公开(公告)号：WO2017111786A1

公开(公告)日：2017-06-29

申请号：PCT/US2015/000282

申请日：2015-12-23

Applicant: INTEL CORPORATION ,  SOOD, Mohit ,  XU, Huili ,  TAN, Wei ,  RAMALINGAM, Suriyakala ,  KRAJNIAK, Jan ,  ANANTHAKRISHNAN, Nisha

Inventor： SOOD, Mohit ,  XU, Huili ,  TAN, Wei ,  RAMALINGAM, Suriyakala ,  KRAJNIAK, Jan ,  ANANTHAKRISHNAN, Nisha

IPC: H01L25/065 ,  H01L23/12 ,  H01L23/48

CPC classification number: H01L23/12 ,  H01L23/48 ,  H01L23/49816 ,  H01L24/16 ,  H01L2224/16227 ,  H01L2224/81024 ,  H01L2924/15311 ,  H05K3/3436 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/043 ,  Y02P70/613

Abstract: An apparatus is described. The apparatus includes a first planar board to second planar board interface. The first planar board to second planar board interface includes a reflowed solder electrical connection structure between the first and second boards and a no flow adhesive. The reflowed solder electrical connection structure includes a reflowed solder ball and a reflowed tinned pad.

Abstract translation: 描述了一种装置。 该设备包括第一平面板到第二平面板接口。 第一平面板到第二平面板接口包括第一板和第二板之间的回流焊料电连接结构和不流动粘合剂。 回流焊接电气连接结构包括回流焊球和回流镀锡焊盘。

公开(公告)号：WO2017039918A1

公开(公告)日：2017-03-09

申请号：PCT/US2016/045164

申请日：2016-08-02

Applicant: INTEL CORPORATION

Inventor： SOOD, Mohit ,  LIU, Boxi ,  TAN, Wei ,  XU, Huili ,  MIRPURI, Kabir J.

IPC: H01L23/498 ,  H01L23/00

CPC classification number: B23K35/262 ,  B23K1/0016 ,  B23K35/0244 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/131 ,  H01L2224/13105 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13118 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/1339 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16502 ,  H01L2224/16505 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/8192 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/3511 ,  H01L2924/3841 ,  H05K1/141 ,  H05K1/144 ,  H05K1/181 ,  H05K3/3436 ,  H05K3/363 ,  H05K2201/042 ,  H05K2201/10234 ,  H05K2201/10378 ,  H05K2201/10734 ,  H05K2203/041 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/01323 ,  H01L2924/01324 ,  H01L2924/01079 ,  H01L2924/01029 ,  H01L2924/01049 ,  H01L2924/00014 ,  H01L2924/0665

Abstract: Embodiments herein may relate to an apparatus with a ball grid array (BGA) package that includes a plurality of solder balls of an off-eutectic material. In embodiments, the respective solder balls of the plurality of solder balls may form solder joints between a substrate of the BGA and a second substrate. In some embodiments the joints may be less than approximately 0.6 micrometers from one another. Other embodiments may be described and/or claimed.

Abstract translation: 本文的实施例可以涉及具有球栅阵列（BGA）封装的装置，其包括多个非共晶材料的焊球。 在实施例中，多个焊球的相应焊球可以在BGA的衬底和第二衬底之间形成焊接接头。 在一些实施例中，接头可以彼此小于约0.6微米。 可以描述和/或要求保护其他实施例。

公开(公告)号：WO2013095670A1

公开(公告)日：2013-06-27

申请号：PCT/US2011/067277

申请日：2011-12-23

Applicant: INTEL CORPORATION ,  SIDHU, Rajen S. ,  DUDEK, Martha A. ,  MATAYABAS, JR., James C. ,  PHEN, Michelle S. ,  TAN, Wei

Inventor： SIDHU, Rajen S. ,  DUDEK, Martha A. ,  MATAYABAS, JR., James C. ,  PHEN, Michelle S. ,  TAN, Wei

IPC: H01L21/60 ,  H01L23/48

CPC classification number: B23K35/025 ,  B23K35/362 ,  H01L21/4853 ,  H01L23/488 ,  H01L23/49816 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0381 ,  H01L2224/03828 ,  H01L2224/03829 ,  H01L2224/03849 ,  H01L2224/0401 ,  H01L2224/05794 ,  H01L2224/058 ,  H01L2224/05809 ,  H01L2224/05811 ,  H01L2224/05813 ,  H01L2224/05817 ,  H01L2224/05839 ,  H01L2224/05844 ,  H01L2224/11334 ,  H01L2224/11848 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/131 ,  H01L2924/3511 ,  H01L2924/3841 ,  H05K3/3489 ,  H05K2203/041 ,  H05K2203/046 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/01032 ,  H01L2924/01105 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/0103 ,  H01L2924/01049 ,  H01L2924/01083

Abstract: Flux formulations and solder attachment during the fabrication of electronic device assemblies are described. One flux formation includes a flux component and a metal particle component, the metal particle component being present in an amount of from 5 to 35 volume percent of the flux formulation. In one feature of certain embodiments, the metal particle component includes solder particles. Other embodiments are described and claimed.

Abstract translation: 描述了在制造电子器件组件期间的焊剂配方和焊料附着。 一种熔剂形成包括助熔剂组分和金属颗粒组分，金属颗粒组分的存在量为焊剂配方的5至35体积％。 在某些实施方案的一个特征中，金属颗粒组分包括焊料颗粒。 描述和要求保护其他实施例。