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    MULTILAYERED COATINGS FOR USE ON ELECTRONIC DEVICES OR OTHER ARTICLES
    2.
    发明申请
    MULTILAYERED COATINGS FOR USE ON ELECTRONIC DEVICES OR OTHER ARTICLES 审中-公开
    用于电子设备或其他文章的多层涂料

    公开(公告)号：WO2008063266A1

    公开(公告)日：2008-05-29

    申请号：PCT/US2007/020412

    申请日：2007-09-19

    Applicant: THE TRUSTEES OF PRINCETON UNIVERSITY ,  WAGNER, Sigurd

    Inventor： WAGNER, Sigurd

    IPC: C23C16/02 ,  C23C16/24 ,  C23C16/40 ,  C23C30/00 ,  H01L31/0224 ,  H01L51/52

    CPC classification number: C23C16/45523 ,  B05D1/62 ,  B05D7/52 ,  C23C16/401 ,  H01L51/5256

    Abstract: A method for forming a multilayered coating over a surface is disclosed. The method comprises providing a single source of precursor material and transporting the precursor material to a reaction location adjacent a surface to be coated. A first layer is deposited over the surface by chemical vapor deposition using the single source of precursor material, under a first set of reaction conditions. A second layer is deposited over the surface by chemical vapor deposition using the single source of precursor material, under a second set of reaction conditions. The first layer may have a predominantly polymeric component and the second layer may have a predominantly non-polymeric component. The chemical vapor deposition process may be plasma-enhanced and may be performed using a reactant gas. The precursor material may be an organo-silicon compound, such as a siloxane. The first and second layers may comprise various types of polymeric materials, such as silicone polymers, and various types of non-polymeric materials, such as silicon oxides. The multilayered coating may have various characteristics suitable for use with organic light-emitting devices, such as optical transparency, impermeability, and/or flexibility.

    Abstract translation: 公开了一种在表面上形成多层涂层的方法。 该方法包括提供单一前体材料源并将前体材料输送到邻近待涂覆表面的反应位置。 在第一组反应条件下，通过化学气相沉积使用单一前体材料源在第一层上沉积第一层。 在第二组反应条件下，通过化学气相沉积使用单一前体材料源沉积第二层。 第一层可以具有主要的聚合物组分，第二层可以具有主要是非聚合物组分。 化学气相沉积工艺可以是等离子体增强的，并且可以使用反应气体进行。 前体材料可以是有机硅化合物，例如硅氧烷。 第一层和第二层可以包括各种类型的聚合材料，例如硅氧烷聚合物，以及各种类型的非聚合材料，例如氧化硅。 多层涂层可以具有适合于与有机发光装置一起使用的各种特性，例如光学透明性，不渗透性和/或柔性。

    A MONITORED OPTICAL COMPONENT AND METHOD OF MAKING
    3.
    发明申请
    A MONITORED OPTICAL COMPONENT AND METHOD OF MAKING 审中-公开
    监测光学元件及其制作方法

    公开(公告)号：WO0173903A9

    公开(公告)日：2003-09-04

    申请号：PCT/US0109014

    申请日：2001-03-20

    Applicant: AEGIS SEMICONDUCTOR ,  WAGNER SIGURD ,  MA EUGENE Y ,  PAYNE ADAM M

    Inventor： WAGNER SIGURD ,  MA EUGENE Y ,  PAYNE ADAM M

    IPC: H01S5/02 ,  H01S5/022 ,  H01S5/026 ,  H01S5/183 ,  H01S5/42 ,  H01S5/0683 ,  H01L31/02

    CPC classification number: H01S5/02284 ,  H01S5/02272 ,  H01S5/0264 ,  H01S5/0422 ,  H01S5/183 ,  H01S5/423 ,  H01S2301/176

    Abstract: Materials suitable for fabricating optical monitors include amorphous, polycrystalline and microcrystalline materials. Semitransparent photodetector materials may be based on silicon or silicon and germanium alloys. Conductors for connecting to and contacting the photodetector may be made from various transparent oxides, including zinc oxide, tin oxide and indium tin oxide. Optical monitor structures based on PIN diodes take advantage of the materials disclosed. Various contact, lineout, substrate and interconnect structures optimize the monitors for integration with various light sources, including vertical cavity surface emitting laser (VCSEL) arrays. Complete integrated structures include a light source, optical monitor and either a package or waveguide into which light is directed.

    Abstract translation: 适用于制造光学显示器的材料包括无定形，多晶和微晶材料。 半透射光电探测器材料可以基于硅或硅和锗合金。 用于连接和接触光电检测器的导体可以由各种透明氧化物制成，包括氧化锌，氧化锡和氧化铟锡。 基于PIN二极管的光学监视器结构利用所公开的材料。 各种接触，线路，基板和互连结构优化了监视器，以与各种光源（包括垂直腔表面发射激光器（VCSEL）阵列）集成。 完整的集成结构包括光源，光学监视器以及光引导的封装或波导。

    FERROUS COMPONENT
    4.
    发明申请
    FERROUS COMPONENT 审中-公开
    FERROISCHES COMPONENT

    公开(公告)号：WO2007085035A3

    公开(公告)日：2007-12-13

    申请号：PCT/AT2007000032

    申请日：2007-01-25

    Applicant: UNIV LINZ ,  BAUER SIEGFRIED ,  GRAZ INGRID ,  SCHWOEDIAUER REINHARD ,  KEPLINGER CHRISTOPH ,  KALTENBRUNNER MARTIN ,  PERICHON LACOUR STEPHANIE ,  WAGNER SIGURD

    Inventor： BAUER SIEGFRIED ,  GRAZ INGRID ,  SCHWOEDIAUER REINHARD ,  KEPLINGER CHRISTOPH ,  KALTENBRUNNER MARTIN ,  PERICHON LACOUR STEPHANIE ,  WAGNER SIGURD

    IPC: H01L25/16

    CPC classification number: H01L25/16 ,  G01L1/005 ,  H01L27/20 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Disclosed is a ferrous component comprising a ferrous layer (10) that is disposed between two electrodes (12, 13), a thin-film field-effect transistor (4) whose gate electrode (3) forms one of the two electrodes (12, 13) of the ferrous layer (10) which is joined to the gate electrode (3) via an intermediate layer (11) acting as an adhesive, and a substrate that is used as a support. In order to obtain a flexible component, the thin-film field-effect transistor (4) and the ferrous layer (10), which is composed of an internally loaded cellular polymer, are applied to the substrate that is embodied as a flexible plastic film (1) while an insulating layer (2) is optionally placed therebetween.

    Abstract translation: 它是具有两个电极之间的ferroisches部件（12，13）布置成铁性层（10），具有一个薄膜场效应晶体管（4），其栅极电极（3）的两个电极中的一个（12，13）的铁性层（10 ）形式中，11）连接作为偶联剂（具有经由中间层与栅电极（3），并用一个作为支承基板进行说明。 为了获得弯曲软质成分，因此建议在作为弯曲软塑料薄膜（1）形成在所述基板上，任选地与绝缘层（2）上的薄膜场效应晶体管的一侧上的插置（4）和，另一方面，它由一个内部带电多孔聚合物铁性层（10） 绘制。

    A SEMITRANSPARENT OPTICAL DETECTOR INCLUDING A SILICON AND GERMANIUM ALLOY AND METHOD OF MAKING
    5.
    发明申请
    A SEMITRANSPARENT OPTICAL DETECTOR INCLUDING A SILICON AND GERMANIUM ALLOY AND METHOD OF MAKING 审中-公开
    包括硅和锗合金的半透明光学检测器及其制造方法

    公开(公告)号：WO0173850A3

    公开(公告)日：2002-05-16

    申请号：PCT/US0109170

    申请日：2001-03-20

    Applicant: AEGIS SEMICONDUCTOR ,  WAGNER SIGURD ,  PAYNE ADAM M

    Inventor： WAGNER SIGURD ,  PAYNE ADAM M

    IPC: H01L31/0376 ,  H01L31/101 ,  H01L31/105 ,  H01L31/18

    CPC classification number: H01L31/1016 ,  H01L31/03765 ,  H01L31/1055 ,  H01L31/1804 ,  Y02E10/547 ,  Y02E10/548 ,  Y02P70/521

    Abstract: Materials suitable for fabricating optical monitors include amorphous, polycrystalline and microcrystalline materials. Semitransparent photodetector materials may be based on silicon or silicon and germanium alloys. Conductors for connecting to and contacting the photodetector may be made from various transparent oxides, including zinc oxide, tin oxide and indium tin oxide. Optical monitor structures based on PIN diodes take advantage of the materials disclosed. Various contact, lineout, substrate and interconnect structures optimize the monitors for integration with various light sources, including vertical cavity surface emitting laser (VCSEL) arrays. Complete integrated structures include a light source, optical monitor and either a package or waveguide into which light is directed.

    Abstract translation: 适用于制造光学显示器的材料包括无定形，多晶和微晶材料。 半透射光电探测器材料可以基于硅或硅和锗合金。 用于连接和接触光电检测器的导体可以由各种透明氧化物制成，包括氧化锌，氧化锡和氧化铟锡。 基于PIN二极管的光学监视器结构利用所公开的材料。 各种接触，线路，衬底和互连结构优化了监视器，以与各种光源（包括垂直腔表面发射激光器（VCSEL）阵列）集成。 完整的集成结构包括光源，光学监视器以及光引导的封装或波导。

    A MONITORED OPTICAL COMPONENT AND METHOD OF MAKING
    6.
    发明申请
    A MONITORED OPTICAL COMPONENT AND METHOD OF MAKING 审中-公开

    公开(公告)号：WO2001073903A3

    公开(公告)日：2001-10-04

    申请号：PCT/US2001/009014

    申请日：2001-03-20

    Applicant: AEGIS SEMICONDUCTOR ,  WAGNER, Sigurd ,  MA, Eugene, Y. ,  PAYNE, Adam, M.

    Inventor： WAGNER, Sigurd ,  MA, Eugene, Y. ,  PAYNE, Adam, M.

    IPC: H01S5/0683

    Abstract: Materials suitable for fabricating optical monitors include amorphous, polycrystalline and microcrystalline materials. Semitransparent photodetector materials may be based on silicon or silicon and germanium alloys. Conductors for connecting to and contacting the photodetector may be made from various transparent oxides, including zinc oxide, tin oxide and indium tin oxide. Optical monitor structures based on PIN diodes take advantage of the materials disclosed. Various contact, lineout, substrate and interconnect structures optimize the monitors for integration with various light sources, including vertical cavity surface emitting laser (VCSEL) arrays. Complete integrated structures include a light source, optical monitor and either a package or waveguide into which light is directed.

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