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公开(公告)号:CN107660308A
公开(公告)日:2018-02-02
申请号:CN201680031979.6
申请日:2016-05-23
申请人: 西门子公司
IPC分类号: H01L21/60 , H01L23/49 , H01L23/485
CPC分类号: H01L23/49 , C25D3/38 , C25D5/18 , C25D21/14 , H01L23/3733 , H01L23/3735 , H01L23/4922 , H01L23/49513 , H01L23/49537 , H01L23/49562 , H01L23/49568 , H01L23/49811 , H01L23/50 , H01L24/05 , H01L24/24 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/75 , H01L24/77 , H01L24/82 , H01L24/83 , H01L24/84 , H01L24/92 , H01L24/97 , H01L2224/04026 , H01L2224/04034 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/24105 , H01L2224/24227 , H01L2224/24245 , H01L2224/29111 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29155 , H01L2224/3207 , H01L2224/32227 , H01L2224/32245 , H01L2224/33181 , H01L2224/37005 , H01L2224/37111 , H01L2224/37124 , H01L2224/37139 , H01L2224/37144 , H01L2224/37147 , H01L2224/37155 , H01L2224/37166 , H01L2224/3719 , H01L2224/37211 , H01L2224/37224 , H01L2224/37239 , H01L2224/37244 , H01L2224/37247 , H01L2224/37255 , H01L2224/37266 , H01L2224/3729 , H01L2224/373 , H01L2224/37395 , H01L2224/376 , H01L2224/4007 , H01L2224/40227 , H01L2224/40499 , H01L2224/756 , H01L2224/75703 , H01L2224/776 , H01L2224/77703 , H01L2224/821 , H01L2224/82101 , H01L2224/83007 , H01L2224/831 , H01L2224/834 , H01L2224/83411 , H01L2224/83424 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/83466 , H01L2224/8349 , H01L2224/83511 , H01L2224/83524 , H01L2224/83539 , H01L2224/83544 , H01L2224/83547 , H01L2224/83555 , H01L2224/83566 , H01L2224/8359 , H01L2224/836 , H01L2224/83695 , H01L2224/8385 , H01L2224/83907 , H01L2224/84007 , H01L2224/841 , H01L2224/8485 , H01L2224/8492 , H01L2224/84951 , H01L2224/9201 , H01L2224/9205 , H01L2224/9221 , H01L2224/97 , H01L2924/13055 , H01L2924/181 , H05K3/424 , H01L2924/00012 , H05K3/4661 , H01L2924/00014 , H01L2924/01029 , H01L2924/01028 , H01L2924/01047 , H01L2924/01079 , H01L2924/0105 , H01L2224/83 , H01L2224/84 , H01L2224/82 , H01L2924/01014 , H01L23/485
摘要: 在用于使具有至少一个接触部的组件电接触的方法中,至少一个开孔接触件电镀式连接到至少一个接触部。因此构成组件模块。接触部优选是平面部分或者具有以下接触面:所述接触面的最大的平面延伸比接触部垂直于所述接触面的延伸更大。电镀式连接的温度为最高100℃、优选地最高60℃、适宜地最高20℃并且理想地最高5℃和/或与所述组件的运行温度偏差最高50℃、优选地最高20℃,尤其最高10℃并且理想地最高5℃、优选地最高2℃。组件可以借助所述接触件与另外的组件和/或导电体和/或衬底接触。优选地,考虑具有两个接触部的组件,所述两个接触部在所述组件的相互背离的侧上,其中,对于各个接触部,至少一个开孔接触件在所述接触部上电镀式连接。
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公开(公告)号:CN107851626A
公开(公告)日:2018-03-27
申请号:CN201680045964.5
申请日:2016-08-02
申请人: 西门子股份公司
发明人: S.施特格迈尔
IPC分类号: H01L23/373 , H01L23/427 , H01L23/467 , H01L23/473
CPC分类号: H01L23/427 , H01L23/3733 , H01L23/3735 , H01L23/3736 , H01L23/467 , H01L24/37 , H01L2224/13939 , H01L2224/37211 , H01L2224/37239 , H01L2224/37244 , H01L2224/37247 , H01L2224/37255 , H01L2224/37395
摘要: 元件模块具有元件,该元件具有至少一个电气的接触部,其中至少一个接触部连接至少一个开孔的接触件,其中元件模块具有用于用冷却液进行冷却的冷却系统,冷却系统包括一个或多个冷却通道,冷却通道借助于开孔的接触件的孔来构成。功率模块包括这种元件模块。
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