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    Fabrication method
    24.
    发明公开
    Fabrication method 有权
    Herstellungsverfahren

    公开(公告)号：EP1226944A1

    公开(公告)日：2002-07-31

    申请号：EP02250367.6

    申请日：2002-01-18

    Applicant: Xerox Corporation

    Inventor： Gulvin, Peter M. ,  Eklund, Elliott A.

    IPC: B41J2/14 ,  H04R19/00 ,  H04R7/08 ,  F04B43/04

    CPC classification number: B81B3/007 ,  B41J2/14314 ,  B41J2/16 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1639 ,  B41J2/1642 ,  B81B2201/052 ,  B81B2203/0127 ,  F04B43/043 ,  H04R7/08

    Abstract: A method for fabricating a membrane (50) having a corrugated, multi-layer structure, comprising the steps of: providing a substrate (20) having an insulator layer (30) on the top surface of the substrate (20), a conductive layer (40) on the insulator layer, a sacrificial layer (206) on said conductive layer (40), and a second conductive layer (202); patterning a series of etch holes (205) in the second conductive layer (202) to allow release etchant to have access to a second sacrificial layer (206) ; depositing the second sacrificial layer (206) onto said second conductive layer (202) so that the series of holes (205) are filled with the second sacrificial layer (206) ; patterning the second sacrificial layer with a radial and/or concentric grid pattern so that a third conductive layer (201) when deposited will form the support structure and top portion of the corrugated structure; depositing the third conductive layer (201) so that the grid pattern is filled in and is in contact with the second conductive layer (202) and; removing the first and second sacrificial layers (206) by immersing the device in a release etchant.

    Abstract translation: 一种用于制造具有波纹状多层结构的膜（50）的方法，包括以下步骤：在所述基板（20）的顶表面上提供具有绝缘体层（30）的基板（20），导电层 （40），在所述导电层（40）上的牺牲层（206）和第二导电层（202）; 在第二导电层（202）中图案化一系列蚀刻孔（205），以允许剥离蚀刻剂进入第二牺牲层（206）; 将所述第二牺牲层（206）沉积到所述第二导电层（202）上，使得所述一系列孔（205）被所述第二牺牲层（206）填充; 以径向和/或同心网格图案图案化第二牺牲层，使得沉积时的第三导电层（201）将形成波纹结构的支撑结构和顶部; 沉积所述第三导电层（201）使得所述栅格图案被填充并与所述第二导电层（202）接触;和 通过将装置浸入释放蚀刻剂中来去除第一和第二牺牲层（206）。

    Method of micromachining a multi-part cavity
    25.
    发明公开
    Method of micromachining a multi-part cavity 审中-公开
    Verfahren zur Mikrobearbeitung einerKörperhölungmit mehrfachem Profil

    公开(公告)号：EP1077475A2

    公开(公告)日：2001-02-21

    申请号：EP00117155.2

    申请日：2000-08-10

    Applicant: Applied Materials, Inc.

    Inventor： Podlesnik, Dragan V. ,  Chinn, Jeffrey D. ,  Lill, Thorsten B. ,  Pan, Shaoher X. ,  Khan, Anisul ,  Wang, Joan Yiqiong ,  Li, Maocheng

    IPC: H01L21/3065 ,  B81C1/00

    CPC classification number: H01L27/1087 ,  B81B2201/052 ,  B81B2203/0315 ,  B81B2203/033 ,  B81C1/00119 ,  B81C2201/016 ,  H01L21/3065 ,  H01L21/3086

    Abstract: The present disclosure pertains to our discovery of a particularly efficient method for etching a multi-part cavity in a substrate. The method provides for first etching a shaped opening, depositing a protective layer over at least a portion of the inner surface of the shaped opening, and then etching a shaped cavity directly beneath and in continuous communication with the shaped opening. The protective layer protects the etch profile of the shaped opening during etching of the shaped cavity, so that the shaped opening and the shaped cavity can be etched to have different shapes, if desired. In particular embodiments of the method of the invention, lateral etch barrier layers and/or implanted etch stops are also used to direct the etching process. The method of the invention can be applied to any application where it is necessary or desirable to provide a shaped opening and an underlying shaped cavity having varying shapes. The method is also useful whenever it is necessary to maintain tight control over the dimensions of the shaped opening.

    Abstract translation: 本公开涉及我们发现用于蚀刻衬底中的多部分空腔的特别有效的方法。 该方法提供了首先蚀刻成形开口，在成形开口的内表面的至少一部分上沉积保护层，然后直接在成形开口下方蚀刻成形腔，并且与成形开口连续连通。 保护层在蚀刻成形腔体期间保护成形开口的蚀刻轮廓，从而如果需要，可以将成形的开口和成形的腔体进行蚀刻以具有不同的形状。 在本发明方法的特定实施例中，横向蚀刻阻挡层和/或注入的蚀刻停止点也用于引导蚀刻工艺。 本发明的方法可以应用于需要或希望提供具有不同形状的成形开口和下面的成形腔的任何应用。 只要需要对成形开口的尺寸进行严格控制，该方法也是有用的。

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