摘要:
A ceramic composite laminate includes a wavelength-converting layer and a non-emissive layer, wherein the ceramic composite laminate has a wavelength conversion efficiency (WCE) of at least 0.650. The ceramic composite laminate can also include a wavelength-converting ceramic layer comprising an emissive material and a scattering material, wherein the laminated composite has a total transmittance of between about 40% to about 85%. The wavelength-converting layer may be formed from plasma YAG:Ce powder.
摘要:
A method of manufacturing a ceramic multi-layer substrate, comprising a first process for manufacturing an unbaked composite laminated body (11) having a first contraction suppressing layer (13) and a second contraction suppressing layer (14) on one principal plane and the other principal plane of an unbaked multi-layer collecting substrate (12) formed of a plurality of ceramic green layers (17) stacked each other, a second process for forming cut-in grooves (16) reaching a part of the multi-layer collecting substrate (12) from the first contraction suppressing layer (13) side through the first contraction suppressing layer (13), a third process for baking the composite laminated body (11), a fourth process for removing the first and second contraction suppressing layers (13) and (14) and taking out the baked multi-layer collecting substrate (11), and a fifth process for taking out a plurality of ceramic multi-layer substrates by dividing the multi-layer collecting substrate along the cut-in grooves (16), whereby the ceramic multi-layer substrate with high dimensional accuracy and high reliability can be provided with high productivity by suppressing the contraction thereof in flat surface direction at the time of baking.
摘要:
The present invention relates to a photosensitive ceramic composite and a method for manufacturing a multilayer substrate using the composite. The photosensitive ceramic composite and manufacturing method of the present invention are applicable to circuit members and components for ceramic multilayer substrates for high-frequency wireless communication. The photosensitive ceramic composite contains inorganic particles and a photosensitive organic component. The inorganic particles have at least surface sections containing an inorganic material having a refractive index less than that of inner sections of the inorganic particles.
摘要:
The present invention relates to a photosensitive ceramic composite and a method for manufacturing a multilayer substrate using the composite. The photosensitive ceramic composite and manufacturing method of the present invention are applicable to circuit members and components for ceramic multilayer substrates for high-frequency wireless communication. The photosensitive ceramic composite contains inorganic particles and a photosensitive organic component. The inorganic particles have at least surface sections containing an inorganic material having a refractive index less than that of inner sections of the inorganic particles.
摘要:
A method of producing a ceramic multilayer substrate comprising the steps of: as a first step, producing a green composite laminate 11 containing first and second shrink-suppressing layers formed on one main surface 13 and the other main surface 14 of a green multilayer mother substrate 12 comprising a plurality of ceramic green layers 17 containing ceramic powder, the first and second shrink-suppressing layers containing a sintering-difficult powder substantially incapable of being sintered under the sintering conditions for the ceramic powder; as a second step, forming first grooves 16 extending from the first shrink-suppressing layer 13 side so as to pass through the first shrink-suppressing layer 13 and reach a part of the multilayer mother substrate 12; as a third step, firing the composite laminate 11; as a fourth step, removing the first and second shrink-suppressing layers 13 and 14 and taking out the sintered multilayer mother substrate 11; and as a fourth step, dividing the multilayer mother substrate 12 along the grooves 16, and taking out a plurality of the ceramic multilayer substrates. Thereby, the shrink in the plan direction at firing can be suppressed. Thus, a ceramic multilayer substrate having a high dimensional accuracy and a high reliability can be produced with a high production efficiency.