公开(公告)号：EP4435152A2

公开(公告)日：2024-09-25

申请号：EP24191899.4

申请日：2017-10-25

申请人： Adeia Semiconductor Technologies LLC

发明人： UZOH, Cyprian, Emeka

IPC分类号： C25D7/12

CPC分类号： H01L24/81 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/1308420130101 ,  H01L2224/1626520130101 ,  H01L2224/1385520130101 ,  H01L2224/1162220130101 ,  H01L2224/1626820130101 ,  H01L2224/1605920130101 ,  H01L24/80 ,  H01L2224/040120130101 ,  H01L2224/055720130101 ,  H01L2224/0560920130101 ,  H01L2224/0561120130101 ,  H01L2224/0561620130101 ,  H01L2224/0562420130101 ,  H01L2224/0563920130101 ,  H01L2224/0564420130101 ,  H01L2224/0564720130101 ,  H01L2224/0565520130101 ,  H01L2224/0568420130101 ,  H01L2224/1146220130101 ,  H01L2224/1146420130101 ,  H01L2224/114720130101 ,  H01L2224/1300720130101 ,  H01L2224/1301920130101 ,  H01L2224/1310520130101 ,  H01L2224/1310920130101 ,  H01L2224/1311120130101 ,  H01L2224/1311620130101 ,  H01L2224/1312420130101 ,  H01L2224/1313920130101 ,  H01L2224/1314420130101 ,  H01L2224/1314720130101 ,  H01L2224/1315520130101 ,  H01L2224/1318420130101 ,  H01L2224/1356220130101 ,  H01L2224/1356420130101 ,  H01L2224/1365520130101 ,  H01L2224/1368420130101 ,  H01L2224/1380920130101 ,  H01L2224/1381120130101 ,  H01L2224/1384720130101 ,  H01L2224/1605820130101 ,  H01L2224/1614820130101 ,  H01L2224/291920130101 ,  H01L2224/8089520130101 ,  H01L2224/8089620130101 ,  H01L2224/8106520130101 ,  H01L2224/8107520130101 ,  H01L2224/8109120130101 ,  H01L2224/8119320130101 ,  H01L2224/8120320130101 ,  H01L2224/818120130101 ,  H01L2224/818420130101 ,  H01L2225/105820130101 ,  H01L2924/1531120130101 ,  H01L2224/810920130101 ,  H01L2224/0556820130101 ,  H01L2224/0391220130101 ,  H01L2224/8109920130101 ,  H01L2224/1100920130101 ,  H01L2225/0651320130101 ,  H01L2224/1650320130101 ,  H01L2224/0300920130101 ,  H01L2224/1380520130101 ,  H01L2224/8108520130101 ,  H01L2224/8035720130101 ,  H01L2224/055820130101 ,  H01L2224/0556220130101 ,  H01L2224/0556420130101 ,  H01L2224/0557120130101 ,  H01L2224/0557220130101 ,  H01L23/552 ,  H01L2224/8385620130101 ,  H01L2224/8386220130101 ,  H01L2224/9212520130101 ,  H01L2224/808120130101 ,  H01L2224/8098620130101 ,  H01L2224/1623720130101 ,  H01L2224/1614720130101 ,  H01L2224/0823720130101 ,  H01L2224/0514720130101 ,  H01L2224/0558220130101 ,  H01L2224/0558320130101 ,  H01L2224/0584720130101 ,  H01L2224/0584420130101 ,  H01L2224/0585520130101 ,  H01L2224/7310420130101 ,  H01L2224/7320420130101 ,  H05K3/4007 ,  H05K3/3436 ,  H05K2201/1024220130101 ,  H01L2224/803420130101 ,  H01L2224/8014120130101 ,  H01L2224/0814520130101 ,  C25D7/123 ,  C25D5/022 ,  C23C18/1653 ,  C25D5/48 ,  C25D5/10 ,  C25D5/18 ,  C25D3/38 ,  C25D5/605 ,  C25D5/12 ,  C23C18/1658

摘要： A bonded structure, comprising a first component including a first substrate having a first dielectric surface and a first conductive feature at the first dielectric surface; and a second component including a second substrate having a second dielectric surface and a second conductive feature at the second dielectric surface. The first dielectric surface is directly bonded to the second dielectric surface without an underfill. The first conductive feature is bonded to second conductive feature by way of a conductive bond region between the first and second conductive features, wherein the bond region comprises structural evidence of conductive nanoparticles employed in bonding the first conductive feature to the second conductive feature.

公开(公告)号：EP4363640A1

公开(公告)日：2024-05-08

申请号：EP22743461.0

申请日：2022-06-30

申请人： Umicore Galvanotechnik GmbH

发明人： ZIEBART, Robert ,  WIRTH, Guenter ,  NEUHAUS, Silvia ,  MUELLER, Stefan

IPC分类号： C25D5/10 ,  B32B15/01 ,  C22C9/02 ,  C22C9/04 ,  C22C13/00 ,  C25D7/00

CPC分类号： C22C9/02 ,  C22C9/04 ,  C22C13/00 ,  B32B15/01 ,  C25D5/10 ,  C25D7/00 ,  C25D3/58 ,  C22C30/00

公开(公告)号：EP3011079B1

公开(公告)日：2019-05-15

申请号：EP14813898.5

申请日：2014-06-20

申请人： Baker Hughes, a GE company, LLC

发明人： MONTEIRO, Othon ,  MAZYAR, Oleg ,  KHABASHESKU, Valery

IPC分类号： C25D5/10 ,  C25D15/00 ,  C25D3/66 ,  C25D3/02 ,  C25D5/18 ,  C23C18/16

CPC分类号： C25D15/00 ,  C23C18/1662 ,  C25D3/02 ,  C25D3/665 ,  C25D5/10 ,  C25D5/18

摘要： A method for coating a substrate includes disposing a deposition composition in a container. The deposition composition includes a plurality of nanosheets and a metal material. The method also includes disposing a substrate in the container, contacting the substrate with the deposition composition, applying a voltage to the substrate, electrodepositing, on the substrate, a coating that includes a metal from metal ions and the nanosheets in response to biasing the substrate at the first potential.

公开(公告)号：EP3412799A1

公开(公告)日：2018-12-12

申请号：EP18176707.0

申请日：2018-06-08

申请人： The Boeing Company

发明人： GAYDOS, Stephen P. ,  IJERI, Vijaykumar S. ,  PRAKASH, Om ,  MISHRA, Trilochan ,  SINGH, Raghuvir ,  TIWARI, Shashi Kant

IPC分类号： C25D3/56 ,  C25D5/10 ,  C25D5/18

CPC分类号： C25D3/562 ,  C25D3/565 ,  C25D5/10 ,  C25D5/18

摘要： The present disclosure provides electrolyte solutions for electrodeposition of zinc-iron alloys, methods of forming electrolyte solutions, and methods of electrodepositing zinc-iron alloys. An electrolyte solution for electroplating can include an alkali metal citrate, an alkali metal acetate, a citric acid, and glycine with a metal salt. An electrolyte solution can be formed by dissolving an alkali metal citrate, an alkali metal acetate, a citric acid, and glycine in water or an aqueous solution. Electrodepositing zinc-iron alloys on a substrate can include introducing a cathode and an anode into an electrolyte solution comprising an alkali metal citrate, an alkali metal acetate, a citric acid, and glycine. Electrodepositing can further include passing a current between the cathode and the anode through the electrolyte solution to deposit zinc and iron onto the cathode.

公开(公告)号：EP2976442B1

公开(公告)日：2018-11-28

申请号：EP14717395.9

申请日：2014-03-12

申请人： Salzgitter Flachstahl GmbH

发明人： KÖHLER, Kai ,  DEBEAUX, Marc ,  LUTHER, Friedrich

IPC分类号： C22C38/20 ,  C22C38/34 ,  C22C38/38 ,  C22C38/28 ,  C23C30/00 ,  C23C28/02 ,  C23C2/06 ,  C22C38/18 ,  C22C38/16 ,  C25D7/06 ,  C25D5/10 ,  C22C38/06 ,  C22C38/04

CPC分类号： C25D5/10 ,  C22C38/04 ,  C22C38/06 ,  C22C38/16 ,  C22C38/18 ,  C22C38/20 ,  C22C38/24 ,  C22C38/26 ,  C22C38/28 ,  C22C38/34 ,  C22C38/38 ,  C23C2/02 ,  C23C2/06 ,  C23C28/02 ,  C23C28/021 ,  C23C30/00 ,  C25D3/22 ,  C25D7/0614

公开(公告)号：EP2905356B1

公开(公告)日：2018-10-10

申请号：EP12886098.8

申请日：2012-10-31

申请人： JX Nippon Mining & Metals Corporation

发明人： SHIBUYA, Yoshitaka ,  FUKAMACHI, Kazuhiko ,  KODAMA, Atsushi

IPC分类号： C23C30/00 ,  C22C5/06 ,  C22C5/08 ,  C22C9/00 ,  C22C9/02 ,  C22C9/04 ,  C22C13/00 ,  C22C13/02 ,  C22C19/03 ,  C22C19/05 ,  C25D3/02 ,  C25D3/12 ,  C25D7/00 ,  H01B5/02 ,  H01R13/03

CPC分类号： C22C5/06 ,  B32B15/01 ,  C22C5/02 ,  C22C5/08 ,  C22C9/00 ,  C22C9/02 ,  C22C9/04 ,  C22C13/00 ,  C22C13/02 ,  C22C19/03 ,  C22C28/00 ,  C23C28/021 ,  C25D3/04 ,  C25D3/18 ,  C25D3/20 ,  C25D3/30 ,  C25D3/38 ,  C25D3/46 ,  C25D3/48 ,  C25D3/50 ,  C25D3/562 ,  C25D3/60 ,  C25D3/64 ,  C25D5/10 ,  C25D5/12 ,  C25D5/505 ,  C25D7/00

摘要： There are provided an electronic component metal material which has low insertability/extractability, low whisker formability, and high durability, and a method for manufacturing the metal material. The electronic component metal material 10 includes a base material 11, an A layer 14 constituting an outermost surface layer on the base material 11 and formed of Sn, In or an alloy thereof, and a B layer 13 constituting a middle layer provided between the base material 11 and the A layer 14 and formed of Ag, Au, Pt, Pd, Ru, Rh, Os, Ir or an alloy thereof, wherein the outermost surface layer (A layer) 14 has a thickness of 0.002 to 0.2 µm, and the middle layer (B layer) 13 has a thickness larger than 0.3 µm.

公开(公告)号：EP3380267A1

公开(公告)日：2018-10-03

申请号：EP16781574.5

申请日：2016-09-16

申请人： Heraeus Materials Singapore Pte. Ltd. ,  Heraeus Oriental HiTec Co., Ltd.

发明人： KANG, Il Tae ,  TARK,Yong-Deok ,  CHO, Mong Hyun ,  KIM, Jong Su ,  JUNG, Hyun Seok ,  KIM, Tae Yeop ,  ZHANG, Xi ,  SARANGAPANI, Murali

IPC分类号： B23K35/30 ,  B23K35/02 ,  C22C5/06 ,  H01L23/00 ,  C23C28/00 ,  C23C30/00

CPC分类号： B23K35/3006 ,  B23K20/007 ,  B23K35/0227 ,  B23K35/0261 ,  B23K35/404 ,  C22C5/06 ,  C22C5/08 ,  C22F1/002 ,  C22F1/02 ,  C22F1/14 ,  C23C14/022 ,  C23C14/165 ,  C23C28/021 ,  C25D5/10 ,  C25D5/12 ,  C25D5/50 ,  C25D7/0607 ,  H01L24/42 ,  H01L24/43 ,  H01L24/44 ,  H01L24/45 ,  H01L24/85 ,  H01L2224/05624 ,  H01L2224/43125 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45164 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45644 ,  H01L2224/45655 ,  H01L2224/45664 ,  H01L2224/48511 ,  H01L2924/0102 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01078 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755

摘要： A wire comprising a wire core with a surface, the wire core having a coating layer superimposed on its surface, wherein the wire core includes: (a) pure silver consisting of silver and further components; or (b) doped silver consisting of silver, at least one doping element, and further components; or (c) a silver alloy consisting of silver, palladium and further components; or (d) a silver alloy consisting of silver, palladium, gold, and further components; or (e) a doped silver alloy consisting of silver, palladium, gold, at least one doping element, and further components, wherein the individual amount of any further component is less than 30 wt.-ppm and the individual amount of any doping element is at least 30 wt.-ppm, and the coating layer is a single-layer of gold or palladium or a double-layer comprised of an inner layer of nickel or palladium and an adjacent outer layer of gold.

公开(公告)号：EP2963740B1

公开(公告)日：2018-09-19

申请号：EP15174851.4

申请日：2015-07-01

申请人： JAPAN AVIATION ELECTRONICS INDUSTRY LIMITED

发明人： TSUGAWA, Sae ,  SATO, Kazuomi

IPC分类号： H01R13/26 ,  H01R24/66 ,  H01R13/03 ,  H01R13/11 ,  C25D5/10

CPC分类号： H01R13/03 ,  C25D5/10 ,  H01R13/112 ,  H01R13/26 ,  H01R24/66

摘要： A connector is mateable with a mating connector which includes a mating contact having a mating contact point. The connector comprises a contact and a holding member which holds the contact. The contact has a contact portion. When the connector and the mating connector are mated with each other, the mating contact point slides on and is in contact with the contact portion. The contact portion has a first plated layer as its outermost layer and a second plated layer located under the first plated layer. The first plated layer is made of silver or silver alloy and has Vickers hardness not more than 90Hv. The second plated layer is made of silver or silver alloy and has Vickers hardness not less than 100Hv.

公开(公告)号：EP2812481B1

公开(公告)日：2018-09-05

申请号：EP12738135.8

申请日：2012-07-24

申请人： NV Bekaert SA

发明人： BUYTAERT, Guy ,  WEMEL, Dieter ,  REIS, Patricia

IPC分类号： D07B1/06 ,  B21C1/00 ,  B21C9/02 ,  C10M173/02 ,  C23F11/14 ,  C23F11/167

CPC分类号： D07B1/0666 ,  B21C9/02 ,  B32B15/015 ,  C10M173/00 ,  C10M173/02 ,  C10M2203/10 ,  C10M2203/1006 ,  C10M2207/125 ,  C10M2207/401 ,  C10M2215/202 ,  C10M2215/223 ,  C10M2219/042 ,  C10M2223/04 ,  C10N2240/402 ,  C22C9/04 ,  C22C38/00 ,  C22C38/001 ,  C22C38/02 ,  C22C38/04 ,  C22C38/42 ,  C22C38/44 ,  C25D3/12 ,  C25D3/22 ,  C25D3/38 ,  C25D5/10 ,  C25D5/48 ,  C25D5/50 ,  C25D7/0607 ,  D07B1/0633 ,  D07B1/0646 ,  D07B1/066 ,  D07B2201/2011 ,  D07B2201/2012 ,  D07B2201/2013 ,  D07B2201/2043 ,  D07B2201/2044 ,  D07B2201/2045 ,  D07B2205/3089 ,  Y10T428/12562 ,  Y10T428/12924 ,  D07B2801/18

摘要： An elongated steel element adapted for the reinforcement of rubber products is covered with a ternary alloy or quaternary alloy coating of copper-M-zinc. M is one or two metals selected out of the group consisting of cobalt, nickel, tin, indium, manganese, iron, bismuth and molybdenum. The copper content inside the coating ranges from 58 weight percent to 75 weight percent. The content of the one or two metals inside said coating ranges from 0.5 weight percent to 10 weight percent. The remainder is zinc and unavoidable impurities. The one or two metals are present throughout the coating. Phosphorus is present on and/or in the coating in an amount of more than 1 and less than 4 milligram per square meter of the coating. The coating further comprises one or, ore compounds which complex with the copper in the coating to form an insoluble film on its surface. Good results are obtained for steam ageing and cured humidity adhesion. Furthermore, a corresponding method for manufacturing such an elongated steel element is disclosed.

公开(公告)号：EP3194642A4

公开(公告)日：2018-07-04

申请号：EP15843023

申请日：2015-09-18

申请人： MODUMETAL INC

发明人： LOMASNEY CHRISTINA A

IPC分类号： C25D21/10 ,  B65G49/02 ,  C25D5/10 ,  C25D5/12 ,  C25D5/14 ,  C25D5/18 ,  C25D7/06 ,  C25D17/02 ,  C25D21/12

CPC分类号： C25D21/10 ,  C25D5/10 ,  C25D5/12 ,  C25D5/14 ,  C25D5/18 ,  C25D7/0607 ,  C25D7/0614 ,  C25D17/02 ,  C25D21/12

摘要： Described herein are apparatus and methods for the continuous application of nanolaminated materials by electrodeposition.