Abstract:
Embodiments of the present disclosure generally relate to methods for forming a TFT having a metal oxide layer. The method may include forming a metal oxide layer and treating the metal oxide layer with a fluorine containing gas or plasma. The fluorine treatment of the metal oxide layer helps fill the oxygen vacancies in the metal oxide channel layer, leading to a more stable TFT and preventing a negative threshold voltage in the TFT.
Abstract:
A method for inspecting a substrate is described. The method includes providing the substrate being a large area substrate in a vacuum chamber, wherein the substrate has a thin-film with a grain structure deposited on the substrate; generating a primary charged particle beam with an imaging charged particle beam microscope, wherein the primary charged particle beam impinges on the substrate in the vacuum chamber; and generating one or more images from signal particles released from the substrate upon impingement of the primary charged particle beam, wherein the one or more images are topographic images.
Abstract:
Methods for forming flat panel displays, and more particularly, methods for forming high pixel density flat panel displays are provided. A method of etching can include depositing a copper layer on a substrate, depositing a hard mask on the copper layer, patterning the hard mask to expose a first portion of the copper layer, and removing the exposed portion of the copper to form an interconnect. The removing the exposed portion of the copper includes dry etching the exposed portion of the copper and exposing the exposed portion of the copper to UV radiation.
Abstract:
Embodiments of the disclosure generally provide methods of forming a capacitor with high capacitance and low leakage as well as a good interface control for thin film transistor (TFT) applications. In one embodiment, a thin film transistor structure includes a capacitor formed in a thin film transistor device. The capacitor further includes a common electrode disposed on a substrate, a dielectric layer formed on the common electrode and a pixel electrode formed on the dielectric layer. An interface protection layer formed between the common electrode and the dielectric layer, or between the dielectric layer and the pixel electrode. A gate insulating layer fabricated by a high-k material may also be utilized in the thin film transistor structure.
Abstract:
Embodiments of the present disclosure generally relate to methods and devices for use of low temperature polysilicon (LTPS) thin film transistors in liquid crystal display (LCD) and organic light-emitting diode (OLED) displays.