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    Process for producing printed circuit boards
    21.
    发明公开
    Process for producing printed circuit boards 失效
    生产印刷电路板和印制电路板的工艺

    公开(公告)号：EP0416518A3

    公开(公告)日：1993-01-27

    申请号：EP90116931.8

    申请日：1990-09-04

    Applicant: IDEMITSU KOSAN COMPANY LIMITED

    Inventor： Nakano, Akikazu

    IPC: H05K1/03

    CPC classification number: H05K1/0373 ,  H05K1/0366 ,  H05K3/022 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0239 ,  H05K2201/0248 ,  H05K2201/0251 ,  H05K2201/09118 ,  Y10T29/4916

    Abstract: A process for producing a printed circuit board is disclosed, in which the following steps are sequentially conducted:
    (1) a step for dispersing in at least one of the mediums of water and an organic solvent
    (A) 95 to 20% by weight of a styrene polymer having a syndiotactic structure, (B) 5 to 80% by weight of a fibrous filler having a fiber length of 1 to 50 mm, and (C) 0.1 to 30 parts by weight of at least one of a binder and a binding fiber in proportion to 100 parts by weight of the total amount of said components (A) and (B), to make a slurry having a concentration of 0.5 to 100 g/l, (2) a sedimentation step of the dispersed solids in said slurry, (3) a step for removing at least one of the mediums of water and an organic solvent in the slurry by filtration and drying and molding the residue, (4) a step for melting with heating and pressure forming the molded product, and (5) a step for providing a metal layer on the molded article. The printed circuit board obtained by the process is excellent in impact resistance, heat resistance, mechanical strength and size stability as well as dielectric properties.

    Reinforced polyphenylene sulphide board, printed circuit board made therefrom and process for making them
    25.
    发明公开
    Reinforced polyphenylene sulphide board, printed circuit board made therefrom and process for making them 失效
    钢筋Polyphenylensulfidplatte，这样得到的印刷电路板和它们的制备方法。

    公开(公告)号：EP0096122A1

    公开(公告)日：1983-12-21

    申请号：EP82302887.3

    申请日：1982-06-04

    Applicant: TORAY INDUSTRIES, INC.

    Inventor： Kitanaka, Minoru ,  Deguchi, Yukichi

    IPC: C08L81/02 ,  B32B17/04 ,  H05K1/02

    CPC classification number: B32B27/28 ,  B29C70/00 ,  B29K2309/08 ,  B32B15/08 ,  B32B38/0036 ,  B32B2262/101 ,  B32B2457/08 ,  C08K7/14 ,  H05K1/0333 ,  H05K1/0366 ,  H05K2201/0251 ,  C08L81/02

    Abstract: A polyphenylene sulfide (PPS) molded board reinforced with 15-85 wt. % of glass fibers (GF) having a length of at least 5 mm is provided. The molded board is useful as an insulating substrate of a printed circuit board. The printed circuit board is prepared by compressing under heating a mixture or laminate of PPS and GF to form a composite molded board and, at or after the compression step, bonding a metallic foil to a surface the composite molded board. The printed circuit board is excellent in mechanical properties such as impact resistance, thermal properties such as heat distortion temperature and solder resistance, and adhesion between the insulating substrate and the metallic foil.

    Abstract translation: 的聚苯硫醚（PPS）模压板钢筋15至85重量％的具有至少5mm的长度被设置的玻璃纤维（GF）中。 模制板是在绝缘的印刷电路板的基板是有用的。 所述印刷电路板是通过加热下或PPS和GF的层压压缩的混合物，以形成复合模制板，并在或压缩步骤之后，将金属箔粘合到表面上的复合成型板制得。 所述印刷电路板具有优良的机械性能：如耐冲击性，热特性：如热变形温度和耐焊锡性和粘附绝缘基板和所述金属箔之间。

    NANOFIBER SHEET, PROCESS FOR PRODUCING THE SAME, AND FIBER-REINFORCED COMPOSITE MATERIAL
    28.
    发明公开
    NANOFIBER SHEET, PROCESS FOR PRODUCING THE SAME, AND FIBER-REINFORCED COMPOSITE MATERIAL 有权
    纳米碳纤维布，和工艺生产复合纤维增强

    公开(公告)号：EP2042655A1

    公开(公告)日：2009-04-01

    申请号：EP07790761.6

    申请日：2007-07-13

    Applicant: Pioneer Corporation ,  Mitsubishi Chemical Corporation ,  Rohm Co., Ltd.

    Inventor： YANO, Hiroyuki ,  NOGI, Masaya ,  IFUKU, Shinsuke ,  ABE, Kentarou ,  HANDA, Keishin

    IPC: D21H11/08 ,  C08J5/04

    CPC classification number: H05K1/0366 ,  D21H11/08 ,  H05K2201/0251 ,  H05K2201/0284 ,  Y10T442/2869

    Abstract: Provided is a nanofiber sheet that sufficiently refined by fibrillation and has high crystallinity of cellulose fiber and can realize a fiber-reinforced composite material exhibiting high transparency, a high elastic modulus, a low coefficient of linear thermal expansion, and high heat resistance and being high in flatness and smoothness. This nanofiber sheet includes crystalline cellulose as the main component and a lignin in an amount of from 10 ppm to 10 wt%. When a fiber/resin composite material obtained by impregnating the nanofiber sheet with tricyclodecane dimethacrylate, subjecting the impregnated product to UV-curing at 20 J/cm 2 , and heating the cured product in vacuum at 160°C for two hours includes 60 wt% of the cured tricyclodecane dimethacrylate and 40 wt% of nanofiber, the following physical characteristics (i) to (iii) are satisfied: (i) the parallel light transmittance of light of a wavelength of 600 nm at a sheet thickness of 100 µm is 70% or more; (ii) the Young's modulus is 5.0 GPa or more; and (iii) the coefficient of linear thermal expansion is 20 ppm/K or less.

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