公开(公告)号：EP1087869A1

公开(公告)日：2001-04-04

申请号：EP98960519.1

申请日：1998-11-27

Applicant: Polyeitan Composites Ltd.

Inventor： COHEN, Yachin ,  REIN, Dimitri ,  VAYKHANSKY, Lev

IPC: B32B27/00 ,  B32B27/12 ,  D03D3/00 ,  D03D15/00 ,  D03D17/00 ,  D03D25/00

CPC classification number: H05K1/0366 ,  B32B27/02 ,  C08J5/04 ,  H05K1/028 ,  H05K1/032 ,  H05K1/0393 ,  H05K2201/0129 ,  H05K2201/0158 ,  H05K2201/0278 ,  H05K2201/0287 ,  H05K2201/0293 ,  H05K2203/1105 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/249941 ,  Y10T428/249942 ,  Y10T428/31681 ,  Y10T442/3415 ,  Y10T442/656

Abstract: An ultrahigh molecular weight polyethylene (UHMWPE) composite (12) for use in printed circuit board or antenna base material. A base material includes at least one dielectric layer which comprises of an ultrahigh molecular weight polyethylene composite (12) and at least one electroconductive layer (16) which comprises of an electroconductive material; the dielectric and electroconductive layers being intimately bonded to one another.

公开(公告)号：EP1019246A1

公开(公告)日：2000-07-19

申请号：EP98949433.1

申请日：1998-09-23

Applicant: Fibermark, Inc.

Inventor： KEMPF, Ulrich

IPC: B32B5/00 ,  B32B5/08

CPC classification number: D21H21/54 ,  B32B27/04 ,  C08J5/24 ,  D21H13/24 ,  D21H13/40 ,  D21H17/52 ,  D21H25/06 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2201/0254 ,  H05K2201/0278 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/249994 ,  Y10T428/25 ,  Y10T428/27 ,  Y10T428/2933 ,  Y10T428/2962 ,  Y10T428/31663

Abstract: A pre-preg substrate, having a low dielectric constant and containing a substantially uniformly distributed hollow-glass-microsphere filler, and method for making the same. The pre-preg substrate is treated with impregnation and lamination techniques to form a laminate with a low dielectric constant, and good mechanical and electrical properties, suitable as a base material for surface mounted devices in high performance circuits. Improved pre-pregs for making high performance circuit boards and for making surface mounted integrated circuits. Improved high performance circuit boards for making surface mounted integrated circuits.

公开(公告)号：EP0998608A1

公开(公告)日：2000-05-10

申请号：EP98935805.6

申请日：1998-07-20

Applicant: E.I. DU PONT DE NEMOURS AND COMPANY

Inventor： KIRAYOGLU, Birol ,  POWELL, David, Jeffrey

IPC: D21H13/26 ,  D21H25/04

CPC classification number: D21H13/26 ,  D21H25/04 ,  H05K1/0366 ,  H05K2201/0278 ,  H05K2201/0293

Abstract: A process for increasing the solvent resistance of calendered paper consisting of poly(p-phenylene terephthalamide) short fibers and poly(m-phenylene isophthalamide) fibrids and the dimensional stability of laminates made therefrom.

公开(公告)号：EP0915125A2

公开(公告)日：1999-05-12

申请号：EP98120989.3

申请日：1998-11-05

Applicant: OJI PAPER CO., LTD.

Inventor： Kato, Yoshihisa ,  Adachi, Takekazu ,  Murata, Mamoru

IPC: C08J5/24 ,  C08J5/04 ,  B32B27/02

CPC classification number: B32B5/26 ,  B32B5/022 ,  B32B5/28 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2457/08 ,  C08J5/048 ,  C08J5/24 ,  C08J2361/06 ,  H05K1/0366 ,  H05K2201/0145 ,  H05K2201/0166 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2203/1105 ,  Y10T428/12569 ,  Y10T428/31594 ,  Y10T428/31725

Abstract: The present invention relates to a method of producing a laminate base material useful for preparing a prepreg or a laminate for electronic equipment such as printed board. The method comprises the steps of:

(1) preparing a slurry comprising para-aramid fibers and curable phenolic resin fibers;
(2) preparing a sheet from said slurry;
(3) adding a resin binder to said sheet so as to bond the fibers with each other, thereby to form a combined non-woven fabric and
(4) compressing said non-woven fabric under heating.

According to the present invention, a prepreg or laminate is obtained which has an improved high-frequency characteristics and much less warp.

Abstract translation: 本发明涉及一种制造层压基材的方法，所述层压基材用于制备用于诸如印刷板的电子设备的预浸料或层压体。 该方法包括以下步骤：（1）制备包含对位芳族聚酰胺纤维和可固化酚醛树脂纤维的浆料; （2）由所述浆料制备片材; （3）在所述片材中加入树脂粘合剂以将纤维相互粘合，从而形成组合的无纺织物，和（4）在加热下压缩所述无纺织物。 根据本发明，获得具有改善的高频特性和更小的翘曲的预浸料或层压材料。

公开(公告)号：EP0902608A1

公开(公告)日：1999-03-17

申请号：EP98500198.1

申请日：1998-09-07

Applicant: Aismalibar, S.A.

Inventor： Balsells Coca, Felip ,  Rodriguez Siurana, Antonio

IPC: H05K1/03 ,  B32B17/04

CPC classification number: B29C70/081 ,  B29C70/885 ,  H05K1/036 ,  H05K1/0366 ,  H05K2201/0293 ,  Y10T428/31511 ,  Y10T428/31518 ,  Y10T428/31522 ,  Y10T442/3488 ,  Y10T442/3602

Abstract: It includes two outer sheets (1,3) of continuous-strand fibreglass fabric and a core (2) of non-woven fibreglass formed by sheets (4,5) of fibreglass paper, all sheets being impregnated with epoxy resin, and presenting at least one sheet of conducting material (8), on one or both outer sides; it is characterized in that it incorporates in the non-woven fibreglass core (2) at least one intermediate sheet (6,7) of fibreglass fabric impregnated with resin.
It allows manufacturing of reliable printed circuits, even when using surface-mounted components, while at the same time its cost is relatively low; it is particularly suitable for the field of consumer and semi-professional electronics.

Abstract translation: 它包括两条连续股玻璃纤维织物外层片（1,3）和由玻璃纤维纸片（4,5）形成的无纺玻璃纤维芯（2），所有片材都浸渍有环氧树脂，并呈现在 在一个或两个外侧上的至少一片导电材料（8）; 其特征在于，其在无纺玻璃纤维芯（2）中包含浸渍有树脂的玻璃纤维织物的至少一个中间片（6,7）。 即使在使用表面安装元件的同时，也可以制造可靠的印刷电路，同时其成本相对较低; 它特别适用于消费电子和半专业电子领域。

公开(公告)号：EP0870795A1

公开(公告)日：1998-10-14

申请号：EP98106480.1

申请日：1998-04-08

Applicant: Sumitomo Chemical Company, Limited

Inventor： Takahashi, Tsutomu ,  Kumada, Hiroaki

IPC: C08J5/18 ,  C08J5/04 ,  C08J5/24 ,  C08J9/28 ,  H05K1/03

CPC classification number: C08J5/18 ,  C08J5/04 ,  C08J2377/10 ,  C08L77/10 ,  H05K1/024 ,  H05K1/0366 ,  H05K2201/0129 ,  H05K2201/015 ,  H05K2201/0166 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T428/249958 ,  Y10T442/3854 ,  Y10T442/3878 ,  Y10T442/3894 ,  C08L25/00

Abstract: Provided is a composite film comprising a continuous phase of para-oriented aromatic polyamide and a phase of low-dielectric resin, said film having a dielectric constant at 1 MHz of not more than 3.2 and a linear thermal expansion coefficient at 200 to 300°C of within ±50×10 -6 /°C. The composite film has characteristics such as a low dielectric constant, favorable mechanical strength, homogeneous structure, light weight, and a low linear thermal expansion coefficient, and the film is useful as a base substrate for a flexible printed circuit board.

Abstract translation: 本发明提供一种复合膜，其包含对位取向芳香族聚酰胺的连续相和低介电树脂的相，所述在1 MHz的不大于3.2，并在200的线性热膨胀系数，以300℃的膜具有介电常数 的内50×10 +/- <-6> /℃。该复合膜具有如下特性：如低介电常数，良好的机械强度，均匀的结构，重量轻，并具有低线性热膨胀系数，并且膜是有用 用于柔性印刷电路板的基底基板。

公开(公告)号：EP0707038B1

公开(公告)日：1998-08-05

申请号：EP95114852.7

申请日：1995-09-21

Applicant: ROGERS CORPORATION

Inventor： St. Lawrence, Michel E. ,  Landi, Vincent R. ,  Hand, Doris I. ,  Walker, Robert H. ,  Gazit, Samuel ,  Miskiavitch, Raymond R.

IPC: C08L9/00 ,  H05K1/03

CPC classification number: C08J5/24 ,  C08J2309/00 ,  C08K3/22 ,  C08K3/34 ,  C08K3/40 ,  C08K5/0066 ,  C08K7/14 ,  C08L7/00 ,  C08L9/00 ,  C08L9/02 ,  C08L9/06 ,  C08L15/00 ,  C08L23/04 ,  C08L53/00 ,  H05K1/0203 ,  H05K1/032 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/162 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/029 ,  H05K2201/0293 ,  Y10T442/3431 ,  Y10T442/3569 ,  C08L2666/06 ,  C08L2666/08 ,  C08L2666/24

公开(公告)号：EP0740013A4

公开(公告)日：1998-07-08

申请号：EP95938007

申请日：1995-11-15

Applicant: MITSUBISHI GAS CHEMICAL CO ,  JAPAN VILENE CO LTD

Inventor： KINBARA HIDENORI ,  NOZAKI MITSURU ,  MIZOGUCHI MASANOBU ,  KIMURA KOJI ,  SHIMONO NAOHIKO

IPC: C08J5/04 ,  C08J5/24 ,  D04H1/42 ,  D04H1/46 ,  D04H1/48 ,  D04H1/58 ,  D04H1/64 ,  D04H13/00 ,  H05K1/03 ,  D06M10/02 ,  C08J5/06 ,  D04H1/54

CPC classification number: C08J5/046 ,  B32B5/28 ,  C08J5/24 ,  D04H1/435 ,  D04H1/48 ,  D04H1/49 ,  D04H1/587 ,  D04H1/64 ,  H05K1/0366 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2203/1105 ,  Y10S428/901 ,  Y10T428/31 ,  Y10T428/31786 ,  Y10T442/689

Abstract: A sheet for a laminate comprising an unwoven fabric composed mainly of a liquid crystal polyester fiber subjected to processes for (1) cohesion, (2) adhesion to a thermosetting resin and (3) surface modification. Such sheets are impregnated with a thermosetting resin and dried to form prepregs for laminates. The sheet has a low dielectric constant, low hygroscopicity, strong adhesion and light weight, and it is easily impregnated with thermosetting resin.

公开(公告)号：EP0790341A2

公开(公告)日：1997-08-20

申请号：EP97301038.2

申请日：1997-02-18

Applicant: TEIJIN LIMITED

Inventor： Murayama, Sadamitsu, c/o Teijin Limited

IPC: D04H1/42 ,  D04H1/60

CPC classification number: H05K1/0366 ,  D04H1/4342 ,  D04H1/60 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T442/2902 ,  Y10T442/697

Abstract: A wholly aromatic polyamide staple fiber fabric having excellent insulation and superior dimensional stability at a high temperature and/or a high humidity, includes 70 to 96 parts by weight of a staple fiber web made from a blend of 5 to 30% by weight of m-type wholly aromatic polyamide staple fibers and 70 to 95% by weight of p-type wholly aromatic polyamide staple fibers, and 4 to 30 parts by weight of an organic resin binder incorporated into the staple fiber web.

Abstract translation: 在高温和/或高湿度下具有优异的绝缘性和优异的尺寸稳定性的全芳族聚酰胺短纤维织物包括70至96重量份由5至30重量％的m 型全芳族聚酰胺短纤维和70〜95重量％的p型全芳香族聚酰胺短纤维，以及4〜30重量份结合到短纤维网中的有机树脂粘合剂。

公开(公告)号：EP0692177B1

公开(公告)日：1997-04-09

申请号：EP94912846.6

申请日：1994-03-28

Applicant: E.I. DU PONT DE NEMOURS AND COMPANY

Inventor： KIRAYOGLU, Birol ,  SULLIVAN, William, John ,  ZUSSMAN, Melvin, Paul

IPC: H05K1/03 ,  D21H13/26

CPC classification number: H05K1/0366 ,  B32B27/04 ,  D04H1/4342 ,  D21H13/26 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2201/068 ,  Y10S428/901 ,  Y10T428/24994 ,  Y10T442/2902 ,  Y10T442/656

Abstract: Dimensionally stable resin impregnated laminates for printed wiring board applications are reinforced with from 43 to 57 weight percent of nonwoven aramid sheet having a coefficient of thermal expansion of less than 10 ppm per °C, a basis weight of from 0.8 to 4.0 oz/yd2, a density of from 0.5 to 1.0 g/cc and a Gurley Hill Porosity of less than 10 sec.