公开(公告)号：EP4386022A1

公开(公告)日：2024-06-19

申请号：EP22861119.0

申请日：2022-08-05

申请人： MITSUBISHI GAS CHEMICAL COMPANY, INC.

发明人： NAKASHIMA, Yuji ,  KOBAYASHI, Takashi ,  HIRANO, Shunsuke ,  HASEBE, Keiichi

IPC分类号： C08F299/00 ,  B32B15/08 ,  B32B27/34 ,  C08J5/24 ,  C08K5/3415 ,  C08L25/00 ,  H05K1/03

CPC分类号： B32B15/08 ,  B32B27/34 ,  C08F299/00 ,  C08J5/24 ,  C08K5/3415 ,  C08L25/00 ,  H05K1/03

摘要： Provided are a resin composition having low dielectric constants and low dielectric loss tangents before moisture absorption (initial state) and after moisture absorption with high metal foil peel strength; and a cured product, a prepreg, a metal foil-clad laminate, a resin sheet, and a printed wiring board in which the resin composition is used. The resin composition contains a compound (A) represented by Formula (M1) and a polymer (B) having a structural unit represented by Formula (V).


Selected Drawing: None

公开(公告)号：EP4382503A1

公开(公告)日：2024-06-12

申请号：EP22853103.4

申请日：2022-08-03

申请人： Kyocera Corporation

发明人： TANI, Yoshito

IPC分类号： C04B35/117 ,  C04B35/10 ,  H05K1/03

CPC分类号： C04B35/117 ,  H05K1/03 ,  C04B35/10

摘要： A ceramic sintered body includes a ceramic sintered body containing Al2O3 (alumina) and an additive, in which a content of Al2O3 is 94 mass% or greater. The additive contains SiO2 (silica), CaO (calcia), MgO (magnesia), TiO2 (titanium oxide), and Fe2O3 (iron oxide). In the ceramic sintered body, a content of Ti (titanium) in terms of TiOz is 120 ppm or greater, and a content of Fe (iron) in terms of Fe2O3 is 180 ppm or greater.

公开(公告)号：EP3845039B1

公开(公告)日：2024-06-12

申请号：EP19780283.8

申请日：2019-08-27

IPC分类号： H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H05K1/09 ,  H05K3/00 ,  H05K3/12 ,  H05K1/03 ,  H05K1/05 ,  H05K1/14 ,  H05K3/28

CPC分类号： H05K1/0306 ,  H05K1/05 ,  H05K3/284 ,  H05K2203/131620130101 ,  H05K1/144 ,  H05K1/0203 ,  H05K2201/06820130101 ,  H05K3/0014 ,  H05K2201/0911820130101 ,  H05K2201/04220130101 ,  H05K1/028 ,  H05K1/0284 ,  H05K1/095 ,  H05K1/117 ,  H05K1/183 ,  H05K1/189 ,  H05K3/1216 ,  H05K3/125 ,  H05K2203/110520130101

公开(公告)号：EP3994962B1

公开(公告)日：2024-05-22

申请号：EP20742331.0

申请日：2020-06-12

IPC分类号： H05K1/11 ,  H05K3/40 ,  H05K3/28 ,  H05K3/36 ,  G06K19/077 ,  H05K1/03 ,  H05K1/14 ,  H05K3/00 ,  G06K19/02

CPC分类号： H05K1/038 ,  H05K1/144 ,  H05K2201/04120130101 ,  H05K2201/05820130101 ,  H05K1/117 ,  H05K2201/039720130101 ,  H05K2201/0942720130101 ,  H05K2201/02920130101 ,  H05K3/281 ,  H05K3/284 ,  H05K3/28 ,  H05K2201/015420130101 ,  H05K3/0097 ,  H05K2203/131120130101 ,  H05K2203/132220130101 ,  H05K2203/022820130101 ,  H05K2203/16720130101 ,  H05K2203/154520130101 ,  G06K19/07722 ,  G06K19/07733 ,  G06K19/07743 ,  H05K2201/1009820130101 ,  H05K3/365 ,  H05K2203/017320130101 ,  H05K3/0052 ,  H05K2201/0988120130101 ,  H05K3/403 ,  H05K2201/0915420130101 ,  G06K19/027

公开(公告)号：EP4360410A1

公开(公告)日：2024-05-01

申请号：EP22829027.6

申请日：2022-06-15

申请人： Corning Incorporated

发明人： KIM, Joon-Soo ,  LEE, Young Suk ,  MOON, Byungdoo ,  MOON, Hyung Soo

IPC分类号： H05K1/03 ,  H05K1/09 ,  H05K3/20 ,  H05K3/18

CPC分类号： H05K1/0306 ,  H05K3/181 ,  H05K3/188 ,  H05K3/387

公开(公告)号：EP4357376A1

公开(公告)日：2024-04-24

申请号：EP22824982.7

申请日：2022-06-14

申请人： MITSUBISHI GAS CHEMICAL COMPANY, INC.

发明人： KUMAZAWA, Yune ,  KATAGIRI, Shunsuke ,  SUZUKI, Takuya

IPC分类号： C08F22/40 ,  C08K5/10 ,  C08F2/44 ,  G03F7/004 ,  G03F7/027 ,  G03F7/029 ,  G03F7/031 ,  H05K1/03 ,  H05K3/28 ,  H05K3/46

CPC分类号： C08F2/44 ,  C08F22/40 ,  C08K5/10 ,  G03F7/004 ,  G03F7/031 ,  G03F7/027 ,  G03F7/029 ,  H05K1/03 ,  H05K3/28 ,  H05K3/46

摘要： An object of the present invention is to provide a resin composition which does not inhibit photocuring reaction in an exposure step, and can confer excellent alkaline developability in a development step, when used in the fabrication of a multilayer printed wiring board; and a resin sheet, a multilayer printed wiring board, and a semiconductor device. The resin composition of the present invention contains: a compound (A) represented by the following formula (1); and a compound (B) containing one or more carboxy groups, other than the compound (A) represented by the following formula (1):

wherein each R1 independently represents a group represented by the following formula (2) or a hydrogen atom; and each R2 independently represents a hydrogen atom, or a linear or branched alkyl group having 1 to 6 carbon atoms, provided that at least one R1 is a group represented by the following formula (2):

wherein -* represents a bonding hand.

公开(公告)号：EP3733399B1

公开(公告)日：2024-04-24

申请号：EP20172710.4

申请日：2020-05-04

IPC分类号： B32B15/00 ,  C08J5/24 ,  H05K1/03 ,  C08F287/00 ,  C08F297/02 ,  C08K5/3492 ,  C08L53/00 ,  B32B27/30 ,  B32B5/02 ,  B32B5/12 ,  B32B5/26 ,  B32B15/14 ,  B32B15/20

CPC分类号： C08J5/24 ,  H05K1/0373 ,  H05K1/0366 ,  C08L53/00 ,  C08F287/00 ,  C08F297/02 ,  C08J2353/0020130101 ,  B32B2307/20620130101 ,  B32B2457/0820130101 ,  B32B5/26 ,  B32B5/022 ,  B32B5/024 ,  B32B5/12 ,  B32B2262/10120130101 ,  B32B2260/02320130101 ,  B32B2260/04620130101 ,  B32B15/20 ,  B32B15/14 ,  B32B2264/1020130101 ,  B32B2264/0220130101 ,  H05K2201/020920130101 ,  H05K2201/021220130101 ,  H05K2201/01220130101

公开(公告)号：EP4353475A1

公开(公告)日：2024-04-17

申请号：EP22820078.8

申请日：2022-05-30

申请人： AGC INC.

发明人： OKUDA, Ryota ,  KAKIUCHI, Toshifumi

IPC分类号： B32B17/10 ,  H01Q1/38 ,  H05K1/03

CPC分类号： H05K1/03 ,  B32B17/10 ,  H01Q1/38

摘要： To provide a substrate for a high frequency device, which satisfies requirements of low dielectric loss tangent, adhesion and transparency.
A substrate for a high frequency device comprising a transparent glass substrate 16 and a transparent resin base material 20 bonded to the glass substrate 16 via an optical clear adhesive 18, wherein the dielectric loss tangent of the resin base material 20 in dielectric loss tangent measurement test is 0.01 or less, the peel strength in peel test is 3.0 N/cm or more, and the amount of out gas in out gas test is 5.0 µg/g or less.

公开(公告)号：EP4112588B1

公开(公告)日：2024-04-17

申请号：EP21779621.8

申请日：2021-03-30

IPC分类号： C04B35/583 ,  C04B41/48 ,  C04B41/00 ,  C04B38/00 ,  C04B41/83 ,  C04B35/64 ,  C04B35/626 ,  H05K1/03 ,  C04B111/00

CPC分类号： H05K1/03 ,  C04B41/83 ,  C04B35/583 ,  C04B41/48 ,  C04B41/4853 ,  C04B41/009 ,  C04B2235/382120130101 ,  C04B2235/9520130101 ,  C04B2235/9420130101 ,  C04B2235/340920130101 ,  C04B2235/320820130101 ,  C04B2235/38620130101 ,  C04B2235/385620130101 ,  C04B2235/60420130101 ,  C04B2235/658620130101 ,  C04B35/64 ,  C04B2235/960720130101 ,  C04B2235/78720130101 ,  C04B2235/389520130101 ,  C04B2235/543620130101 ,  C04B35/62655 ,  C04B35/62695 ,  C04B38/0074 ,  C04B2235/7720130101 ,  C04B2111/0084420130101

公开(公告)号：EP4349596A1

公开(公告)日：2024-04-10

申请号：EP22811196.9

申请日：2022-05-16

申请人： DAIKIN INDUSTRIES, LTD.

发明人： UEDA, Yuki ,  OKUNO, Shingo ,  YAMAUCHI, Akiyoshi ,  SOUDA, Yoshihiro ,  NAKATANI, Yasukazu

IPC分类号： B32B27/30 ,  C09D5/02 ,  C09D127/12 ,  C09D127/18 ,  C09D127/20 ,  C09D175/04 ,  C09D7/45 ,  C09D7/61 ,  H05K1/03

摘要： Provided is an aqueous coating composition capable of forming a fluororesin coating film layer with excellent electrical properties and surface physical properties, and good adhesive properties. A coating composition containing 2 or more kinds of fluororesins, wherein at least 1 kind of the fluororesin, a fluororesin (I), has a number of functional groups of 30 to 1,000 per 10 6 main-chain carbon atoms, and the coating composition further contains an inorganic filler, a surfactant, a liquid medium, and a non-fluororesin.