途径来防止熔融接合材料的逸出对周围环境的损害。 首先，可以通过使用屏障，水坝或类似手段在接头附近捕获或容纳熔融材料来防止逃逸。 其次，通过调节接头内的参数，例如焊料组成，接合压力或RCM厚度，可以减少泄漏。

公开(公告)号：WO2005005092A3

公开(公告)日：2005-05-06

申请号：PCT/US2004014775

申请日：2004-05-12

Applicant: REACTIVE NANOTECHNOLOGIES INC ,  JOHNS KOPKINS UNIVERSITY ,  BESNOIN ETIENNE ,  WANG JIAPING ,  DUCKHAM ALAN ,  SPEY STEPHEN JOHN JR ,  VAN HEERDEN DAVID PETER ,  WEIHS TIMOTHY P ,  KNIO OMAR M

Inventor： BESNOIN ETIENNE ,  WANG JIAPING ,  DUCKHAM ALAN ,  SPEY STEPHEN JOHN JR ,  VAN HEERDEN DAVID PETER ,  WEIHS TIMOTHY P ,  KNIO OMAR M

IPC: B23K1/00 ,  B23K1/19 ,  B23K31/02 ,  B23K31/12 ,  B23K35/00 ,  B23K35/02 ,  B23K35/34 ,  C06B45/14 ,  G05B17/02

CPC classification number: B23K1/0016 ,  B23K31/02 ,  B23K31/12 ,  B23K35/001 ,  B23K35/0238 ,  B23K35/34 ,  B23K2201/40 ,  B23K2203/05 ,  B23K2203/10 ,  C06B45/14 ,  G05B17/02 ,  Y10T428/12493 ,  Y10T428/12535

Abstract: An embodiment of the invention includes a method of simulating a behavior of an energy distribution within a soldered or brazed assembly to predict various physical parameters of the assembly. The assembly typically includes a reactive multilayer material. The method comprises the steps of providing an energy evolution equation having an energy source term associated with a self-propagating reaction that originates within the reactive multilayer material. The method also includes the steps of discretizing the energy evolution equation, and determining the behavior of the energy distribution in the assembly by integrating the discretized energy evolution equation using other parameters associated with the assembly.

Abstract translation: 本发明的实施例包括模拟焊接或钎焊组件内的能量分布的行为以预测组件的各种物理参数的方法。 该组件通常包括反应性多层材料。 该方法包括以下步骤：提供具有与源自反应性多层材料内的自蔓延反应相关的能源项的能量发展方程。 该方法还包括以下步骤：离散能量演变方程，以及通过使用与组件相关的其他参数对离散能量演化方程进行积分来确定组件中能量分布的行为。

公开(公告)号：WO2009149153A2

公开(公告)日：2009-12-10

申请号：PCT/US2009/046085

申请日：2009-06-03

Applicant: REACTIVE NANOTECHNOLOGIES, INC. ,  BAUM, Michael ,  MINGE, Daniel, L. ,  CURRAN, Maureen, A. ,  HANNAFIN, John ,  WEIHS, Timothy, P. ,  VINCENT, Ramzi

Inventor： BAUM, Michael ,  MINGE, Daniel, L. ,  CURRAN, Maureen, A. ,  HANNAFIN, John ,  WEIHS, Timothy, P. ,  VINCENT, Ramzi

IPC: H05K1/09

CPC classification number: H05K1/111 ,  H05K3/341 ,  H05K3/3494 ,  H05K2201/09663 ,  H05K2201/09781 ,  H05K2201/10106 ,  H05K2201/10969 ,  H05K2203/0195 ,  H05K2203/0405 ,  H05K2203/1115 ,  H05K2203/1163 ,  Y02P70/611 ,  Y02P70/613

Abstract: An ignition trace pattern (10) on a printed circuit board (19) for conveying an initiating electrical current to a reactive multilayer foil preform (14) in a bonding region. The ignition trace (10) includes an ignition pad (11) disposed on the printed circuit board (19) adjacent to, but electrically isolated from, a bond pad (12) in the bonding region on the printed circuit board (19), a remote pad (13) disposed outside the bonding region on the printed circuit board (19) to which an electrode (16) may be electrically connected for delivering an initiating electrical current, and a trace (18) connecting the remote pad (13) and the ignition pad (11). The trace (18) is configured to conduct an initiating electrical current from the remote pad (13) to the ignition pad (11) and into any adjacent reactive multilayer foil performs (14) in electrical contact with the ignition pad (11) in the bonding region.

Abstract translation: 印刷电路板（19）上的点火迹线图案（10），用于将起始电流传送到接合区域中的反应性多层箔预制件（14）。 点火迹线（10）包括位于印刷电路板（19）上的点火垫（11），其与印刷电路板（19）上的接合区域中的接合焊盘（12）相邻但电隔离， 远程焊盘（13），布置在印刷电路板（19）上的接合区域的外部，电极（16）可以电连接到电极（16）以传递启动电流;以及轨迹（18），其将远程焊盘（13）和 点火垫（11）。 轨迹（18）被配置为将起动电流从远程焊盘（13）传导到点火垫（11）并进入任何相邻的反应性多层箔（14），其与所述点火垫（11）电接触 接合区域。

公开(公告)号：WO2009003130A2

公开(公告)日：2008-12-31

申请号：PCT/US2008068410

申请日：2008-06-26

Applicant: REACTIVE NANOTECHNOLOGIES INC ,  XUN YUWEI ,  HEERDEN DAVID VAN ,  CURRAN MAUREEN A ,  WEIHS TIMOTHY P

Inventor： XUN YUWEI ,  HEERDEN DAVID VAN ,  CURRAN MAUREEN A ,  WEIHS TIMOTHY P

IPC: B23K20/08 ,  B23K20/12 ,  B32B15/00

CPC classification number: B23K20/16 ,  B23K2203/10 ,  Y10T428/31678

Abstract: In accordance with the invention, containers or interfaces having two surfaces 201a and 201b to be joined, and a region to be sealed, are fused by providing between the surfaces 201a and 201b a thin strip or wire of RCM 102 embedded within a fusible material 101, applying pressure 205 and igniting the RCM 102. The released energy from the ignited RCM 102 results in a melting of the fusible material 101 and subsequent bonding of the fusible material 101 upon cooling to the surrounding surfaces 201a and 201b, achieving a hermetic seal there between without the use of a separate gasket component.

Abstract translation: 根据本发明，具有要接合的两个表面201a和201b以及待密封区域的容器或界面通过在表面201a和201b之间提供嵌入可熔材料101内的RCM 102的薄条或金属线来熔合 施加压力205并点燃RCM 102.来自被点燃的RCM 102的释放的能量导致熔化材料101的熔化，并且随后在冷却时熔融材料101随后与周围表面201a和201b接合，从而在那里实现气密密封 之间而不使用单独的垫片组件。

公开(公告)号：WO2005005092A2

公开(公告)日：2005-01-20

申请号：PCT/US2004/014775

申请日：2004-05-12

Applicant: REACTIVE NANOTECHNOLOGIES, INC. ,  JOHNS KOPKINS UNIVERSITY ,  BESNOIN, Etienne ,  WANG, Jiaping ,  DUCKHAM, Alan ,  SPEY, Stephen, John, Jr. ,  VAN HEERDEN, David, Peter ,  WEIHS, Timothy, P. ,  KNIO, Omar, M.

Inventor： BESNOIN, Etienne ,  WANG, Jiaping ,  DUCKHAM, Alan ,  SPEY, Stephen, John, Jr. ,  VAN HEERDEN, David, Peter ,  WEIHS, Timothy, P. ,  KNIO, Omar, M.

IPC: B23K35/00

CPC classification number: B23K1/0016 ,  B23K31/02 ,  B23K31/12 ,  B23K35/001 ,  B23K35/0238 ,  B23K35/34 ,  B23K2201/40 ,  B23K2203/05 ,  B23K2203/10 ,  C06B45/14 ,  G05B17/02 ,  Y10T428/12493 ,  Y10T428/12535

Abstract: An embodiment of the invention includes a method of simulating a behavior of an energy distribution within a soldered or brazed assembly to predict various physical parameters of the assembly. The assembly typically includes a reactive multilayer material. The method comprises the steps of providing an energy evolution equation having an energy source term associated with a self-propagating reaction that originates within the reactive multilayer material. The method also includes the steps of discretizing the energy evolution equation, and determining the behavior of the energy distribution in the assembly by integrating the discretized energy evolution equation using other parameters associated with the assembly.

Abstract translation: 本发明的实施例包括模拟焊接或钎焊组件内的能量分布的行为以预测组件的各种物理参数的方法。 组件通常包括反应性多层材料。 该方法包括以下步骤：提供能量演化方程，其具有与源自反应性多层材料的自蔓延反应相关联的能量源项。 该方法还包括离散化能量演化方程的步骤，以及通过使用与组件相关联的其它参数来整合离散化能量演化方程来确定组件中能量分布的行为。

公开(公告)号：WO2008079461A3

公开(公告)日：2008-10-09

申请号：PCT/US2007077723

申请日：2007-09-06

Applicant: REACTIVE NANOTECHNOLOGIES INC ,  DUCKHAM ALAN ,  WEIHS TIMOTHY P ,  NEWSON JESSE ,  LEVIN JONATHAN ,  VALLIAPPAN SOMASUNDARAM

Inventor： DUCKHAM ALAN ,  WEIHS TIMOTHY P ,  NEWSON JESSE ,  LEVIN JONATHAN ,  VALLIAPPAN SOMASUNDARAM

IPC: B32B15/00

CPC classification number: B23K1/0006 ,  B23K1/19 ,  B23K20/165 ,  B23K2203/16 ,  B23K2203/172 ,  C23C14/3414 ,  C23C24/04 ,  C23C28/321 ,  C23C28/345 ,  H05K3/3463 ,  H05K3/3494 ,  H05K2203/0405 ,  H05K2203/1163 ,  Y10T428/12493

Abstract: A process and apparatus for the reactive multilayer joining of components utilizing metallization techniques to bond difficult-to-wet materials and temperature sensitive materials to produce joined products.

Abstract translation: 一种利用金属化技术对部件进行反应性多层连接以将难以湿润的材料和温度敏感材料粘合以产生连接产品的方法和装置。

公开(公告)号：WO2008079461A2

公开(公告)日：2008-07-03

申请号：PCT/US2007/077723

申请日：2007-09-06

Applicant: REACTIVE NANOTECHNOLOGIES, INC. ,  DUCKHAM, Alan ,  WEIHS, Timothy, P. ,  NEWSON, Jesse ,  LEVIN, Jonathan ,  VALLIAPPAN, Somasundaram

Inventor： DUCKHAM, Alan ,  WEIHS, Timothy, P. ,  NEWSON, Jesse ,  LEVIN, Jonathan ,  VALLIAPPAN, Somasundaram

IPC: B23K1/20 ,  B23K31/02 ,  B32B15/00 ,  C23C14/00

CPC classification number: B23K1/0006 ,  B23K1/19 ,  B23K20/165 ,  B23K2203/16 ,  B23K2203/172 ,  C23C14/3414 ,  C23C24/04 ,  C23C28/321 ,  C23C28/345 ,  H05K3/3463 ,  H05K3/3494 ,  H05K2203/0405 ,  H05K2203/1163 ,  Y10T428/12493

Abstract: A process and apparatus for the reactive multilayer joining of components utilizing metallization techniques to bond difficult-to-wet materials and temperature sensitive materials to produce joined products.

Abstract translation: 用于使用金属化技术的部件的反应性多层接合方法和装置，以将难以湿的材料和温度敏感的材料粘合以产生连接的产品。