公开(公告)号：EP1919984B1

公开(公告)日：2012-12-05

申请号：EP06802055.1

申请日：2006-08-22

Applicant: DuPont-Mitsui Fluorochemicals Company, Ltd.

Inventor： LEE, Jeong, Chang ,  TAKI, Etsuya

IPC: C08J5/04 ,  C08J5/24 ,  B32B15/08 ,  B32B27/04 ,  H05K1/03

CPC classification number: C08J5/04 ,  B32B5/024 ,  B32B7/08 ,  B32B15/08 ,  B32B15/082 ,  B32B15/085 ,  B32B15/20 ,  B32B27/04 ,  B32B27/12 ,  B32B27/304 ,  B32B27/322 ,  B32B2262/101 ,  B32B2307/202 ,  B32B2307/204 ,  B32B2307/306 ,  B32B2307/31 ,  B32B2307/518 ,  B32B2307/538 ,  B32B2307/5825 ,  B32B2307/714 ,  B32B2307/734 ,  B32B2457/08 ,  C08J5/24 ,  C08J2327/12 ,  H05K1/034 ,  H05K1/0366 ,  H05K2201/0141 ,  H05K2201/015 ,  Y10T428/3154 ,  Y10T428/31678 ,  Y10T442/20 ,  Y10T442/2418 ,  Y10T442/2475 ,  Y10T442/2992 ,  Y10T442/3415 ,  Y10T442/475 ,  Y10T442/656

公开(公告)号：EP2519083A1

公开(公告)日：2012-10-31

申请号：EP10839014.7

申请日：2010-07-16

Applicant: Nippon Mektron, Limited

Inventor： KAJIYA Atsushi ,  YOSHIHARA Hidekazu ,  ITANI Toru

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K1/032 ,  H05K1/028 ,  H05K1/0393 ,  H05K3/22 ,  H05K3/429 ,  H05K3/4635 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/09263 ,  H05K2203/1105

Abstract: The present invention is to provide a flexible circuit board and a method for production thereof, which are high in connection reliability, and in which the flexible circuit board is formed with a bent portion and can be deformed in a flexible manner, and in which even if deformation is repeated, or if there is heat dissipation from electronic parts, or if fine wiring is formed, exfoliation and breakage of a wiring layer will not occur.
The present invention resides in a flexible circuit board which has: an insulating film 2 made of a thermoplastic resin; a wiring layer 3 formed on said insulating film 2; and an insulating layer 4 made of a thermoplastic resin and formed on said wiring layer 3; and which characterized in that said flexible circuit board 1 is formed in at least one place thereof with a bent portion having a radius of curvature R (mm); and said flexible circuit board 1 is constructed such that it is deformable in a state in which the radius of curvature R (mm) of said bent portion is maintained.

公开(公告)号：EP2198680B1

公开(公告)日：2012-10-24

申请号：EP08798983.6

申请日：2008-08-29

Applicant: 3M Innovative Properties Company

Inventor： YANG, Rui, ,  KREUTTER, Nathan P., ,  MCHATTIE, James S.,

IPC: H05K3/00 ,  B32B15/08 ,  C09J179/08 ,  B32B15/20 ,  C08G73/14 ,  H01L21/48 ,  H05K3/28 ,  H05K3/38 ,  H05K3/46

CPC classification number: H05K3/4691 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B27/365 ,  B32B2457/00 ,  C08G73/14 ,  C09J179/08 ,  H05K3/002 ,  H05K3/281 ,  H05K3/386 ,  H05K3/4652 ,  H05K2201/0141 ,  H05K2201/0154 ,  H05K2203/0793 ,  Y10T29/49124 ,  Y10T428/24917 ,  Y10T428/31681

公开(公告)号：EP2081204B1

公开(公告)日：2012-08-01

申请号：EP09000587.7

申请日：2009-01-16

Applicant: Harris Corporation

Inventor： Rendek, Louis Joseph Jr. ,  Shacklette, Lawrence Wayne ,  Jaynes, Paul Brain ,  Marvin, Philip Anthony

IPC: H01H13/704 ,  H05K3/00 ,  H01H13/705 ,  H01H13/06

CPC classification number: H01H13/704 ,  H01H11/00 ,  H05K1/0284 ,  H05K3/303 ,  H05K3/4614 ,  H05K3/4626 ,  H05K3/4632 ,  H05K2201/0141 ,  H05K2201/091 ,  Y10T29/49107 ,  Y10T29/4913

Abstract: An electronic device includes a multilayer circuit board having a non-planar three-dimensional shape defining a membrane switch recess therein. The multilayer circuit board may include at least one liquid crystal polymer (LCP) layer, and at least one electrically conductive pattern layer thereon defining at least one membrane switch electrode adjacent the membrane switch recess to define a membrane switch. The electronic may further include a compressible dielectric material filling the membrane switch recess. The electronic device may also include at least one spring member within the membrane switch recess.

公开(公告)号：EP2302986A1

公开(公告)日：2011-03-30

申请号：EP10176401.7

申请日：2010-09-13

Applicant: NITTO DENKO CORPORATION

Inventor： Hanazono, Hiroyuki ,  Inoue, Shinichi

IPC: H05K1/03 ,  H01M8/02

CPC classification number: H05K1/0326 ,  H01M8/006 ,  H01M8/0269 ,  H01M8/1011 ,  H01M8/1097 ,  H05K1/0393 ,  H05K2201/0141 ,  Y02E60/523

Abstract: An FPC board (1) includes a base insulating layer (2). The base insulating layer (2) is composed of a first insulating portion (2a) and a second insulating portion (2b). A bend portion (B1) is provided in the first insulating portion. A conductor layer (3) is formed on one surface of the base insulating layer (2). The conductor layer (3) is composed of a collector portion (3a,3b) and a drawn-out conductor portion (4a,4b). A cover layer (6a,6b) is formed to cover the conductor layer (3). A liquid crystal polymer is used as a material for the base insulating layer (2).

Abstract translation: FPC基板（1）具有基底绝缘层（2）。 基底绝缘层（2）由第一绝缘部（2a）和第二绝缘部（2b）构成。 弯曲部分（B1）设置在第一绝缘部分中。 导体层（3）形成在基底绝缘层（2）的一个表面上。 导体层（3）由集电部（3a，3b）和引出导体部（4a，4b）构成。 形成覆盖层（6a，6b）以覆盖导体层（3）。 液晶聚合物被用作基底绝缘层（2）的材料。

公开(公告)号：EP2198680A1

公开(公告)日：2010-06-23

申请号：EP08798983.6

申请日：2008-08-29

Applicant: 3M Innovative Properties Company

Inventor： YANG, Rui, ,  KREUTTER, Nathan P., ,  MCHATTIE, James S.,

IPC: H05K3/46 ,  H05K3/00 ,  B32B27/08 ,  B32B15/08 ,  C09J179/08 ,  C09J7/02

CPC classification number: H05K3/4691 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B27/365 ,  B32B2457/00 ,  C08G73/14 ,  C09J179/08 ,  H05K3/002 ,  H05K3/281 ,  H05K3/386 ,  H05K3/4652 ,  H05K2201/0141 ,  H05K2201/0154 ,  H05K2203/0793 ,  Y10T29/49124 ,  Y10T428/24917 ,  Y10T428/31681

Abstract: The present invention relates to partially rigid flexible circuits having both rigid portions and flexible portions and methods for making the same.

公开(公告)号：EP2136993A1

公开(公告)日：2009-12-30

申请号：EP08745646.3

申请日：2008-04-11

Applicant: 3M Innovative Properties Company

Inventor： YANG, Rui

IPC: B32B27/06 ,  C08G73/10 ,  C08J5/18

CPC classification number: H05K3/002 ,  H05K1/0346 ,  H05K1/036 ,  H05K1/0393 ,  H05K3/281 ,  H05K2201/0141 ,  H05K2201/0154 ,  H05K2201/0195 ,  Y10T428/24917 ,  Y10T428/31681 ,  Y10T428/31721

Abstract: The invention relates to flexible circuits and more particularly to flexible printed circuits having cover layers. The cover layers may be a chemically-etchable adhesive polyimide. The cover layers may be patterned after they are applied to the flexible circuit substrate.

公开(公告)号：EP2081418A2

公开(公告)日：2009-07-22

申请号：EP09000584.4

申请日：2009-01-16

Applicant: Harris Corporation

Inventor： Rendek, Louis Joseph Jr. ,  Shacklette, Lawrence Wayne ,  Marvin, Philip Anthony

IPC: H05K1/00

CPC classification number: H05K3/0014 ,  H01H2219/01 ,  H05K1/0284 ,  H05K1/185 ,  H05K3/4611 ,  H05K2201/0141 ,  H05K2201/091 ,  H05K2203/1105 ,  H05K2203/302

Abstract: A method is for making a non-planar three-dimensional (3D) multilayered circuit board. The method may include forming a stacked arrangement including at least one pair of liquid crystal polymer (LCP) layers with a bonding layer therebetween. The stacked arrangement may further include at least one electrically conductive pattern layer on at least one of the LCP layers. The method may further include heating and applying pressure to the stacked arrangement to shape the stacked arrangement into a non-planar 3D shape and concurrently causing the bonding layer to bond together the adjacent LCP layers of the stacked arrangement to thereby form the non-planar 3D multi-layered circuit board.

Abstract translation: 一种制造非平面三维（3D）多层电路板的方法。 该方法可以包括形成包括至少一对液晶聚合物（LCP）层的堆叠布置，其间具有结合层。 所述堆叠布置还可包括至少一个LCP层上的至少一个导电图案层。 该方法还可以包括加热和施加压力到堆叠布置以将堆叠布置形成为非平面3D形状并且同时使结合层将堆叠布置的相邻LCP层结合在一起，从而形成非平面3D 多层电路板。

公开(公告)号：EP2077701A2

公开(公告)日：2009-07-08

申请号：EP08009185.3

申请日：2008-05-19

Applicant: LG ELECTRONICS, INC.

Inventor： Lee, Sang Gon ,  Kim, Dae Sung ,  Chang, Woo Hyuck

IPC: H05K1/00

CPC classification number: H05K1/028 ,  H01L23/3735 ,  H01L23/4985 ,  H01L2924/0002 ,  H01L2924/12044 ,  H05K2201/0141 ,  H05K2201/068 ,  H05K2201/10681 ,  Y10T428/24917 ,  Y10T428/2495 ,  Y10T428/31681 ,  H01L2924/00

Abstract: A flexible film is provided. The flexible film includes a dielectric film; and a metal layer disposed on the dielectric film, wherein the dielectric film has a thermal expansion coefficient of about 3 to 25 ppm/°C. The flexible film is robust against temperature variations and has excellent thermal resistance and excellent dimension stability.

Abstract translation: 提供柔性薄膜。 柔性膜包括电介质膜; 以及设置在所述介电膜上的金属层，其中所述介电膜具有约3至25ppm /℃的热膨胀系数。 柔性薄膜对温度变化稳健，具有优异的耐热性和优异的尺寸稳定性。

公开(公告)号：EP1168436A3

公开(公告)日：2008-11-19

申请号：EP01305287.3

申请日：2001-06-18

Applicant: International Business Machines Corporation

Inventor： Berger, Daniel George ,  Farooq, Shaji ,  Herron, Lester Wynn ,  Humenik, James N. ,  Knickerbocker, John Ulrich ,  Pasco, Robert William ,  Perry, Charles H. ,  Sachdev, Krishna G.

IPC: H01L23/14 ,  H01L23/15 ,  H01L23/498

CPC classification number: H05K1/0373 ,  H01L21/4857 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0306 ,  H05K3/4611 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/068 ,  Y10S428/901 ,  Y10T428/24273 ,  Y10T428/24479 ,  Y10T428/24917 ,  Y10T428/24942 ,  Y10T428/249955 ,  Y10T428/249956 ,  Y10T428/251 ,  Y10T428/254 ,  Y10T428/259 ,  H01L2924/00

Abstract: A composite electronic and/or optical substrate including polymeric and ceramic material wherein the composite substrate has a dielectric constant less than 4 and a coefficient of thermal expansion of 8 to 14 ppm/ °C at 100°C. The composite substrate may be either ceramic- filled polymeric material or polymer-filled ceramic material.