PLASMA ETCHING FOR COPPER PATTERNING
    3.
    发明申请

    公开(公告)号:WO2018236651A1

    公开(公告)日:2018-12-27

    申请号:PCT/US2018/037396

    申请日:2018-06-13

    Abstract: Methods for forming flat panel displays, and more particularly, methods for forming high pixel density flat panel displays are provided. A method of etching can include depositing a copper layer on a substrate, depositing a hard mask on the copper layer, patterning the hard mask to expose a first portion of the copper layer, and removing the exposed portion of the copper to form an interconnect. The removing the exposed portion of the copper includes dry etching the exposed portion of the copper and exposing the exposed portion of the copper to UV radiation.

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