公开(公告)号：EP2048918A1

公开(公告)日：2009-04-15

申请号：EP07118109.3

申请日：2007-10-09

Applicant: Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO

Inventor： The designation of the inventor has not yet been filed

IPC: H05K1/00

CPC classification number: H05K3/0058 ,  H05K1/0284 ,  H05K1/0393 ,  H05K3/0014 ,  H05K2201/056 ,  H05K2201/091 ,  H05K2201/09263 ,  H05K2203/1327

Abstract: Method for providing a conductive pattern (5) on a plastic component (2) having one or more not-flat areas (3a), comprising providing the conductive pattern on a mainly flat carrier (4), the conductive pattern comprising, for each area (3b) which corresponds to such non-flat area of the plastic component, a pattern area having an extendable shape or design. Next, putting the carrier, including its conductive pattern and one or more extendable sub-patterns, into or onto a mold (1) which is arranged for molding the plastic component. Finally, performing a molding operation in which, in any order, the plastic component is formed and the carrier is, at least partly, shaped in accordance with any not-flat area of the component, the relevant sub-pattern being stretched in accordance with that not-flat area. The extendable sub-pattern may have, at least partly, e.g. a meandering form or the form of an extendable grid.

Abstract translation: 一种用于在具有一个或多个不平坦区域（3a）的塑料部件（2）上提供导电图案（5）的方法，包括在主要平坦的载体（4）上提供所述导电图案，所述导电图案包括针对每个区域 （3b），其对应于塑料部件的这种非平坦区域，图案区域具有可延伸的形状或设计。 接下来，将载体（包括其导电图案和一个或多个可延伸的子图案）放置在用于模制塑料部件的模具（1）中或上方。 最后，进行成型操作，其中以任何顺序形成塑料部件，并且载体至少部分地根据部件的任何不平坦的区域成形，相关的子图案根据 那个不平坦的地区。 可延伸的子图案可以至少部分地具有例如， 曲折形式或可扩展网格的形式。

公开(公告)号：EP1996860A2

公开(公告)日：2008-12-03

申请号：EP07762789.1

申请日：2007-01-26

Applicant: 3M Innovative Properties Company

Inventor： SCHULTZ, John, C. ,  OUDERKIRK, Andrew, J. ,  PEIFFER, Joel, S. ,  O'BRYAN, Nelson, B., Jr. ,  WHEATLEY, John, A. ,  MURRAY, Cameron, T.

IPC: F21V29/00 ,  H05K1/05 ,  H05K1/02

CPC classification number: H05K1/189 ,  F21K9/00 ,  G02F1/133603 ,  G02F2001/133628 ,  H01L2224/48091 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/07811 ,  H01L2924/3011 ,  H05K1/0203 ,  H05K1/0373 ,  H05K1/0393 ,  H05K3/0061 ,  H05K3/386 ,  H05K2201/0209 ,  H05K2201/091 ,  H05K2201/09363 ,  H05K2201/10106 ,  Y10S362/80 ,  H01L2924/00 ,  H01L2224/4554

Abstract: An illumination assembly (10) includes a compliant substrate (30) comprising a first and second electrically conductive foil (32,36) separated by an electrically insulating layer (40). The insulating layer includes a polymer material (43) loaded with particles (42) that enhance thermal conductivity of the insulating layer. A plurality of LED dies (20) are disposed on the first conductive foil (32).

Abstract translation: 照明组件包括柔性衬底，其包括由电绝缘层分隔的第一和第二导电箔。 绝缘层包括负载有提高绝缘层导热性的颗粒的聚合物材料。 多个LED管芯设置在第一导电箔上。

公开(公告)号：EP1988759A1

公开(公告)日：2008-11-05

申请号：EP06712994.0

申请日：2006-02-03

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： MUKAE, Hidetsugu, c/o Matsushita Electric Ind. Co., Ltd. ,  SUZUKI, Hiroyuki, c/o Matsushita El. Ind. Co., Ltd., Int. Prop. Rights Op. Co., Ltd.

IPC: H05K1/14

CPC classification number: H05K3/361 ,  H05K2201/091 ,  H05K2201/09781 ,  H05K2201/2009 ,  H05K2203/0278

Abstract: To provide a connecting portion of a circuit board and a circuit board-connecting structure, in which connecting portions can be positively connected together, and also a connecting process can be simplified.
In a circuit board-connecting portion 10, a first connecting portion 15 and a second connecting portion 20 are disposed in facing relation such that first conductors 14 contact second conductors 19, and also a first substrate 12 and a second substrate 17 are fixed to each other by an adhesive 22. The first connecting portion 15 has rigid members 24 provided at a reverse surface 12B of the first substrate 12 which is a soft substrate, and the rigid members 24 are disposed along a direction of a thickness of the first substrate 14, and are provided at positions corresponding to at least parts 14A of the first conductors 14.

Abstract translation: 为了提供电路板和电路板连接结构的连接部分，其中连接部分可以牢固地连接在一起，并且还可以简化连接过程。 在电路板连接部分10中，以第一导体14接触第二导体19的方式设置第一连接部分15和第二连接部分20，并且将第一基板12和第二基板17固定到每个 第一连接部分15具有设置在作为软质基板的第一基板12的反面12B处的刚性构件24，并且刚性构件24沿着第一基板14的厚度方向 并且设置在与第一导体14的至少14A部相对应的位置处。

公开(公告)号：EP1771051B1

公开(公告)日：2008-02-27

申请号：EP05021506.0

申请日：2005-09-30

Applicant: Delphi Technologies, Inc.

Inventor： Gärtner, Markus ,  Schmitz, Klaus Dieter

IPC: H05K3/32 ,  H01R12/04

CPC classification number: H01R12/58 ,  H01R12/592 ,  H01R13/41 ,  H01R43/205 ,  H05K3/308 ,  H05K3/326 ,  H05K2201/091 ,  H05K2201/09118 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2201/10787

公开(公告)号：EP1429589A3

公开(公告)日：2006-09-27

申请号：EP03028364.2

申请日：2003-12-10

Applicant: Marquardt GmbH

Inventor： Neitzel, Roland ,  Stegerwald, Gerhard

IPC: H05K3/32 ,  H05K1/11 ,  H01R12/38

CPC classification number: H01R12/585 ,  H05K1/118 ,  H05K3/0064 ,  H05K3/301 ,  H05K3/306 ,  H05K3/308 ,  H05K3/326 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/1059 ,  H05K2201/10598 ,  H05K2201/10856 ,  H05K2201/2009 ,  H05K2203/1327

Abstract: Die Erfindung betrifft einen Schaltungsträger (3) für eine elektrische Schaltung, insbesondere in der Art einer wenigstens teilweise flexiblen Leiterplatte. Der Schaltungsträger (3) weist elektrische, elektronische o. dgl. Bauteile (2), wie einen Elektromotor (2a), Schalter (2b), Widerstand, Kondensator, Spule, IC, Steckanschluß o. dgl. auf. Weiter besitzt der Schaltungsträger (3) Leiterbahnen zur elektrischen Verbindung der Bauteile (2) sowie Kontaktflächen (5) zur elektrischen Kontaktierung der Bauteile (2). Die Kontaktfläche (5) ist wenigstens teilweise in der Ebene des Schaltungsträgers (3) freigeschnitten, derart daß die Kontaktfläche (5) eine Flexibilität in eine außerhalb der Ebene (6) des Schaltungsträgers (3) verlaufende Richtung aufweist, insbesondere in der Art einer Kontaktzunge. Ein Kontaktelement (8) zur elektrischen Kontaktierung des Bauteils (2) liegt mit einem Anpreßdruck derart an der Kontaktfläche (5) an, daß die Kontaktfläche (5) aus der Ebene (6) des Schaltungsträgers (3) ausgelenkt ist.

公开(公告)号：EP1668698A1

公开(公告)日：2006-06-14

申请号：EP04766823.1

申请日：2004-09-17

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： VON GENTZKOW, Wolfgang ,  HEINL, Dieter

IPC: H01L23/373 ,  H01L23/367

CPC classification number: H05K1/0203 ,  C09K5/14 ,  H01L23/3737 ,  H01L2924/0002 ,  H05K3/0064 ,  H05K2201/0209 ,  H05K2201/091 ,  H01L2924/00

Abstract: The invention relates to a cooling body for electric and/or electronic components, in particular printed circuit boards. The cooling body consists of a chemically uniform material, whose exterior is cross-linked and which is thus poorly or non-adhesive and whose interior can be plastically deformed and thus adapted to the contours of the components or printed circuit boards. The cooling body can be cured by thermal post-cross-linking.

公开(公告)号：EP1661053A2

公开(公告)日：2006-05-31

申请号：EP04780522.1

申请日：2004-08-06

Applicant: Shapira, Shmuel

Inventor： Shapira, Shmuel

IPC: G06K1/00

CPC classification number: H05K3/041 ,  H05K1/165 ,  H05K3/107 ,  H05K3/28 ,  H05K3/386 ,  H05K2201/0382 ,  H05K2201/09036 ,  H05K2201/091 ,  H05K2203/0108 ,  H05K2203/1476 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: A system and method of forming a circuit. The system and method includes layering an impressionable material and a conductive material, defining adjacent charge paths on the conductive material, and shaping the impressionable material to increase a gap between adjacent charge paths.

公开(公告)号：EP1429589A2

公开(公告)日：2004-06-16

申请号：EP03028364.2

申请日：2003-12-10

Applicant: Marquardt GmbH

Inventor： Neitzel, Roland ,  Stegerwald, Gerhard

IPC: H05K3/32 ,  H05K1/11 ,  H01R12/38

CPC classification number: H01R12/585 ,  H05K1/118 ,  H05K3/0064 ,  H05K3/301 ,  H05K3/306 ,  H05K3/308 ,  H05K3/326 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/1059 ,  H05K2201/10598 ,  H05K2201/10856 ,  H05K2201/2009 ,  H05K2203/1327

Abstract: Die Erfindung betrifft einen Schaltungsträger (3) für eine elektrische Schaltung, insbesondere in der Art einer wenigstens teilweise flexiblen Leiterplatte. Der Schaltungsträger (3) weist elektrische, elektronische o. dgl. Bauteile (2), wie einen Elektromotor (2a), Schalter (2b), Widerstand, Kondensator, Spule, IC, Steckanschluß o. dgl. auf. Weiter besitzt der Schaltungsträger (3) Leiterbahnen zur elektrischen Verbindung der Bauteile (2) sowie Kontaktflächen (5) zur elektrischen Kontaktierung der Bauteile (2). Die Kontaktfläche (5) ist wenigstens teilweise in der Ebene des Schaltungsträgers (3) freigeschnitten, derart daß die Kontaktfläche (5) eine Flexibilität in eine außerhalb der Ebene (6) des Schaltungsträgers (3) verlaufende Richtung aufweist, insbesondere in der Art einer Kontaktzunge. Ein Kontaktelement (8) zur elektrischen Kontaktierung des Bauteils (2) liegt mit einem Anpreßdruck derart an der Kontaktfläche (5) an, daß die Kontaktfläche (5) aus der Ebene (6) des Schaltungsträgers (3) ausgelenkt ist.

Abstract translation: 电路载体的接触表面（5）在电路载体（3）的平面中至少部分地被切割，使得接触表面在延伸到电路载体的平面外的方向上具有柔性，形式为 接触舌头 接触构件（8）使用导致接触表面偏离电路载体的平面的压力抵靠接触表面以接触部件（2）。 包括用于制造电路载体的方法的独立权利要求。

公开(公告)号：EP0800754B1

公开(公告)日：2004-03-10

申请号：EP95933164.6

申请日：1995-09-20

Applicant: TESSERA, INC.

Inventor： KOVAC, Zlata ,  MITCHELL, Craig ,  DISTEFANO, Thomas

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/30 ,  H01L21/60 ,  H01R4/58 ,  H01L21/56

CPC classification number: H01L24/81 ,  H01L21/56 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/72 ,  H01L24/75 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49174 ,  H01L2924/00014

Abstract: A method and an apparatus for providing a planar and compliant interface between a semiconductor chip (120) and its supporting substrate to accommodate for the thermal coefficient of expansion mismatch therebetween. The compliant interface is comprised of a plurality of compliant pads (110) defining channels (117) between adjacent pads. The pads are typically compressed between a flexible film chip carrier (100) and the chip. A compliant filler (170) is further disposed within the channels to form a uniform encapsulation layer having a controlled thickness.

公开(公告)号：EP1112530A1

公开(公告)日：2001-07-04

申请号：EP99900049.0

申请日：1999-01-14

Applicant: DYCONEX PATENTE AG

Inventor： SCHMIDT, Walter

IPC: G03F7/00 ,  H05K3/00

CPC classification number: H05K3/005 ,  G03F7/0017 ,  H05K3/4084 ,  H05K3/4644 ,  H05K3/4652 ,  H05K2201/091 ,  H05K2203/0108 ,  H05K2203/0195 ,  H05K2203/1189 ,  Y10T29/49165 ,  Y10T83/944

Abstract: The invention relates to a method for producing micro-openings in semi-finished products (300) for printed boards using prefabricated elements (200) consisting of several layers of electrically conductive materials (21, 22) and dielectrics (20). According to said method micro-openings are embossed in dielectrics and/or electrically conductive materials and the embossed micro-openings are cleaned using plasma or by means of wet-chemical methods.