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    Process for producing multilayer printed circuit boards
    25.
    发明公开
    Process for producing multilayer printed circuit boards 失效
    Verfahren zur Herstellung von mehrschichtigen Leiterplatten

    公开(公告)号：EP0746189A1

    公开(公告)日：1996-12-04

    申请号：EP96303955.7

    申请日：1996-05-31

    Applicant: HITACHI CHEMICAL COMPANY, LTD.

    Inventor： Shimizu, Hiroshi ,  Ogawa, Nobuyuki ,  Shibata, Katsuji ,  Nakaso, Akishi

    IPC: H05K3/46 ,  C09K13/02 ,  C08J7/12

    CPC classification number: H05K3/4655 ,  C08J7/12 ,  C08J2363/00 ,  H05K3/002 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0554 ,  H05K2203/0783 ,  Y10S428/901

    Abstract: A process for producing a multilayer printed circuit board, which comprises:
       laminating an interlayer plate having conductor circuits thereon with a thermosetting copper-clad adhesive resin sheet having a copper foil on one side, so as to make the resin side of the sheet contact with the interlayer plate, followed by curing the resin to give an integrated laminate, the thermosetting copper-clad adhesive resin sheet being obtainable by integrating a copper foil with a thermosetting epoxy resin composition comprising (a) an epoxy polymer having a weight-average molecular weight of 100,000 or more, obtainable by polymerizing a bifunctional epoxy resin and a bifunctional halogenated phenol in an equivalent weight ratio of epoxy group:phenolic hydroxyl group of from 1:0.9 to 1:1.1, (b) a crosslinking agent, and (c) a polyfunctional epoxy resin;
       forming an etching resist on the copper foil of the integrated laminate, followed by formation of fine holes in the copper foil surface by selective etching;
       removing the remaining etching resist,
       removing the cured resin layer under the fine holes by etching using an etching solution comprising (A) an amide as a solvent, (B) an alkali metal compound, and (C) an alcohol as a solvent to form via holes and expose parts of the conductor circuits;
       plating a metal layer or coating an electroconductive paste so as to electrically connect the conductor circuits of the interlayer plate and the outer layer copper foil;
       forming an etching resist on the outer layer copper foil, followed by formation of wiring circuits on the copper foil by selective etching; and
       removing the remaining etching resist.

    Abstract translation: 一种多层印刷电路板的制造方法，其特征在于，在具有导体电路的层叠板上，在一侧具有铜箔的热固性铜包覆型粘合树脂片层叠，使所述片材的树脂侧与 夹层板，然后使树脂固化，得到一体化的叠层体，该热固性铜包覆粘合树脂片可以通过将铜箔与热固性环氧树脂组合物整合而得到，该组合物包含（a）重均分子量的环氧聚合物 可以通过以1:0.9至1:1.1的环氧基：酚羟基的当量重量的双官能环氧树脂和双官能卤代酚聚合获得，（b）交联剂，和（c） 多官能环氧树脂; 在一体化层叠体的铜箔上形成抗蚀剂，然后通过选择性蚀刻在铜箔表面形成细孔; 除去剩余的抗蚀剂，通过使用包含（A）酰胺作为溶剂的蚀刻溶液，（B）碱金属化合物和（C）作为溶剂的醇形成的蚀刻溶液通过蚀刻除去细孔下方的固化树脂层， 通孔和露出导体电路的部分; 电镀金属层或涂覆导电浆料，以便电连接层间板和外层铜箔的导体电路; 在外层铜箔上形成抗蚀剂，然后通过选择性蚀刻在铜箔上形成布线电路; 并除去剩余的蚀刻抗蚀剂

    Adhesive compositions and copper foil and copper clad laminates using same
    27.
    发明公开
    Adhesive compositions and copper foil and copper clad laminates using same 失效
    Klebstoffzusammensetzungen und damit hergestellte Kupferfolien und kupferkaschierte Schichtstoffplatten

    公开(公告)号：EP0691389A1

    公开(公告)日：1996-01-10

    申请号：EP95304380.9

    申请日：1995-06-22

    Applicant: GOULD ELECTRONICS INC.

    Inventor： Poutasse, Charles A.

    IPC: C09J163/00 ,  C08L63/00 ,  H05K3/38

    CPC classification number: H05K3/386 ,  C08G59/02 ,  C08G59/06 ,  C08G59/40 ,  C08L61/04 ,  C09J163/00 ,  H05K3/022 ,  H05K3/384 ,  H05K3/385 ,  H05K3/389 ,  H05K2201/0239 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0315 ,  H05K2203/0723 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/30 ,  Y10T428/31511 ,  Y10T428/31525 ,  Y10T428/31529 ,  Y10T428/31678

    Abstract: This invention relates to an adhesive composition, comprising: (A) at least one phenolic resole resin; and (B) the product made by reacting (B-1) at least one difunctional epoxy resin, with (B-2) at least one compound represented by the formula

    wherein in Formulae (I) and (II): G, T and Q are each independently functional groups selected from the group consisting of COOH, OH, SH, NH₂, NHR¹, (NHC(=NH)) m NH₂, RCOOH, NR¹₂, C(O)NHR¹, RNR¹₂, ROH, RSH, RNH₂ and RNHR¹, wherein R¹ is a hydrocarbon group, R is an alkylene or alkylidene group and m is a number in the range of 1 to about 4; T can also be R¹, OR¹ or SO₂C₆H₄-NH₂; and Q can also be H. The invention also relates to copper foils having the foregoing adhesive composition adhered to at least one side thereof to enhance the adhesion between said foils and dielectric substrates. The invention also relates to laminates comprising copper foil, a dielectric substrate, and an adhesion-promoting layer comprising the foregoing adhesive composition disposed between and adhered to the foil and the substrate.

    Abstract translation: 本发明涉及一种粘合剂组合物，其包含：（A）至少一种酚醛树脂树脂; 和（B）通过使（B-1）至少一种双官能环氧树脂与（B-2）至少一种由式（I）和（II）表示的化合物表示的至少一种化合物反应制得的产物：G ，T和Q各自独立地为选自COOH，OH，SH，NH 2，NHR 1，（NHC（= NH））m NH 2，R 2 COOH，NR 1 2，C （O）NHR 1，R 2 NR 12，R 2 OH，R 2 SH，R ​​2 NH 2和R 2 NHR 1，其中R 1， 是烃基，R 2是亚烷基或亚烷基，m是1至约4的数; T也可以是R 1，OR 1或SO 2 C 6 H 4 -NH 2; 并且Q也可以是H.本发明还涉及具有粘附到其至少一个侧面的上述粘合剂组合物的铜箔，以增强所述箔和电介质基底之间的粘附。 本发明还涉及包括铜箔，电介质基底和包含上述粘合剂组合物的粘合促进层的层压体，所述粘合剂组合物设置在箔和衬底之间并粘附到箔和衬底上。

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