Abstract:
A method includes sensing a state of a data cell to generate a data voltage. The state of the data cell corresponds to a state of a programmable resistance based memory element of the data cell. The method further includes sensing a state of a reference cell to generate a reference voltage. The state of the data cell and the state of the reference cell are sensed via a common sensing path. The method further includes determining a logic value of the data cell based on the data voltage and the reference voltage.
Abstract:
A two-transistor one-MTJ (2T1MTJ) three port structure includes two separate pin layer structures coupled to one free layer structure. The pin layer structures may include an anti-ferromagnetic layer (AFM) layer coupled to a pin layer. The free layer structure includes free layer coupled to a barrier layer and a cap layer. The free layer structure may include a thin barrier layer coupled to each of the pin layer stacks. The three port MTJ structure provides separate write and read paths which improve read sensing margin without increasing write voltage or current. The three port MTJ structure may be fabricated with a simple two step MTJ etch process.
Abstract:
A semiconductor device includes a magnetic tunnel junction (MTJ) storage element configured to be disposed in a common interlayer metal dielectric (IMD) layer with a logic element. Cap layers separate the common IMD layer from a top and bottom IMD layer. Top and bottom electrodes are coupled to the MTJ storage element. Metal connections to the electrodes are formed in the top and bottom IMD layers respectively through vias in the separating cap layers. Alternatively, the separating cap layers are recessed and the bottom electrodes are embedded, such that direct contact to metal connections in the bottom IMD layer is established. Metal connections to the top electrode in the common IMD layer are enabled by isolating the metal connections from the MTJ storage elements with metal islands and isolating caps.
Abstract:
Magnetic tunnel junctions (MTJs) and methods of forming same are disclosed. A pinned layer is disposed in the MTJ such that a free layer of the MTJ can couple to a drain of an access transistor when provided in a magnetic random access memory (MRAM) bitcell. This structure alters the write current flow direction to align the write current characteristics of the MTJ with write current supply capability of an MRAM bitcell employing the MTJ. As a result, more write current can be provided to switch the MTJ from a parallel (P) to anti-parallel (AP) state. An anti-ferromagnetic material (AFM) layer is provided on the pinned layer to fix pinned layer magnetization. To provide enough area for depositing the AFM layer to secure pinned layer magnetization, a pinned layer having a pinned layer surface area greater than a free layer surface area of the free layer is provided.
Abstract:
Systems and methods to reduce source loading effects in STT-MRAM are disclosed. In a particular embodiment, a method includes determining a switching current ratio of a magnetic tunnel junction (MTJ) structure that enables stable operation of a memory cell. The memory cell includes the MTJ structure serially coupled to an access transistor. The method also includes modifying an offset magnetic field that is incident to a free layer of the MTJ structure. The modified offset magnetic field causes the MTJ structure to exhibit the switching current ratio.
Abstract:
A multi-free layer magnetic tunnel junction (MTJ) cell includes a bottom electrode layer, an antiferromagnetic layer on the bottom electrode layer, a fixed magnetization layer on the antiferromagnetic layer and a barrier layer on the fixed magnetization layer. A first free magnetization layer is on a first area of the barrier layer, and a capping layer is on the first free magnetization layer. A free magnetization layer is on a second area of the barrier layer, laterally displaced from the first area, and a capping layer is on the second free magnetization layer. Optionally current switches establish a read current path including the first free magnetization layer concurrent with not establishing a read current path including the second free magnetization layer. Optionally current switches establishing a read current path including the first and second free magnetization layer.
Abstract:
A non-volatile latch circuit includes a pair of cross-coupled inverters, a pair of resistance-based memory elements, and write circuitry configured to write data to the pair of resistance-based memory elements. The pair of resistance-based memory elements is isolated from the pair of cross-coupled inverters during a latching operation. A sensing circuit includes a first current path that includes a first resistance-based memory element and an output of the sensing circuit. The sensing circuit includes a second current path to reduce current flow through the first resistance-based memory element at a first operating point of the sensing circuit. The sensing circuit may also include an n-type metal-oxide-semiconductor (NMOS) transistor to provide a step down supply voltage to the first current path.
Abstract:
Disclosed is an electronic device manufacturing process including depositing a bottom electrode layer (711). Then an electronic device (721) is fabricated on the bottom electrode layer. Patterning of the bottom electrode layer is performed after fabricating the electronic device and in a separate process from patterning a top electrode. A first dielectric layer (740) is then deposited on the electronic device and the bottom electrode layer followed by a top electrode layer (751). The top electrode is then patterned in a separate process from the bottom electrode. Separately patterning the top and bottom electrodes improves yields by reducing voids in the dielectric material between electronic devices. One electronic device the manufacturing process is well -suited for is magnetic tunnel junctions (MTJs).
Abstract:
Systems, circuits and methods for read operations in Spin Transfer Torque Magnetoresistive Random Access Memory (STT-MRAM) are disclosed. A plurality of bit cells, each coupled to one of a plurality of bit lines, word lines and source lines are provided. A plurality of precharge transistors corresponding to one of the plurality of bit lines are configured to discharge the bit lines to ground prior to a read operation.
Abstract:
A method of establishing a reference level includes providing first and second non-overlapping paths from a first node to a second node, providing first and second reference magnetic random access memory (MRAM) elements in the first path, providing third and fourth reference MRAM elements in the second path, measuring a first value indicative of a resistance between the first node and the second node, and setting the reference level based at least in part on the measured value. Also an associated reference circuit.