公开(公告)号：EP2440024A4

公开(公告)日：2012-12-05

申请号：EP10783253

申请日：2010-05-18

Applicant: SUMITOMO ELECTRIC INDUSTRIES ,  SUMITOMO ELEC PRINTED CIRCUITS

Inventor： YAMAMOTO MASAMICHI ,  NAKATSUGI KYOUICHIROU ,  YAMAGUCHI TAKASHI ,  KAWAKAMI SHIGEKI ,  KIMURA MICHIHIRO

IPC: H05K3/32 ,  H05K3/28 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36

CPC classification number: H05K3/361 ,  C23F11/149 ,  H01L2924/0002 ,  H05K3/282 ,  H05K3/305 ,  H05K3/323 ,  H05K3/3431 ,  H05K3/4007 ,  H05K2201/0248 ,  H05K2201/0373 ,  H05K2201/094 ,  H05K2201/10977 ,  H05K2201/10992 ,  H05K2203/308 ,  Y10T156/10 ,  H01L2924/00

公开(公告)号：EP2481271A1

公开(公告)日：2012-08-01

申请号：EP10766401.3

申请日：2010-09-23

Applicant: 3M Innovative Properties Company

Inventor： KROPP, Karl, M. ,  HAYES, Earl, J.

IPC: H05K3/36

CPC classification number: H05K3/363 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2924/12032 ,  H01L2924/12041 ,  H05K1/141 ,  H05K1/189 ,  H05K3/3452 ,  H05K2201/10106 ,  H05K2201/10992 ,  Y10T29/49117 ,  H01L2924/00

Abstract: Electrical component assembly (30) comprising a first electrical component (32) comprising an electrical connection protrusion (34) (e.g., a solder bump) made of a first metal solder composition having a first melting point, and a second electrical component (36) comprising an electrical contact (38). A second metal solder composition (40) having a second melting point is formed or otherwise disposed so as to function as an electrical connection between at least a portion of the electrical connection protrusion (34) and the electrical contact (38) of the second electrical component (36). The second melting point is lower than the first melting point, and there is a distinct interface of demarcation between the electrical connection protrusion (34) and the second metal solder composition (40).

公开(公告)号：EP2453726A1

公开(公告)日：2012-05-16

申请号：EP11192441.1

申请日：2010-05-18

Applicant: Sumitomo Electric Industries, Ltd. ,  Sumitomo Electric Printed Circuits, Inc.

Inventor： Yamamoto, Masamichi ,  Nakatsugi, Kyouichirou ,  Yamaguchi, Takashi ,  Kawakami, Shigeki ,  Kimura, Michihiro

IPC: H05K3/32 ,  H05K3/36 ,  H05K3/34 ,  H05K3/28

CPC classification number: H05K3/361 ,  C23F11/149 ,  H01L2924/0002 ,  H05K3/282 ,  H05K3/305 ,  H05K3/323 ,  H05K3/3431 ,  H05K3/4007 ,  H05K2201/0248 ,  H05K2201/0373 ,  H05K2201/094 ,  H05K2201/10977 ,  H05K2201/10992 ,  H05K2203/308 ,  Y10T156/10 ,  H01L2924/00

Abstract: [Object] Provided are a connection method and an electronic device, in which the manufacturing process can be simplified, and a connection structure using an adhesive can be produced at low cost.
[Solution] A connection method according to the present invention includes a step (a2) of preparing a base material including an electrode (22) for connection using an adhesive (30) and an electrode (26) for connection using solder (50); a step (b2) of covering only the electrode (26) for connection using solder with an organic film (15) formed by OSP treatment or a noble metal plating film, the electrode for connection using solder being arranged on the base material; a step (c2) of joining the electrode (26) for connection using solder to a connection conductor (42) using solder by solder reflow treatment in a non-oxidizing atmosphere; and after the step (c2), a step (d2) of bonding the electrode (22) for connection using an adhesive to a connection conductor (12) with an adhesive (30) mainly containing a thermosetting resin to establish electrical connection.

Abstract translation: 提供了一种连接方法和电子设备，其中可以简化制造过程，并且可以以低成本生产使用粘合剂的连接结构。 [解决方案]根据本发明的连接方法包括制备包括用于使用粘合剂（30）连接的电极（22）和用于使用焊料（50）连接的电极（26）的基材的步骤（a2）。 仅使用焊料与OSP处理形成的有机膜（15）或贵金属电镀膜覆盖用于连接的电极（26）的工序（b2），使用焊料的连接用电极配置在基材上; 在非氧化气氛中通过焊料回流处理使用焊料将用于使用焊料连接的电极（26）连接到连接导体（42）的步骤（c2） 在步骤（c2）之后，用主要包含热固性树脂的粘合剂（30）将用粘合剂连接的电极（22）与连接导体（12）接合以建立电连接的步骤（d2）。

公开(公告)号：EP1729343B1

公开(公告)日：2011-11-30

申请号：EP06011142.4

申请日：2006-05-30

Applicant: HITACHI, LTD. ,  HITACHI HARAMACHI ELECTRONICS CO., LTD.

Inventor： Toyoda, Yasushi ,  Saito, Katsuaki ,  Koike, Yoshihiko ,  Ookubo, Shinji

IPC: H01L23/498 ,  H01L23/373

CPC classification number: H01L23/3735 ,  H01L23/24 ,  H01L23/488 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/80 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H05K3/3421 ,  H05K3/3463 ,  H05K2201/10992 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

公开(公告)号：EP1912484A1

公开(公告)日：2008-04-16

申请号：EP06768352.4

申请日：2006-07-21

Applicant: Sharp Kabushiki Kaisha

Inventor： KINOSHITA, Kazuo

IPC: H05K3/34 ,  H01L21/60 ,  H05K1/18

CPC classification number: H05K3/3436 ,  H01L24/11 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/351 ,  H05K3/3463 ,  H05K3/368 ,  H05K2201/094 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/048 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: The camera module structure (10) of the present invention, is a board electrode (2) formed on a printed board (1) and a mounting electrode (4) formed on a camera module (3) mounted on the printed board (1) being joined through a solder joint section (5), and the board electrode (2) and the mounting electrode (4) are aligned by self-alignment. The solder joint section (5) is composed of a first solder (6) and a second solder (7) having different characteristics. Thus, a solder mounting structure wherein a heavy-weight component is joined on the board with solder by self-alignment is provided.

Abstract translation: 本发明的照相机模块结构10是形成在印刷电路板1上的电路板电极2和形成在安装在印刷电路板1上的照相机模块3上的安装电极4， 通过焊接部分（5）接合，并且板电极（2）和安装电极（4）通过自对准而对齐。 焊接部分（5）由具有不同特性的第一焊料（6）和第二焊料（7）组成。 因此，提供了一种焊料安装结构，其中重量重的部件通过自对准与焊料接合在板上。

公开(公告)号：EP1009202B1

公开(公告)日：2007-10-17

申请号：EP98923088.3

申请日：1998-06-02

Applicant: IBIDEN CO., LTD.

Inventor： TSUKADA, Kiyotaka, Ibiden Co., Ltd., Gama Fact. ,  KOBAYASHI, Hiroyuki, Ibiden Co., Ltd., Gama Fact. ,  UKAI, Yoshikazu, Ibiden Co., Ltd., Gama Fact. ,  CHIHARA, Kenji, Ibiden Co., Ltd., Gama Fact. ,  TOHYAMA, Yoshihide, Ibiden Co., Ltd., Gama Fact, ,  OKUDA, Yasuyoshi, Ibiden Co., Ltd., Gama Fact. ,  KODERA, Yoshihiro, Ibiden Co., Ltd., Gama Fact.

IPC: H05K3/34

CPC classification number: H05K3/244 ,  B23K35/007 ,  B23K35/262 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0215 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T428/12028 ,  Y10T428/12701 ,  Y10T428/12708 ,  Y10T428/12875 ,  Y10T428/12903 ,  Y10T428/12944 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A soldering member for connection to an external unit, which is joined to a connection terminal having a nickel/gold electroless plating layer on the surface formed correspondingly to a conductor pattern on a printed wiring board. The member comprises a soldering ball containing finely powdered copper, and exhibits excellent strength of junction to the connection terminal.

公开(公告)号：EP1808265A1

公开(公告)日：2007-07-18

申请号：EP05805313.3

申请日：2005-10-27

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： MAEDA, Tadashi Matsushita Electric Industrial Co. ,  SAKAI, Tadahiko Matsushita Electric Industrial Co.

IPC: B23K35/363

CPC classification number: H05K3/3484 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/282 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/3613 ,  H05K3/3436 ,  H05K3/3463 ,  H05K3/3489 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/10992 ,  Y02P70/613

Abstract: It provides metal-powder-contained flux disposed between bumps and circuit electrodes when electronic parts are mounted by soldering, the metal powder comprises a core metal formed of metal such as tin and zinc and a surface metal covering surfaces of the core metal formed of noble metal such as gold and silver. Accordingly, metal powder will not remain as residue that is liable to cause migration after the reflow process, and it is possible to assure both soldering effect and insulation effect.

Abstract translation: 当通过焊接安装电子部件时，其提供设置在凸块和电路电极之间的金属粉末含量的金属，金属粉末包括由诸如锡和锌的金属形成的芯金属和由贵金属形成的芯金属的表面金属覆盖表面 金属如金和银。 因此，金属粉末不会残留在回流处理后容易引起迁移的残留物，并且可以确保焊接效果和绝缘效果。

公开(公告)号：EP1503414A3

公开(公告)日：2007-05-30

申请号：EP04077135.4

申请日：2004-07-23

Applicant: CTS Corporation

Inventor： Bloom, Terry R.

IPC: H01L23/498 ,  H01L21/60 ,  H01C1/012

CPC classification number: H01C1/144 ,  H01G4/232 ,  H01L21/486 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2224/16237 ,  H01L2924/01019 ,  H01L2924/19041 ,  H05K3/321 ,  H05K3/3436 ,  H05K2201/10234 ,  H05K2201/10992 ,  H05K2203/041 ,  Y02P70/613

Abstract: A ball grid array package includes a substrate with a top and bottom surface. A circuit component is located on the bottom surface. The circuit component has a pair of ends. A pair of conductors are located on the bottom surface. The conductors are connected to the ends of the circuit component. A conductive epoxy covers a portion of the conductors and a portion of the bottom surface. The conductive epoxy is in electrical contact with the conductors. A ball is connected to the conductive epoxy. The conductive epoxy provides an electrical connection between the conductor and the ball. The ball is preferably copper and is subsequently coated to prevent corrosion. Other embodiments of the invention are shown in which the balls are omitted and in which the conductive epoxy is used to fill vias in a substrate.

公开(公告)号：EP1331707B1

公开(公告)日：2006-04-26

申请号：EP03001226.4

申请日：2003-01-20

Applicant: FCI

Inventor： Keller, Rex W.

IPC: H01R43/02 ,  H05K3/34 ,  H01L23/485

CPC classification number: H01R43/0256 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2924/15311 ,  H01R4/027 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0367 ,  H05K2201/10378 ,  H05K2201/10992 ,  H05K2203/048 ,  Y02P70/613

公开(公告)号：EP1003358B1

公开(公告)日：2005-06-01

申请号：EP99122724.0

申请日：1999-11-16

Applicant: Grundig Multimedia B.V.

Inventor： Weidel, Günther

IPC: H05K3/32 ,  H05K3/34

CPC classification number: H05K3/3447 ,  H05K3/321 ,  H05K2201/1003 ,  H05K2201/10083 ,  H05K2201/10166 ,  H05K2201/10977 ,  H05K2201/10992