公开(公告)号：EP2139009A4

公开(公告)日：2012-01-04

申请号：EP08739514

申请日：2008-03-31

Applicant: SEKISUI CHEMICAL CO LTD

Inventor： SUN REN-DE ,  MATSUSHITA KIYOTO ,  SASAKI TAKU ,  UENOYAMA SHINYA ,  OKUDA MASAKI ,  OKINAGA NOBUYUKI

IPC: H01B5/00 ,  B22F1/02 ,  B23K35/26 ,  C22C13/00 ,  C25D5/12 ,  C25D7/00 ,  H01L21/60

CPC classification number: C25D5/12 ,  B22F1/025 ,  B23K35/26 ,  C23C18/1635 ,  C23C18/1653 ,  C23C18/1692 ,  C23C18/30 ,  C23C18/34 ,  C23C28/023 ,  C25D5/10 ,  C25D5/56 ,  C25D7/00 ,  H01L24/13 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/2989 ,  H01L2224/81101 ,  H01L2224/81801 ,  H01L2224/83851 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/3436 ,  H05K2201/0221 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2224/13111 ,  H01L2924/00014

公开(公告)号：EP2202755A1

公开(公告)日：2010-06-30

申请号：EP08841659.9

申请日：2008-10-24

Applicant: Sekisui Chemical Co., Ltd.

Inventor： SASAKI, Taku ,  NATSUI, Hiroshi ,  UENOYAMA, Shinya ,  SUN, Ren-de

IPC: H01B5/00 ,  C23C18/40 ,  H01B1/22 ,  H01B13/00 ,  H01R11/01 ,  H05K1/14 ,  H05K3/32

CPC classification number: H05K3/323 ,  C23C18/1635 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/38 ,  C23C18/40 ,  C23C18/405 ,  C25D5/56 ,  H01B1/22 ,  H01R13/035 ,  H05K2201/0221

Abstract: It is an object of the present invention to provide a conductive particle which has low initial connection resistance and which is hard to increase in connection resistance even when stored for a long period.
The present invention is a conductive particle comprising a copper layer formed on a surface of a resin particle, wherein in the copper layer, an area ratio of an area corresponding to voids in a cross-section in a thickness direction is 5% or less, and copper composing the copper layer has an average crystallite diameter of 40 nm or more.

Abstract translation: 本发明目的在于提供一种导电粒子，其中具有低的初始连接电阻的目的和所有的这是很难在连接电阻增加，即使当存储了很长的时期。 本发明是一种导电性粒子包括形成树脂颗粒的表面上的铜层，在该铜层的区域对应于空隙的截面在厚度方向上的面积比worin为5％或更小， 和铜构成的铜层具有上的40nm以上的微晶平均粒径。

公开(公告)号：EP2139009A1

公开(公告)日：2009-12-30

申请号：EP08739514.1

申请日：2008-03-31

Applicant: Sekisui Chemical Co., Ltd.

Inventor： SUN, Ren-de ,  MATSUSHITA, Kiyoto ,  SASAKI, Taku ,  UENOYAMA, Shinya ,  OKUDA, Masaki ,  OKINAGA, Nobuyuki

IPC: H01B5/00 ,  B22F1/02 ,  B23K35/26 ,  C22C13/00 ,  C25D5/12 ,  C25D7/00 ,  H01L21/60 ,  H01R12/04

CPC classification number: C25D5/12 ,  B22F1/025 ,  B23K35/26 ,  C23C18/1635 ,  C23C18/1653 ,  C23C18/1692 ,  C23C18/30 ,  C23C18/34 ,  C23C28/023 ,  C25D5/10 ,  C25D5/56 ,  C25D7/00 ,  H01L24/13 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/2989 ,  H01L2224/81101 ,  H01L2224/81801 ,  H01L2224/83851 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/3436 ,  H05K2201/0221 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2224/13111 ,  H01L2924/00014

Abstract: It is an object of the present invention to provide: a conductive fine particle, which is used for conductive connection between fine electrodes and tends not to give rise to a crack in the solder layer or disconnection caused by breakage in the connection interface between an electrode and the conductive fine particle even with a drop impact and the like, and tends not to have fatigue even after repetitive heating and cooling; an anisotropic conductive material obtained by using the conductive fine particle; and a conductive connection structure.
The present invention relates to a conductive fine particle, which comprises a solder layer containing tin and being formed on a surface of a resin fine particle, with nickel adhered to a surface of the solder layer, and contains 0.0001 to 5.0% by weight of the nickel with respect to a total of a metal contained in the solder layer and the nickel adhered to the surface of the solder layer.

Abstract translation: 本发明的目的是提供：导电性细颗粒，其用于细电极之间的导电连接并且趋向于不引起焊料层中的裂纹或由电极之间的连接界面中的断裂引起的断开 导电性细颗粒即使具有落下冲击等，即使在重复加热和冷却之后也不会有疲劳; 通过使用导电性微粒获得的各向异性导电材料; 和导电连接结构。 本发明涉及一种导电性细颗粒，其包含含锡的焊料层，并且形成在树脂细颗粒的表面上，镍附着在焊料层的表面，并且含有0.0001至5.0重量％的 镍相对于焊料层中所含的总量和附着在焊料层表面的镍。

公开(公告)号：EP1831897A4

公开(公告)日：2009-01-28

申请号：EP05822819

申请日：2005-12-28

Applicant: DONGBU HITEK CO LTD

Inventor： MIN BYUNG HOON ,  KIM KYUNG HEUM ,  KIM SEUNG BUM ,  LEE SUNG SOO ,  PARK KYOUNG BAE ,  KIM NAM GYOL ,  YOO BYOUNG JAE

IPC: H01B1/00 ,  C08J7/06

CPC classification number: H01B1/02 ,  C23C18/1635 ,  C23C18/1641 ,  C23C18/1653 ,  C23C18/22 ,  C23C18/285 ,  C23C18/30 ,  C23C18/36 ,  C23C18/405 ,  C23C28/00 ,  C23C28/021 ,  C23C28/023 ,  C25D3/60 ,  C25D7/00 ,  C25D17/20 ,  H01L23/49816 ,  H01L24/01 ,  H01L24/80 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/2989 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/351 ,  H05K3/3436 ,  H05K2201/0212 ,  H05K2201/0221 ,  Y02P70/613 ,  Y10T428/2991 ,  Y10T428/2993 ,  H01L2924/00

Abstract: This invention relates to plastic conductive particles having an outer diameter of 2.5 μm~l mm obtained by sequentially plating a 0.1-10 W thick a metal plating layer and a 1-100 W thick Pb solder layer or a Pb-free solder layer on plastic core beads having a high elastic modulus of compression, and to a method of manufacturing thereof . The method of manufacturing the plastic conductive particles according to this invention includes preparing plastic core beads having excellent thermal properties and a high elastic modulus of compression, etching surfaces of the plastic core beads for surface treatment thereof, forming a metal plating layer via electroless plating to improve adhesion between the bead surface and the metal plating layer, and then forming a solder layer in a manner such that a sealed hexagonal barrel is immersed in an electroplating solution and then an electroplating process is conducted using a mesh barrel rotating 360 °at 6~10 rpm or a mesh barrel having a structure in which one surface of a conventional sealed hexagonal barrel is open, and rotating 200° in right and left directions at 1~5 rpm, to manufacture plastic conductive particles having a size of 1 mm or less. The plastic conductive particles of this invention enable the maintenance of packaging gaps, and thus can be applied to IC packaging, LCD packaging and other conductive materials.

公开(公告)号：EP1426979A8

公开(公告)日：2004-09-15

申请号：EP02765567.9

申请日：2002-09-17

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： WAKIYA, Takeshi, Sekisui Chemical Co., Ltd. ,  YONEDA, Yoshikazu, Sekisui Chemical Co., Ltd. ,  UEBA, Masako, Sekisui Chemical Co., Ltd.

IPC: H01B5/00 ,  H01B5/16 ,  H01B1/00 ,  B01J19/00 ,  C08K9/04 ,  C08L101/00 ,  H01R11/01 ,  C09C3/06 ,  C09J9/02

CPC classification number: H05K3/323 ,  B22F1/0062 ,  B22F2998/00 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0233 ,  Y10T428/2991 ,  Y10T428/2998 ,  B22F1/025

Abstract: An objective of the invention is to provide a coated conductive particle having superior connection reliability, a method for manufacturing such coated conductive particle, an anisotropic conductive material and a conductive-connection structure. A coated conductive particle comprising a particle having a surface made of conductive metal and an insulating particles to coat the surface of the particle having the surface made of conductive metal there with, wherein the insulating particles are chemically bonded to the particle having the surface made of conductive metal via a functional group (A) having a bonding property to the conductive metal so that a single coating layer is formed.

公开(公告)号：EP1051265A4

公开(公告)日：2004-04-07

申请号：EP99905459

申请日：1999-01-29

Applicant: HENKEL LOCTITE CORP

Inventor： MCARDLE CIARAN B ,  BARNES RORY B

IPC: B05D5/12 ,  B05D3/06 ,  B05D3/14 ,  B05D7/00 ,  B05D7/04 ,  C08F2/46 ,  C08F2/48 ,  C23C24/08 ,  C23C24/10 ,  C23C26/00 ,  C23C26/02 ,  H01F1/00 ,  H01F41/16 ,  H01F41/18 ,  H01F41/34 ,  H05K3/32

CPC classification number: B05D3/207 ,  B05D3/067 ,  B05D7/00 ,  C23C24/08 ,  C23C24/10 ,  C23C26/00 ,  C23C26/02 ,  H01F41/16 ,  H01F41/18 ,  H01F41/34 ,  H05K3/323 ,  H05K2201/0218 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/083 ,  H05K2203/0425 ,  H05K2203/104

Abstract: The present invention provides a variety of interrelated methods of coating non-random and ordered arrays of particles, as well as films containing such arrays. The present invention also relates to the coated non-random and ordered arrays of particles and films prepared therefrom. The coated non-random and ordered arrays are obtained by the use of ferrofluid compositions which may be curable. The arrays and films may contain electrically-conductive particles useful in electronic applications for effecting contact between conductors.

公开(公告)号：EP1002844A3

公开(公告)日：2000-10-11

申请号：EP99119499.4

申请日：1999-10-01

Applicant: Beiersdorf Aktiengesellschaft

Inventor： Pfaff, Ronald, Dr.

IPC: C09J7/00 ,  H01L21/60 ,  H01L23/498 ,  H01R4/04 ,  H01R13/03 ,  H05K3/32

CPC classification number: H01L24/83 ,  C09J7/10 ,  H01B1/22 ,  H01L24/28 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/19043 ,  H01R4/04 ,  H05K3/323 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/0233 ,  H05K2201/0272 ,  H05K2201/0329 ,  H05K2201/2036 ,  Y10T428/2813 ,  Y10T428/2817 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/2878 ,  Y10T428/2887 ,  Y10T428/2982 ,  Y10T428/2991 ,  Y10T428/2996 ,  H01L2924/00

Abstract: Elektrisch leitfähige, thermoplastische und hitzeaktivierbare Klebstoffolie, enthaltend i) ein thermoplastisches Polymer mit einem Anteil von zumindest 30 Gew.-% ii) ein oder mehrere klebrigmachende Harze mit einem Anteil von 5 bis 50 Gew.-% und/oder iii) Epoxidharze mit Härtern, gegebenenfalls auch Beschleunigern, mit einem Anteil von 5 bis 40 Gew.-%, iv) metallisierte Partikel mit einem Anteil von 0,1 bis 40 Gew.-%, v) nur schwer oder nicht verformbare Spacerpartikel mit einem Anteil von 1 bis 10 Gew-%, die bei der Verklebungstemperatur der Klebstoffolie nicht schmelzen.

公开(公告)号：EP0996321A2

公开(公告)日：2000-04-26

申请号：EP99306548.1

申请日：1999-08-19

Applicant: SONY CHEMICALS CORPORATION

Inventor： Yamada, Yukio, Sony Chemicals Corporation ,  Saito, Masao, Sony Chemicals Corporation ,  Shinozaki, Junji, Sony Chemicals Corporation ,  Takeichi, Motohide, c/o Sony Chemicals Corporation

IPC: H05K3/32 ,  H01L21/60 ,  H01R4/04

CPC classification number: H01L24/83 ,  H01L24/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29399 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H01R4/04 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0233 ,  H05K2201/0266 ,  H05K2201/10674 ,  H01L2924/00

Abstract: An anisotropically electroconductive adhesive to be used for establishing electric connection between terminals of, for example, an IC chip and of a circuit pattern, at a low cost with high reliabilities both in the establishment of electric connection and in the insulation upon the connection without suffering from short-circuiting between circuit lines in the circuit and without causing any obstruction on the circuit, even when the terminals or the circuit lines are disposed at close intervals, which adhesive comprises an electrically insulating adhesive matrix and electroconductive particles dispersed in the matrix, wherein the electroconductive particles comprise at least two electroconductive particulate products of different average particle sizes and wherein each particle of both the particulate products is coated with an electrically insulating resin insoluble in the insulating adhesive matrix.

公开(公告)号：EP0413161B1

公开(公告)日：1995-03-08

申请号：EP90113759.6

申请日：1990-07-18

Applicant: CASIO COMPUTER COMPANY LIMITED

Inventor： Sugiyama, Kazuhiro, c/o Hamura R & D Center ,  Atsumi, Yoshinori, c/o Hamura R & D Center

IPC: H01R4/04

CPC classification number: H01R4/04 ,  G02F1/1339 ,  G02F1/13452 ,  H01R12/57 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0233 ,  H05K2201/09036 ,  H05K2201/10681

公开(公告)号：EP0475655A2

公开(公告)日：1992-03-18

申请号：EP91308035.4

申请日：1991-09-02

Applicant: SOKEN CHEMICAL & ENGINEERING CO. LTD., ,  CHEMITECH CORPORATION

Inventor： Fukuzawa, Hidemoto ,  Okada, Yasuhiro ,  Imai, Tatsuhiro ,  Ousaka, Noriyuki

IPC: C08K9/10 ,  C09J133/08 ,  H01B1/22

CPC classification number: H05K3/323 ,  C08K9/08 ,  C08L2666/14 ,  C09J133/08 ,  H01B1/22 ,  H01L2924/07811 ,  H05K3/361 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0233 ,  C08L33/08

Abstract: An anisotropic conductive adhesive composition comprising an insulating adhesive component and particles dispersed in said insulating adhesive component, said anisotropic conductive adhesive composition being characterized in that

said insulating adhesive component comprises a copolymer of acrylic ester having an alkyl group of 1-4 carbon atoms and a maleimide derivative,
5 to 60 parts by weight, based on 100 parts by weight of the copolymer, of a thermosetting resin, and
0.05 to 5.0 parts by weight, based on 100 parts by weight of the copolymer, of a coupling agent, and
said particles are metallic-layer containing particles comprising a core made of resin, a metallic layer covering said core and a resin layer formed from finely divided resin fixed by the dry blending method on the surface of said metallic layer.

Abstract translation: 一种各向异性导电粘合剂组合物，其包含绝缘粘合剂组分和分散在所述绝缘粘合剂组分中的颗粒，所述各向异性导电粘合剂组合物的特征在于所述绝缘粘合剂组分包含具有1-4个碳原子的烷基的丙烯酸酯和 马来酰亚胺衍生物，相对于共聚物100重量份为5〜60重量份，热固性树脂为0.05〜5.0重量份，基于100重量份共聚物，偶联剂和所述 颗粒是包含由树脂制成的芯的金属层的颗粒，覆盖所述芯的金属层和由通过干式混合方法固定在所述金属层的表面上的由细分散的树脂形成的树脂层。