公开(公告)号：EP1926355B1

公开(公告)日：2014-01-08

申请号：EP07076013.7

申请日：2007-11-21

Applicant: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.

Inventor： Ostmann, Andreas ,  Seckel, Manuel ,  Löher, Thomas ,  Manessis, Dionysios ,  Patzelt, Rainer

IPC: H05K3/00 ,  H05K1/00

CPC classification number: H05K1/0271 ,  H05K1/0283 ,  H05K1/188 ,  H05K1/189 ,  H05K3/284 ,  H05K3/303 ,  H05K3/382 ,  H05K2201/0133 ,  H05K2201/0187 ,  H05K2201/0355 ,  H05K2201/09263 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2201/2009 ,  H05K2203/0271

公开(公告)号：EP2680678A1

公开(公告)日：2014-01-01

申请号：EP11861583.0

申请日：2011-03-29

Applicant: Dowa Metals & Mining Co., Ltd.

Inventor： OSANAI, Hideyo ,  TAKAHASHI, Takayuki ,  IDEGUCHI, Satoru ,  KOTANI, Hirotaka

IPC: H05K1/02 ,  H05K1/03

CPC classification number: H05K1/053 ,  B22D19/0081 ,  B22D19/04 ,  H01L21/481 ,  H01L21/4871 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/022 ,  H05K2201/09136 ,  H05K2201/2009 ,  H05K2203/128 ,  Y10T428/12618 ,  Y10T428/2457 ,  Y10T428/2462 ,  Y10T428/24942 ,  H01L2924/00

Abstract: A metal/ceramic bonding substrate includes: a ceramic substrate; a metal plate bonded directly to one side of the ceramic substrate; a metal base plate bonded directly to the other side of the ceramic substrate; and a reinforcing member having a higher strength than that of the metal base plate, the reinforcing member being arranged so as to extend from one of both end faces of the metal base plate to the other end face thereof without interrupting that the metal base plate extends between a bonded surface of the metal base plate to the ceramic substrate and the opposite surface thereof.

Abstract translation: 金属/陶瓷接合基板包括：陶瓷基板; 直接结合在陶瓷基板的一侧的金属板; 金属基板直接结合到陶瓷基板的另一侧; 所述加强构件具有比所述金属基板高的强度的强化构件，所述加强构件配置成从所述金属基板的两个端面之一延伸到所述另一端面，而不会中断所述金属基板延伸 在金属基板与陶瓷基板的接合面与其相对面之间。

公开(公告)号：EP2498586A3

公开(公告)日：2013-08-28

申请号：EP12158691.1

申请日：2012-03-09

Applicant: Funai Electric Co., Ltd.

Inventor： Ishino, Yusuke ,  Kawai, Yasuhiko

IPC: H05K1/11

CPC classification number: H05K1/118 ,  H05K1/0281 ,  H05K1/147 ,  H05K2201/10189 ,  H05K2201/2009

Abstract: A flexible flat cable includes a cable main body and a pair of reinforcing plates. The cable main body includes a pair of resin films and a plurality of linear conductors. The linear conductors are exposed with respect to one of the resin films to form longitudinally extending electrical terminals. Each of the reinforcing plates has a fixed end section. The fixed end sections are fixedly coupled to end portions of the cable main body on the other of the resin films, respectively. The fixed end sections define a pair of bending lines such that the end portions of the cable main body are bendable relative to a middle portion of the cable main body to form acute corners between the end portions and the middle portion, respectively.

公开(公告)号：EP2583540A1

公开(公告)日：2013-04-24

申请号：EP11723474.0

申请日：2011-06-06

Applicant: Robert Bosch GmbH

Inventor： ARENS, Christian

IPC: H05K3/32 ,  H01R43/02

CPC classification number: H05K3/328 ,  H01R12/592 ,  H01R43/0221 ,  H05K3/3405 ,  H05K3/3494 ,  H05K2201/1034 ,  H05K2201/2009 ,  H05K2203/107 ,  H05K2203/1581

Abstract: The invention relates to a method for producing an electrical connection (20) between a flexible flat cable (12) having a plurality of conductors (10) disposed between two insulating layers (14, 16) and at least one metal contact partner (18) having an end face (28), in particular at least one contact pin. The method thereby comprises the following steps: a) introducing at least one recess (30) in the insulating layer (16) in the area of at least one joint zone (26), b) applying at least one reinforcing element (36) transparent to laser radiation (40) to the opposite insulating layer (14) in the area of the at least one joint zone (26) for mechanical stabilization, c) positioning at least one conductor (10) by means of the at least one reinforcing element (36) in relation to the end face (28) of at least one contact partner (18), and d) thermally joining, in particular welding or soldering, the at least one conductor (10) and the at least one contact partner (18) by laser radiation (40), wherein the laser radiation (40) passes through the reinforcing element (36). The invention further relates to an electrical connection (20) produced according to the method.

公开(公告)号：EP2433476A2

公开(公告)日：2012-03-28

申请号：EP10719618.0

申请日：2010-05-05

Applicant: Koninklijke Philips Electronics N.V.

Inventor： BRUYNEEL, Filip ,  PEETERS, Alfred

IPC: H05K1/18

CPC classification number: H05K1/189 ,  G02F1/133603 ,  G02F1/133608 ,  H05B33/0803 ,  H05K2201/051 ,  H05K2201/09018 ,  H05K2201/10106 ,  H05K2201/10159 ,  H05K2201/2009

Abstract: An oblong sized printed circuit board (1) comprises light emitting diode circuitry (2, 3). Parts of the printed circuit board (1) are flexible in at least one direction, to improve a manufacturing efficiency. Preferably, the printed circuit board (1) can make curves in length and width directions and does not require holes for screws. The light emitting diode circuitry (2, 3) may comprise light emitting diode circuits (2) with light emitting diodes and other circuitry (3) such as a driver for driving light emitting diode circuits (2) individually for providing ambient light for a display (5). A device (100) comprising the printed circuit board (1) may further comprise the display (5). Such a device (100) is for example a television receiver / display device / screen device. The printed circuit board (1) may be attached to structures (61, 62) moveable by hand / machine for directing the ambient light. The device (100) may be a roll (101) for rolling up the printed circuit board (1).

公开(公告)号：EP2019572B1

公开(公告)日：2012-02-01

申请号：EP08013359.8

申请日：2008-07-24

Applicant: TDK Corporation

Inventor： Kanemaru, Yoshikazu ,  Kawabata, Kenichi

IPC: H05K3/00 ,  H01L23/538

CPC classification number: H05K3/0052 ,  H01L23/49838 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K1/112 ,  H05K1/185 ,  H05K3/0097 ,  H05K3/4602 ,  H05K2201/09136 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2201/2009 ,  H05K2203/0169 ,  H05K2203/1469 ,  Y02P70/611 ,  Y10T29/49124 ,  H01L2224/82 ,  H01L2924/00

Abstract: The object of the present invention is to provide an assembly substrate which is easily handled and capable of suppressing occurrence of warpage, and offers high productivity and economic efficiency, and its manufacturing method. A work board 100 includes an insulating layer 21 on one surface of a substantially rectangular-shaped substrate 11, and electronic components 41 and a plate-like integrated frame 51 are embedded inside the insulating layer 21. The plate-like integrated frame 51 has a plurality of concave portions 53 arranged in parallel at its inner periphery wall 52a, and arranged on a non-placing area of the electronic components 41 so as to surround a plurality of the electronic components 41 (groups).

公开(公告)号：EP2144483A4

公开(公告)日：2011-06-08

申请号：EP07736995

申请日：2007-03-29

Applicant: FUJITSU LTD

Inventor： URAI TAKASHI

IPC: H05K1/18

CPC classification number: H05K1/0271 ,  H01L23/4006 ,  H01L23/562 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2023/4087 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K3/0058 ,  H05K2201/10409 ,  H05K2201/10734 ,  H05K2201/2009 ,  H01L2924/00

公开(公告)号：EP2066157A3

公开(公告)日：2011-03-09

申请号：EP08170158.3

申请日：2008-11-27

Applicant: Shinko Electric Industries Co., Ltd.

Inventor： Sunohara, Masahiro

IPC: H05K1/02 ,  H01L23/498

CPC classification number: H05K1/0271 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/562 ,  H01L2221/68345 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3511 ,  H05K3/20 ,  H05K3/205 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2201/09781 ,  H05K2201/10674 ,  H05K2201/2009 ,  H01L2924/00

Abstract: In a wiring substrate (1A, 1B, 1C, 1D) having a wiring member (30B) made by layering insulating layers (20, 20a, 20b, 20c) and wiring layers (18, 18a, 18b, 18c, 18d), and a reinforcing body (50A) disposed between the insulating layers of this wiring member (30B), this reinforcing body (50A) is configured to cross plural linear members (51A).

公开(公告)号：EP1460887B1

公开(公告)日：2010-07-14

申请号：EP04075869.0

申请日：2004-03-17

Applicant: The Boeing Company

Inventor： Anderson, David M. ,  Gladish, David R. ,  Johnson, Robert T. ,  Thomas, Terry L. ,  Senibi, Simon D. ,  Malkin, Matthew C.

IPC: H05K1/11 ,  H05K1/18 ,  H01R9/00

CPC classification number: H05K1/118 ,  H01R12/523 ,  H05K1/0281 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/3447 ,  H05K3/42 ,  H05K2201/0195 ,  H05K2201/09154 ,  H05K2201/10189 ,  H05K2201/2009

公开(公告)号：EP2019571A3

公开(公告)日：2010-04-14

申请号：EP08013361.4

申请日：2008-07-24

Applicant: TDK Corporation

Inventor： Kanemaru, Yoshikazu ,  Morita, Takaaki ,  Kawabata, Kenichi

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/46 ,  H05K3/00

CPC classification number: H05K1/185 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/04105 ,  H01L2224/16227 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/4602 ,  H05K2201/068 ,  H05K2201/2009 ,  H05K2203/0169 ,  Y10T29/49146 ,  H01L2224/82 ,  H01L2924/00

Abstract: A method of manufacturing an electronic component-embedded board is provided which is capable of suppressing warpage without requiring complicated processes at low cost and which offers high productivity and economic efficiency. A worksheet 100 includes insulating layers 21 and 31 on one surface of an approximately rectangular substrate 11, and an electronic component 41 and a plate-like frame member (member) 51 embedded inside the insulating layer 21, wherein the plate-like frame member 51 satisfying the relationship represented by the following formula (1) :α1