公开(公告)号：EP2302692A1

公开(公告)日：2011-03-30

申请号：EP09773505.4

申请日：2009-07-01

Applicant: Sharp Kabushiki Kaisha

Inventor： FUNAKOSHI, Yasushi

IPC: H01L31/042 ,  H05K1/02

CPC classification number: H01L31/0516 ,  B32B17/10018 ,  B32B17/10788 ,  B32B17/10871 ,  H01L31/02013 ,  H01L31/022441 ,  H02S40/34 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/0145 ,  H05K2201/10143 ,  Y02E10/50 ,  Y02E10/52

Abstract: Provided is a solar battery module wherein solar battery cells are electrically connected to each other by using a wiring board having a predetermined wiring pattern formed on a resin base material. A method for manufacturing such solar battery module is also provided. In the wiring board of the solar battery module, a direction wherein a design margin is small is permitted to be a direction wherein the thermal contraction ratio of the resin base material is small, by the shape of an electrode pattern on the solar battery cell and that of the wiring pattern on the wiring board. At the time of manufacturing such solar battery module, temperature in a heat treatment step is set at 100°C or higher but not higher than 180°C. Electrode designing at a fine pitch is made possible and the solar battery module exhibits high solar battery characteristics, even when the solar battery cells are connected by using wiring boards composed of various types of resin materials having thermal compression ratio not sufficiently low.

Abstract translation: 提供一种太阳能电池模块，其中通过使用具有形成在树脂基材上的预定布线图案的布线板将太阳能电池单元彼此电连接。 还提供了一种制造这种太阳能电池模块的方法。 在太阳能电池模块的布线基板中，设计边缘小的方向允许为树脂基材的热收缩率小的方向，太阳能电池单元上的电极图案的形状， 布线板上的布线图案。 在制造这种太阳能电池模块时，热处理步骤中的温度设定在100℃以上但不高于180℃。 即使当使用热压缩比不足够低的各种类型的树脂材料构成的布线板来连接太阳能电池单元时，太阳能电池模块也能够以很细的间距进行设计，并且太阳能电池模块具有高的太阳能电池特性。

公开(公告)号：EP1962348A3

公开(公告)日：2010-04-14

申请号：EP08103194.0

申请日：2006-08-14

Applicant: Cambrios Technologies Corporation

Inventor： Alden, Jonathan ,  Dai, Haixia ,  Knapp, Michael R ,  Na, Shuo ,  Pakbaz, Hash ,  Pschenitzka, Florian ,  Quan, Xina ,  Spaid, Michael, A ,  Wolf, Jeffrey ,  Winoto, Adrian

IPC: H01L31/0224 ,  H01B1/22 ,  G02F1/1343 ,  G02B5/02 ,  H01L21/768

CPC classification number: H01B1/22 ,  B22F2998/00 ,  B82Y20/00 ,  B82Y30/00 ,  C03C17/007 ,  C03C17/008 ,  C03C2217/445 ,  C03C2217/479 ,  C09D11/52 ,  C23F11/02 ,  C30B7/02 ,  C30B29/02 ,  C30B29/60 ,  C30B33/00 ,  G02F1/13439 ,  H01L27/14623 ,  H01L31/02164 ,  H01L31/022466 ,  H01L2224/45139 ,  H01L2224/49175 ,  H01L2924/00011 ,  H01L2924/12044 ,  H01L2924/3011 ,  H05K1/0269 ,  H05K1/097 ,  H05K3/048 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/026 ,  H05K2201/10128 ,  H05K2203/1545 ,  Y10S977/762 ,  B22F1/0025 ,  H01L2924/00 ,  H01L2924/01004 ,  H01L2924/0102 ,  H01L2924/01039

Abstract: A Transparent conductor including a conductive layer coated on a substrate is described. More specifically, the conductive layer comprises a network of nanowires which may be embedded in a matrix. The conductive layer is optically transparent and flexible. It can be coated or laminated onto a variety of substrates, including flexible and rigid substrates.

公开(公告)号：EP1965438A3

公开(公告)日：2009-05-13

申请号：EP08103188.2

申请日：2006-08-14

Applicant: Cambrios Technologies Corporation

Inventor： Alden, Jonathan ,  Dai, Haixia ,  Knapp, Michael R ,  Na, Shuo ,  Pakbaz, Hash ,  Pschenitzka, Florian ,  Quan, Xina ,  Spaid, Michael, A ,  Wolk, Jeffrey ,  Winoto, Adrian

IPC: H01L31/0224 ,  H01B1/22 ,  G02F1/1333 ,  G02F1/1335 ,  G02B5/02 ,  H01L21/768

CPC classification number: H01B1/22 ,  B22F2998/00 ,  B82Y20/00 ,  B82Y30/00 ,  C03C17/007 ,  C03C17/008 ,  C03C2217/445 ,  C03C2217/479 ,  C09D11/52 ,  C23F11/02 ,  C30B7/02 ,  C30B29/02 ,  C30B29/60 ,  C30B33/00 ,  G02F1/13439 ,  H01L27/14623 ,  H01L31/02164 ,  H01L31/022466 ,  H01L2224/45139 ,  H01L2224/49175 ,  H01L2924/00011 ,  H01L2924/12044 ,  H01L2924/3011 ,  H05K1/0269 ,  H05K1/097 ,  H05K3/048 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/026 ,  H05K2201/10128 ,  H05K2203/1545 ,  Y10S977/762 ,  B22F1/0025 ,  H01L2924/00 ,  H01L2924/01004 ,  H01L2924/0102 ,  H01L2924/01039

Abstract: A Transparent conductor including a conductive layer coated on a substrate is described. More specifically, the conductive layer comprises a network of nanowires which may be embedded in a matrix. The conductive layer is optically transparent and flexible. It can be coated or laminated onto a variety of substrates, including flexible and rigid substrates.

公开(公告)号：EP1764214A2

公开(公告)日：2007-03-21

申请号：EP06252756.9

申请日：2006-05-26

Applicant: TORAY INDUSTRIES, INC.

Inventor： Tanaka, Shotaro ,  Ohashi, Junpei ,  Takada, Yasushi

IPC: B32B27/36 ,  C08K5/353 ,  B32B15/08 ,  B32B15/20

CPC classification number: B32B27/36 ,  B32B15/08 ,  B32B15/09 ,  B32B15/20 ,  B32B27/08 ,  B32B27/16 ,  B32B27/18 ,  B32B27/281 ,  B32B2307/3065 ,  B32B2307/5825 ,  B32B2307/714 ,  B32B2457/08 ,  C08K5/353 ,  H05K1/0326 ,  H05K1/036 ,  H05K2201/0145 ,  H05K2201/0154 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31721 ,  Y10T428/31786 ,  Y10T428/31794 ,  C08L67/02

Abstract: A laminated polyester film, with excellent adhesive properties for use in a laminating material, is a film in which a resin layer including a polyester resin and a oxazoline-based cross-linking agent is laminated on at least one side surface of polyester film, diethylene glycol accounts for 40 mole% or more of all diol components constituting the polyester resin and the mass ratio of the polyester resin to the oxazoline-based cross-linking agent resin layer is within a range of 20/80 to 80/20. The film may form part of a flame-retardant polyester film in which a polyimide-including layer is laminated on both sides of the laminated polyester film. The flame-retardant polyester film may be used in a copper-clad laminated plate, which, in turn, may be used in a circuit substrate.

Abstract translation: 在层叠材料中使用的具有优异粘合性的层压聚酯膜是将聚酯树脂和恶唑啉系交联剂的树脂层层叠在聚酯膜的至少一个侧面上的膜，二亚乙基 乙二醇占构成聚酯树脂的所有二醇成分的40摩尔％以上，聚酯树脂与恶唑啉系交联剂树脂层的质量比在20/80〜80/20的范围内。 膜可以形成其中在聚酯聚酯膜的两面上层叠含聚酰亚胺的层的阻燃性聚酯膜的一部分。 阻燃性聚酯膜可以用于覆铜层压板，其也可以用于电路基板。

公开(公告)号：EP1517939B1

公开(公告)日：2005-11-23

申请号：EP03762124.0

申请日：2003-06-26

Applicant: EASTMAN CHEMICAL COMPANY

Inventor： PECORINI, Thomas, Joseph ,  BOONE, Gary, Darrel

IPC: C08G63/199 ,  C08J5/18

CPC classification number: B32B27/36 ,  B29C55/12 ,  B29C55/16 ,  B29K2067/00 ,  B32B15/08 ,  B32B15/09 ,  B32B2307/518 ,  C08G63/199 ,  C08J5/18 ,  C08J2367/02 ,  H05K1/0326 ,  H05K1/0393 ,  H05K3/281 ,  H05K3/386 ,  H05K2201/0145 ,  H05K2203/0271 ,  Y10S428/91 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31786 ,  Y10T428/31797

Abstract: Disclosed are biaxially oriented polyester film produced from a polyester comprising: (1) diacid residues comprising at least 90 mole percent of terephthalic acid residues, naphthalenedicarboylic acid residues or combinations thereof; and (2) diol residues comprising at least 90 mole percent of 1,4-cyclohexanedimethanol residues; wherein the polyester comprises a total of 100 mole percent diacid residues and a total of 100 mole percent diol residues; wherein a film of the polyester is stretched or oriented at stretch ratios and stretch temperatures that satisfy the equation (27*R) - (1.3*(T-Tg)) ≥ 27, where T is the average of the machine and transverse direction stretch temperatures in degrees Celsius, Tg is the glass transition temperature of the polymer film in degrees Celsius and R is the average of the machine and transverse direction stretch ratios and the stretched film is subsequently heat-set at an actual film temperature of from 260°C to Tm, wherein Tm is the melting point of the polyester as measured by differential scanning calorimetry (DSC), while maintaining the dimensions of the stretched film.

公开(公告)号：EP1009200A4

公开(公告)日：2005-06-01

申请号：EP98911183

申请日：1998-04-02

Applicant: NITTO DENKO CORP

Inventor： MIYAKE YASUFUMI ,  TERADA TETSUYA ,  YAGURA KENKICHI ,  MIYAAKE CHIHARU ,  SUGIMOTO TOSHIHIKO

IPC: H05K1/02 ,  H05K1/00 ,  H05K1/03 ,  H05K1/11 ,  H05K3/28 ,  H05K3/36 ,  H05K3/38

CPC classification number: H05K3/386 ,  H05K1/0326 ,  H05K1/0393 ,  H05K1/118 ,  H05K3/281 ,  H05K3/361 ,  H05K2201/012 ,  H05K2201/0145 ,  H05K2201/0355

Abstract: The present invention provides a rigid circuit member obtained by bending a composite laminate comprising a circuit conductor made of a metal foil interposed between plastic films having an elastic modulus of not less than 450 kg/mm with an adhesive, characterized in that as said plastic film there is used a polyethylene naphthalate film. The present invention also provides a circuit board adapted to be connected to a conductor on a rigid substrate, characterized in that said circuit conductor is interposed between polyethylene naphthalate films. The present invention further provides a printed circuit board, comprising a polyethylene naphthalate film having an elastic modulus of not less than 500 kg/mm , not more than 1.5 x 10 / DEG C, a hygroscopic expansion coefficient of not more than 1.2 x 10 /%RH, a water vapor permeability of not more than 15 g/m /mil.day, a percent water absorption of not more than 2% and a melting point of not higher than 280 DEG C and a conductor circuit integrated into a laminate with an adhesive layer provided interposed therebetween.

Abstract translation: 本发明提供一种刚性电路部件，该刚性电路部件通过将具有插入在弹性模量为450kg / mm 2以上的塑料膜之间的金属箔构成的电路导体的复合层叠体与粘合剂弯曲而成，其特征在于，作为 所说的塑料膜是用聚萘二甲酸乙二醇酯膜。 本发明还提供了一种适于连接到刚性基板上的导体的电路板，其特征在于，所述电路导体介于聚萘二甲酸乙二醇酯薄膜之间。 本发明还提供一种印刷电路板，其包含弹性模量不小于500kg / mm 2，不大于1.5×10 -5 /℃的聚萘二甲酸乙二醇酯膜，吸湿膨胀系数为 不超过1.2×10 -5 / RH，水蒸汽透过度不大于15g / m 2 /天，吸水率不超过2％，熔点不为 高于280℃的导体电路和集成在其间设置有粘合剂层的层压体中的导体电路。

公开(公告)号：EP1275682A4

公开(公告)日：2003-07-16

申请号：EP01917494

申请日：2001-03-23

Applicant: MITSUI TAKEDA CHEMICALS INC ,  MATSUSHITA ELECTRIC WORKS LTD

Inventor： INOUE T ,  OKUMURA H ,  HIRATA ISAO ,  OKADA S

IPC: B32B5/26 ,  B32B27/04 ,  C08F283/01 ,  C08F290/06 ,  C08J5/24 ,  H05K1/03 ,  B29B11/16 ,  B32B15/08 ,  B32B17/04 ,  B32B27/20

CPC classification number: B32B5/26 ,  B32B5/022 ,  B32B5/024 ,  B32B27/04 ,  B32B27/20 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2264/02 ,  B32B2305/72 ,  B32B2307/734 ,  B32B2398/20 ,  B32B2605/00 ,  B32B2605/12 ,  C08F283/01 ,  C08F290/064 ,  C08J5/24 ,  H05K1/036 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/0129 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/068 ,  Y10T428/249924 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/26 ,  Y10T428/2904 ,  Y10T428/2927 ,  Y10T428/298 ,  Y10T428/2991 ,  Y10T428/31786

Abstract: A lowly heat-expandable laminate which is obtained by superposing and curing fiber-reinforced layers impregnated with a resin composition comprising a radical-polymerizable resin, a radical-polymerizable monomer, and an inorganic filler and, compounded therewith, a specific amount of a thermoplastic resin. It is excellent in heat resistance, water resistance, and toughness and has an average coefficient of linear expansion of 20x10-6/°C or lower in the temperature range of 40 to 150°C.

公开(公告)号：EP1222843A1

公开(公告)日：2002-07-17

申请号：EP00960727.6

申请日：2000-09-20

Applicant: Ahlstrom Glassfibre OY

Inventor： KOMLENIC, Rod,C/o Ahlstrom Filtration, Inc. ,  RENNELS, Kelly,C/o Ahlstrom Filtration, Inc. ,  RÖKMAN, Kay ,  SABEL, Hakan

IPC: H05K1/03

CPC classification number: C08J5/046 ,  B32B5/28 ,  C08J5/24 ,  D21F11/002 ,  D21H13/18 ,  D21H13/22 ,  D21H13/24 ,  D21H13/26 ,  D21H13/40 ,  D21H25/005 ,  D21H25/04 ,  D21H25/06 ,  H05K1/0366 ,  H05K2201/0145 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/28 ,  Y10T442/2008 ,  Y10T442/2738 ,  Y10T442/608 ,  Y10T442/632 ,  Y10T442/637

Abstract: A printed circuit board is made from at least one non-woven sheet or web layer comprising at least 50 % by weight acrylic fibers, with any balance substantially electrically non-conductive fibers, filler, and binder. The sheet or web is preferably made by the foam process, and may contain 60-80 % straight polyacrylonitrile fibers and 40-20 % fibrillated (pulp) ones. The web or sheet is preferably compressed by thermal calendering so that it has a density of about 0.1-1 grams per cubic centimeter; and the web or sheet may have a basis weight of between about 20-120 grams per square meter. The web or sheet may also have a 1-40 % of substantially electrically non-conductive organic or inorganic binder, or may be substantially binder free. A printed circuit board made using the layers of these non-woven webs or sheets is otherwise conventional, including a pre-preg material, electrically conductive circuit elements, and electronics, and has improved properties compared to woven glass and non-woven aramid products, including improved fiber consolidation, easy board construction, and improved MD/CD ratio and stability.

公开(公告)号：EP1057656A4

公开(公告)日：2002-02-20

申请号：EP99972582

申请日：1999-10-01

Applicant: UNITIKA LTD

Inventor： NAKAYAMA YASUKI ,  WAKAMURA KAZUYUKI ,  OSHITA MAKOTO ,  DOI OSAMU ,  KOMETANI YOSHIAKI ,  TSUBOGO MAKOTO

IPC: B32B27/36 ,  B42D15/10 ,  G06K19/02 ,  G06K19/077 ,  H05K1/03 ,  B32B27/20 ,  B42D15/00

CPC classification number: B32B27/08 ,  B32B27/36 ,  B32B2367/00 ,  B32B2425/00 ,  B42D25/00 ,  B42D25/45 ,  G06K19/02 ,  G06K19/077 ,  H05K1/036 ,  H05K2201/0145 ,  H05K2201/0209

Abstract: A three layer polyester resin sheet for card use, which comprises a layer of 100 parts by weight of a poly(ethylene terephthalate)-based polyester resin and 50 parts by weight or less of a granular inorganic compound as the intermediate layer and layers of an amorphous polyester resin as both of the outer layers, namely a sheet having excellent surface printability, mechanical strength and heat resistance and also having excellent self-adhesiveness between sheets under a low temperature low pressure condition and embedding ability of electronic parts and the like, and a resin laminate which uses the same.

Abstract translation: 的三层聚酯树脂片用卡，其中按重量计聚（对苯二甲酸乙二醇酯）的基聚酯树脂和50重量份或更小的颗粒状无机化合物的作为中间层和一个层包括100份的层 无定形聚酯树脂作为两个外层，即具有优异的表面的可印刷性，机械强度和耐热性以及电子部件，因此具有低温低压状态下薄片之间优异的自粘合性和埋入性等的片材，和 的树脂层压板，其使用相同的。

公开(公告)号：EP1097959A1

公开(公告)日：2001-05-09

申请号：EP00309748.2

申请日：2000-11-03

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Ikeguchi, Nobuyuki ,  Shimoda, Masahiro

IPC: C08J5/24 ,  C09D163/00

CPC classification number: C08J5/24 ,  C08G59/4014 ,  C08G73/0655 ,  H05K1/036 ,  H05K1/0373 ,  H05K1/162 ,  H05K3/0038 ,  H05K2201/0112 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2201/0278 ,  H05K2203/0315

Abstract: A high relative-permittivity B-staged sheet obtained by incorporating an insulating inorganic filler having a relative permittivity of at least 500 at room temperature into a solvent-less resin component so as to have an insultaing inorganic filler content of 80 to 99 % by weight, a high relative-permittivity prepreg obtained from the above high relative-permittivity B-staged sheet, a process for the production of the high relative-permittivity prepreg, and a printed wiring board obtained from any one of the above high relative-permittivity B-staged sheet and the high relative-permittivity prepreg.

Abstract translation: 通过对绝缘性的至少500在室温下的相对介电常数为溶剂型树脂组分的无机填料掺入而得到的高相对介电常数B阶片，以便具有在80 insultaing无机填料的含量到99％重量 ，高的相对介电常数半固化片从上述高相对介电常数B阶片，用于生产高相对介电常数预浸料坯的过程中获得的，并且从上述高相对介电常数B的任一个而获得的印刷配线板 -staged片材和高的相对介电常数prepreg-。