公开(公告)号：WO2014137287A1

公开(公告)日：2014-09-12

申请号：PCT/SG2014/000065

申请日：2014-02-19

Applicant: HERAEUS MATERIALS SINGAPORE PTE. LTD.

Inventor： CHEW, Yeong, Huey ,  SARANGAPANI, Murali ,  MILKE, Eugen

IPC: H01L23/49 ,  C22C9/00 ,  H01L21/60

CPC classification number: C22C9/00 ,  B23K35/0261 ,  B23K35/0266 ,  B23K35/302 ,  B23K35/322 ,  B32B15/018 ,  C22C1/02 ,  H01L24/05 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/4312 ,  H01L2224/4321 ,  H01L2224/4382 ,  H01L2224/43848 ,  H01L2224/43985 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45664 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/85099 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/01203 ,  H01L2924/01201 ,  H01L2924/2075 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20109 ,  H01L2924/00015 ,  H01L2924/20303 ,  H01L2924/20304 ,  H01L2924/20305 ,  H01L2924/01204 ,  H01L2924/01202 ,  H01L2924/00 ,  H01L2924/2011 ,  H01L2924/00012 ,  H01L2924/01005 ,  H01L2924/01033

Abstract: The invention is related to a bonding wire, comprising a core (2) with a surface, wherein the core (2) comprises copper as a main component, and a coating layer (3) superimposed over the surface of the core (2), wherein the coating layer (3) comprises palladium as a main component, wherein the core (2) comprises silver and phosphorus as further components, wherein the core comprises silver and phosphorus as further components, wherein the ratio between the silver content and the phosphorus content of the core is in the range of 0.03 to 2.

Abstract translation: 本发明涉及一种接合线，包括具有表面的芯（2），其中芯（2）包括铜作为主要成分，以及叠层在芯（2）的表面上的涂层（3） 其中所述涂层（3）包括钯作为主要成分，其中所述芯（2）包含银和磷作为其它组分，其中所述芯包含银和磷作为其它组分，其中所述银含量与所述磷含量之比 的核心在0.03到2的范围内。