公开(公告)号：EP2993965A1

公开(公告)日：2016-03-09

申请号：EP14192956.2

申请日：2014-11-13

Applicant: LG Display Co., Ltd.

Inventor： Lee, Sunghoon

IPC: H05K1/02

CPC classification number: G06F3/041 ,  G06F2203/04102 ,  H05K1/0281 ,  H05K1/118 ,  H05K1/148 ,  H05K3/361 ,  H05K2201/052 ,  H05K2201/058 ,  H05K2201/09781 ,  H05K2201/1034 ,  H05K2201/10356 ,  H05K2201/2009

Abstract: There are provided a flexible printed circuit board having enhanced peeling force and a touch panel including the same. The flexible printed circuit board (FPCB) includes a first bonding portion and a second bonding portion respectively bonded to a first circuit unit and a second circuit unit. The first bonding portion includes a pad corresponding portion corresponding to pads of the first circuit unit and dummy portions outwardly extending from both end portions of the pad corresponding portion. An FPCB wiring formation portion includes FPCB wirings respectively connected to the pads and extending from the first bonding portion to the second bonding portion and concave portions respectively disposed to be adjacent to the dummy portions and having a curved surface.

Abstract translation: 提供了具有增强的剥离力的柔性印刷电路板和包括该柔性印刷电路板的触摸面板。 柔性印刷电路板（FPCB）包括分别接合到第一电路单元和第二电路单元的第一接合部分和第二接合部分。 第一接合部分包括对应于第一电路单元的焊盘的焊盘对应部分和从焊盘对应部分的两个端部向外延伸的虚拟部分。 FPCB布线形成部分包括分别连接到焊盘并且从第一接合部分延伸到第二接合部分的FPCB布线和分别设置成与虚设部分相邻并具有弯曲表面的凹部。

公开(公告)号：EP2269216B1

公开(公告)日：2014-12-24

申请号：EP09721759.0

申请日：2009-03-19

Applicant: ATI Technologies ULC

Inventor： TOPACIO, Roden ,  ZBRZEZNY, Adam

IPC: H01L21/60 ,  H01L23/498 ,  H05K1/02 ,  H05K3/34

CPC classification number: H01L23/3128 ,  H01L23/16 ,  H01L23/562 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K3/3452 ,  H05K3/3457 ,  H05K2201/09136 ,  H05K2201/09781 ,  H05K2203/043 ,  H01L2924/014 ,  H01L2924/00014

公开(公告)号：EP2624672A4

公开(公告)日：2014-11-26

申请号：EP10857880

申请日：2010-10-01

Applicant: MEIKO ELECTRONICS CO LTD

Inventor： IMAMURA YOSHIO ,  MATSUMOTO TOHRU ,  SHIMIZU RYOICHI

IPC: H05K1/18 ,  H05K1/02

CPC classification number: H05K13/0023 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/544 ,  H01L2221/68359 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/04105 ,  H01L2224/26175 ,  H01L2224/32245 ,  H01L2224/83005 ,  H01L2224/83132 ,  H05K1/0269 ,  H05K1/16 ,  H05K1/188 ,  H05K2201/09781 ,  H05K2201/09918

公开(公告)号：EP2786592A2

公开(公告)日：2014-10-08

申请号：EP12821118.2

申请日：2012-11-28

Applicant: Soundchip SA

Inventor： DARLINGTON, Paul ,  DONALDSON, Mark

IPC: H04R1/06 ,  H04R11/02 ,  H01R12/71 ,  H04R25/00 ,  H04R31/00 ,  H05K3/30

CPC classification number: H04R1/06 ,  H04R11/02 ,  H04R25/604 ,  H04R25/608 ,  H04R2400/13 ,  H05K1/0272 ,  H05K3/30 ,  H05K3/3431 ,  H05K2201/09072 ,  H05K2201/09781 ,  H05K2201/10083

Abstract: An electro-acoustic transducer (100) comprising: a body (110) defining a mounting surface (114) for mounting the electro-acoustic transducer (100) on a substrate and an opening (120) for allowing sound to enter or exit the body (110); a diaphragm (132) mounted in the body (110); and a compression chamber (118) located between the diaphragm (132) and the opening (120); wherein the opening (120) is located on the mounting surface (114).

Abstract translation: 一种电声换能器（100），包括：主体（110），其限定用于将电声换能器（100）安装在基板上的安装表面（114）和用于允许声音进入或离开身体的开口（120） （110）; 安装在所述主体（110）中的隔膜（132）; 和位于隔膜（132）和开口（120）之间的压缩室（118）。 其中所述开口（120）位于所述安装表面（114）上。

公开(公告)号：EP2742784A1

公开(公告)日：2014-06-18

申请号：EP12778423.9

申请日：2012-08-30

Applicant: Koninklijke Philips N.V.

Inventor： DINGEMANS, Antonius Petrus Marinus

IPC: H05K3/20 ,  H05K1/02 ,  H05K3/00

CPC classification number: H05K3/303 ,  F21K9/90 ,  F21V21/002 ,  H01L25/0753 ,  H01L27/153 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/0209 ,  H05K1/0283 ,  H05K1/0284 ,  H05K1/05 ,  H05K3/0058 ,  H05K3/0097 ,  H05K3/202 ,  H05K13/046 ,  H05K2201/09263 ,  H05K2201/09781 ,  H05K2201/10106 ,  H05K2203/04 ,  H05K2203/1545 ,  H05K2203/175 ,  Y10T29/49144 ,  H01L2924/00

Abstract: There is provided a method for manufacturing a component interconnect board (150) comprising a conductor structure for providing electrical circuitry to at least one component (114) when mounted on the component board, the method comprising providing a conductor sheet (100) with a first predetermined pattern (115), providing a solder resist sheet (112) with a second predetermined pattern for defining solder areas (125) of the component board, forming a subassembly (120) by laminating the solder resist sheet on top of the conductor sheet, applying solder onto the subassembly, placing the at least one component onto the subassembly, performing soldering, and laminating the subassembly to a substrate (130). The solder resist sheet is further arranged to act as a carrier for the conductor sheet.

公开(公告)号：EP2719263A1

公开(公告)日：2014-04-16

申请号：EP12719714.3

申请日：2012-05-08

Applicant: ZF Friedrichshafen AG

Inventor： LASSMANN, Wilfried ,  BÜTTNER, Christian

IPC: H05K1/02 ,  H05K3/46 ,  H05K5/00

CPC classification number: H05K1/115 ,  H05K1/0201 ,  H05K1/0206 ,  H05K1/0207 ,  H05K3/4608 ,  H05K5/0082 ,  H05K2201/09309 ,  H05K2201/09663 ,  H05K2201/09781

Abstract: The invention proposes a printed circuit board (100) having a plurality of layers, which have at least one outer layer (110, 120) and at least one inner layer (130, 140) adjoining the outer layer (110, 120). The printed circuit board (100) has a plurality of micro throughplatings (170), which are formed between a supply voltage area of the at least one outer layer (110, 120) and a supply voltage area of the at least one inner layer (130, 140).

公开(公告)号：EP2188849A4

公开(公告)日：2013-10-16

申请号：EP08793182

申请日：2008-08-11

Applicant: LG INNOTEK CO LTD

Inventor： PARK JUN SEOK

IPC: H01L33/64 ,  H05K1/02

CPC classification number: H01L33/641 ,  H01L33/642 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2924/00011 ,  H05K1/0206 ,  H05K1/0209 ,  H05K2201/0209 ,  H05K2201/09318 ,  H05K2201/09663 ,  H05K2201/09781 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01049

公开(公告)号：EP2494598A1

公开(公告)日：2012-09-05

申请号：EP10737421.7

申请日：2010-07-15

Applicant: Xilinx, Inc.

Inventor： WYLAND, Christopher, P.

IPC: H01L23/66

CPC classification number: H01L23/66 ,  H01L23/64 ,  H01L2223/6616 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0251 ,  H05K1/116 ,  H05K2201/09463 ,  H05K2201/09781 ,  H05K2201/09809 ,  H01L2924/00

Abstract: Vias (106) are typically of a lower impedance than the signal lines (102, 128) connected to them. The noise and reflected signals resulting in impedance mismatch may require circuits to be operated at a frequency far lower than desired. An embodiment avoids impedance mismatch in circuits and achieves an advance in the art by providing a via (106) with higher impedance through the addition of split ring resonators (104, 112, 120, 126) to each end of the via (106).

公开(公告)号：EP2227897B1

公开(公告)日：2012-09-05

申请号：EP08861652.9

申请日：2008-12-16

Applicant: OmniVision Technologies, Inc.

Inventor： HILTUNEN, Jari ,  MONTANDON, Ian

IPC: H04N5/225 ,  H04N5/335

CPC classification number: H04N5/2253 ,  H04N5/2257 ,  H05K3/303 ,  H05K3/3436 ,  H05K2201/09781 ,  H05K2201/10568 ,  H05K2201/10734 ,  H05K2201/2036 ,  Y02P70/613

公开(公告)号：EP2490514A1

公开(公告)日：2012-08-22

申请号：EP11008197.3

申请日：2011-10-11

Applicant: Mitsubishi Electric Corporation

Inventor： Miura, Tsuyoshi ,  Namikoshi, Kazuo

IPC: H05K3/34 ,  B23K1/08 ,  H05K1/11

CPC classification number: H05K3/3468 ,  B23K1/0016 ,  B23K1/085 ,  B23K1/203 ,  B23K2201/42 ,  H05K1/111 ,  H05K3/3421 ,  H05K2201/094 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/10689 ,  H05K2203/046 ,  Y02P70/613

Abstract: A printed wiring board (1) has a solder-land group (5, 6) for placing a quad flat package IC (3), and the solder-land group (5, 6) consists of front solder-land groups (5) and rear solder-land groups (6). The printed wiring board 1 includes rear solder-drawing lands (9) that are positioned adjacent to rear solder-land groups (6), that have front edges each of which is substantially parallel to a longitudinal direction of rear solder lands (6a, 6b) constituting the rear solder-land group (6) and has a length approximately equal to or longer than that of the solder lands in the longitudinal direction, that are separated into two parts in a horizontal direction with respect to a traveling direction of solder flow such that a gap between the respective two separate lands (9) is made wider in its rearward portion than that in its frontward portion, and that have a slit (9a) substantially parallel to the longitudinal direction near the front edge.

Abstract translation: 印刷电路板（1）具有用于放置四边形扁平封装IC（3）的焊锡焊盘组（5,6），并且焊接焊盘组（5,6）由前焊接焊盘组（5）组成， 和后焊接组（6）。 印刷电路板1包括位于与后焊接台组（6）相邻的后焊盘（9），前后焊盘（9）具有大致平行于后焊盘（6a，6b）的纵向方向的前边缘 ），其长度大致等于或长于焊锡焊盘的长度方向的长度，相对于焊料流的行进方向在水平方向分离成两部分 使得相应的两个分离的平台（9）之间的间隙在其后部比其前部更宽，并且具有在前边缘附近基本上平行于纵向的狭缝（9a）。