公开(公告)号：EP1182919A2

公开(公告)日：2002-02-27

申请号：EP01119985.8

申请日：2001-08-18

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Uchiyama, Hiroshi ,  Hachimura, Tetsutarou ,  Okuda, Osamu ,  Yoshida, noriaki

IPC: H05K13/08

CPC classification number: H05K3/0008 ,  H05K1/0269 ,  H05K3/303 ,  H05K13/08 ,  H05K2201/09918 ,  H05K2201/10204

Abstract: An offset measuring board is formed of a rectangular metal plate which can be positioned to a component mounting position by a positioning device and which has at least in proximity to one corner portion thereof a recognition through hole, as a recognition mark, having a black bottom face within a recessed portion.

Abstract translation: 孔，以抵消测量板上形成的矩形金属板，其可通过定位装置被定位成一个部件安装位置和其具有至少在靠近一个角部上通过的识别，作为识别标志，具有黑色底 面对的凹部内。

公开(公告)号：EP0989794A2

公开(公告)日：2000-03-29

申请号：EP99307258.6

申请日：1999-09-14

Applicant: LUCENT TECHNOLOGIES INC.

Inventor： Roy, Apurba

IPC: H05K7/20

CPC classification number: H05K7/20509 ,  H05K1/0209 ,  H05K3/341 ,  H05K2201/09781 ,  H05K2201/10204

Abstract: In accordance with the invention, a plurality of high thermal conductivity bodies are bonded to relatively hot spots of a component-populated substrate surface to provide thermal conduction from the surface to an overlying thermal plane. The high conductivity bodies can be configured for pick-and-place application and self-aligned in solder bonding. Receiving solder pads on the substrate facilitate low thermal resistance solder bonding and self-alignment. In a preferred embodiment the bodies are rectangular parallelpipeds with bifurcated bonding surfaces.

Abstract translation: 根据本发明，多个高导热体被结合到组分填充的衬底表面的相对热点上以提供从表面到上覆热平面的热传导。 高导电体可以配置用于拾取和放置应用，并在焊接中自对准。 接收衬底上的焊盘有助于低热阻焊接和自对准。 在优选实施例中，主体是具有分叉结合表面的矩形平行镊子。

公开(公告)号：EP2624673B1

公开(公告)日：2017-12-06

申请号：EP10857881.6

申请日：2010-10-01

Applicant: Meiko Electronics Co., Ltd.

Inventor： TODA, Mitsuaki ,  IMAMURA, Yoshio ,  HASEGAWA, Takuya

IPC: H05K1/18 ,  H05K1/02

CPC classification number: H05K1/182 ,  H05K1/0269 ,  H05K1/188 ,  H05K3/32 ,  H05K2201/09918 ,  H05K2201/10204 ,  H05K2201/10636 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/4913

Abstract: A component-embedded substrate includes an electrically insulating base (11) of resin, an electric or electronic embedded component (8) and a dummy embedded component (7) both embedded in the insulating base (11), a conductor pattern (18) formed on at least one side of the insulating base (11) and connected directly to or indirectly via a connection layer (6) to the embedded component (8) and the dummy embedded component (7), and a mark (10) formed on a surface of the dummy embedded component (7) and used as a reference when the conductor pattern (18) is formed, whereby positional accuracy of the conductor pattern (18) relative to the embedded component (8) can be improved.

公开(公告)号：EP2624673A4

公开(公告)日：2014-12-03

申请号：EP10857881

申请日：2010-10-01

Applicant: MEIKO ELECTRONICS CO LTD

Inventor： TODA MITSUAKI ,  IMAMURA YOSHIO ,  HASEGAWA TAKUYA

IPC: H05K1/18 ,  H05K1/02

CPC classification number: H05K1/182 ,  H05K1/0269 ,  H05K1/188 ,  H05K3/32 ,  H05K2201/09918 ,  H05K2201/10204 ,  H05K2201/10636 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/4913

Abstract: A component-embedded substrate includes an electrically insulating base (11) of resin, an electric or electronic embedded component (8) and a dummy embedded component (7) both embedded in the insulating base (11), a conductor pattern (18) formed on at least one side of the insulating base (11) and connected directly to or indirectly via a connection layer (6) to the embedded component (8) and the dummy embedded component (7), and a mark (10) formed on a surface of the dummy embedded component (7) and used as a reference when the conductor pattern (18) is formed, whereby positional accuracy of the conductor pattern (18) relative to the embedded component (8) can be improved.

公开(公告)号：EP2624673A1

公开(公告)日：2013-08-07

申请号：EP10857881.6

申请日：2010-10-01

Applicant: Meiko Electronics Co., Ltd.

Inventor： TODA, Mitsuaki ,  IMAMURA, Yoshio ,  HASEGAWA, Takuya

IPC: H05K3/46 ,  H05K3/00

CPC classification number: H05K1/182 ,  H05K1/0269 ,  H05K1/188 ,  H05K3/32 ,  H05K2201/09918 ,  H05K2201/10204 ,  H05K2201/10636 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/4913

Abstract: A component-embedded substrate includes an electrically insulating base (11) of resin, an electric or electronic embedded component (8) and a dummy embedded component (7) both embedded in the insulating base (11), a conductor pattern (18) formed on at least one side of the insulating base (11) and connected directly to or indirectly via a connection layer (6) to the embedded component (8) and the dummy embedded component (7), and a mark (10) formed on a surface of the dummy embedded component (7) and used as a reference when the conductor pattern (18) is formed, whereby positional accuracy of the conductor pattern (18) relative to the embedded component (8) can be improved.

Abstract translation: 甲元器件内置基板包括在电绝缘树脂的基体（11）电气或电子部件内置（8）和一个虚设嵌入式组件（7）两个埋设于绝缘基座（11），导体图案（18）而形成 在绝缘基体（11）的至少一侧，并且直接连接到地或间接地经由到嵌入式组件的连接层（6）（8）和形成在所述虚设部件嵌入式（7），和标记（10） 虚设嵌入式组件（7）的表面，并用作参考当导体图案（18）形成，由此，导体图案的位置精度（18）相对于所述嵌入式组件（8）可以得到改善。

公开(公告)号：EP2283717B1

公开(公告)日：2012-03-28

申请号：EP09757212.7

申请日：2009-05-28

Applicant: Sartorius Weighing Technology GmbH

Inventor： WEITEMEIER, Swen ,  OLDENDORF, Christian

IPC: H05K1/02 ,  G01R31/3163

CPC classification number: G01R31/2815 ,  G01R31/2839 ,  G06F21/86 ,  H05K1/0275 ,  H05K2201/10151 ,  H05K2201/10204

Abstract: The invention relates to an electronic device comprising a circuit board (10), with a set of input contacts (IN/COM), a set of output contacts (OUT/COM) and an electrical circuit (18) connected between the input contacts (IN/COM) and the output contacts (OUT/COM) and a controller. The invention is characterised in that the controller carries out a real-time test of the circuit board by means of a test signal introduced into the electrical circuit, the electrical circuit (18) being designed as a passive source-specific, or individual circuit board network with at least one element with a capacitive action, wherein the capacitive element is a conductor surface (221) forming a capacitor in the assembled state with a corresponding conductor surface (222' '), on the device, connected to the electrical circuit (18) by means of a contact element in the assembled state, such that the capacitive value of the element with a capacitive action in the assembled state is different from the capacitive value thereof in the disassembled state.

公开(公告)号：EP2280593A1

公开(公告)日：2011-02-02

申请号：EP10171258.6

申请日：2010-07-29

Applicant: Rockwell Automation Technologies, Inc.

Inventor： Peterson, Corey A.

IPC: H05K3/34

CPC classification number: H05K3/3489 ,  B23K3/082 ,  H05K2201/10204 ,  H05K2203/0169 ,  H05K2203/162

Abstract: A fluxometer system and method is provided. The fluxometer comprises a frame, a simulated circuit board disposed in the frame and having a plurality of holes formed therein extending generally transverse to a plane of the board and a cover. The cover is received on the frame over the simulated circuit board and includes several protrusions simulating leads that extend into the holes of the simulated circuit board. The fluxometer further includes an indicator sheet disposed between the simulated circuit board and the cover, the protrusions extending through the indicator sheet.

Abstract translation: 提供了流量计系统和方法。 流量计包括框架，设置在框架中的模拟电路板，并且具有形成在其中的多个孔，其大致横向于板的平面和盖。 覆盖物被接收在模拟电路板上的框架上，并且包括模拟延伸到模拟电路板的孔中的引线的几个突起。 流量计还包括设置在模拟电路板和盖之间的指示片，突出部延伸穿过指示片。

公开(公告)号：EP2276329A1

公开(公告)日：2011-01-19

申请号：EP09165670.2

申请日：2009-07-16

Applicant: ABB Research Ltd.

Inventor： Coppola, Luisa ,  Fabbri, Matteo ,  Schmidt, Roland ,  Cottet, Didier

IPC: H05K1/02

CPC classification number: H05K1/0209 ,  H05K2201/066 ,  H05K2201/09736 ,  H05K2201/09781 ,  H05K2201/10204

Abstract: The invention relates to an electronic circuit board comprising at least one conductor path (6, 6') and at least one component (3) which is one of an electronic component, electric component and heat emitting component and which is connected to said conductor path (6, 6'). At least one thermal capacitor (4) is thermally connected to said conductor (6) in vicinity to said at least one component (3), wherein the at least one thermal capacitor (4) is suitable for transmitting and/or buffering thermal energy of the at least one component.

Abstract translation: 本发明涉及一种电子电路板，其包括至少一个导体路径（6,6'）和至少一个组件（3），该组件（3）是电子部件，电气部件和发热部件之一，并且连接到所述导体路径 （6,6'）。 至少一个热电容器（4）在所述至少一个部件（3）附近热连接到所述导体（6），其中所述至少一个热电容器（4）适于传输和/或缓冲 该至少一个部件。

公开(公告)号：EP1687114A4

公开(公告)日：2008-10-29

申请号：EP04781932

申请日：2004-08-23

Applicant: MOTOROLA INC

Inventor： WEIGLER WILLIAM C ,  BABULA ROBERT ,  HERBOLD JAMES E ,  GALL THOMAS P ,  SHARKEY STEVEN G

IPC: B23K1/00 ,  B23K1/018 ,  H01L21/48 ,  H05K3/34 ,  H05K3/42 ,  H05K13/04

CPC classification number: H05K3/3457 ,  B23K1/018 ,  B23K2201/42 ,  H01L24/11 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/11334 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/0101 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K3/42 ,  H05K2201/10204 ,  H05K2203/046 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A method for vertical removal of excess solder from a circuit substrate includes the use of a sacrificial circuit substrate (60) with a plurality of pads and vias that are solder-wettable. The pads and vias of the sacrificial circuit substrate are placed (64) in vertical proximity to the excess solder of the circuit substrate. The excess solder is heated (66) until it is liquid, wherein the excess solder is wicked (68) vertically onto the pads and into the vias of the sacrificial circuit substrate. Thereafter, the sacrificial circuit substrate is lifted (70) from the proximity of the circuit substrate while the solder is in a liquid, taking the excess solder with it but leaving a predetermined amount on the circuit substrate.

公开(公告)号：EP1098368A4

公开(公告)日：2007-08-15

申请号：EP00915469

申请日：2000-04-11

Applicant: MATSUSHITA ELECTRIC IND CO LTD

Inventor： KIMURA SUZUSHI ,  HIMORI TSUYOSHI ,  HASHIMOTO KOJI

IPC: H01L23/538 ,  H01L25/16 ,  H05K1/02 ,  H05K1/18 ,  H05K3/40 ,  H05K3/46 ,  H01L25/00 ,  H01L21/56 ,  H01L23/12 ,  H05K3/00

CPC classification number: H05K1/184 ,  H01L23/5383 ,  H01L23/5386 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16265 ,  H01L2224/73204 ,  H01L2924/01078 ,  H01L2924/19103 ,  H01L2924/19105 ,  H05K1/023 ,  H05K1/0231 ,  H05K1/185 ,  H05K3/4046 ,  H05K3/4602 ,  H05K2201/09118 ,  H05K2201/09827 ,  H05K2201/10204 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2203/1469 ,  H05K2203/161 ,  Y02P70/611 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49172

Abstract: A module component in which chip parts are embedded in a circuit board and a method of manufacturing of the same. The module component can have desired circuit characteristics and functions stably even if the size of a part is miniaturized, is produced with high efficiency, and suitable for mechanical mounting. Since a desired circuit is formed by arranging a prescribed number of parts according to a prescribed rule, no heat treatment of embedded parts is required when making a module. Since each chip part has values conforming to the specifications, the circuit characteristic, functions and dimensional accuracy or the like can be stably obtained as designed. Since the chip parts are arranged according to the prescribed rule, insertion of the chip parts can be easily automated and speeded up, and miniaturization of the chip parts is coped with sufficiently. Moreover, the circuit structure can be changed flexibly and easily only by changing the insertion positions and types of chip parts.