公开(公告)号：EP1427013A3

公开(公告)日：2004-07-07

申请号：EP04005427.2

申请日：2000-09-20

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Haupt, Detlef ,  Maurer, Thomas

IPC: H01L23/367 ,  H05K1/02

CPC classification number: H01L23/367 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K3/0061 ,  H05K3/341 ,  H05K2201/0373 ,  H05K2201/0969 ,  H05K2201/10416 ,  H05K2201/10689 ,  H05K2201/10772 ,  H01L2924/00

Abstract: Das Steuergerät (20) ist mit einem elektrischen Bauelement (2) bestückt, in dem Wärme erzeugt wird. Diese wird über ein längliches Metallteil (21) abgeführt wird, dessen eine Stirnfläche (22) mit dem Bauelement (2) verlötet ist. Die dem Bauelement (2) zugewandte Stirnfläche (22) weist eine ihre Oberfläche vergrößernde Gestalt auf. Sie ist nach außen gewölbt ausgebildet und kann mit einer Riffelung versehen sein.

公开(公告)号：EP1214741A2

公开(公告)日：2002-06-19

申请号：EP00963990.7

申请日：2000-09-20

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： MAURER, Thomas ,  HAUPT, Detlef

IPC: H01L23/367

CPC classification number: H01L23/367 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K3/0061 ,  H05K3/341 ,  H05K2201/0373 ,  H05K2201/0969 ,  H05K2201/10416 ,  H05K2201/10689 ,  H05K2201/10772 ,  H01L2924/00

Abstract: The control device (1) is equipped with an electrical component (2) in which heat is generated. Said heat is dissipated over an elongated metal part (10) whose one face (12) is soldered to the component (2). The face (12) oriented toward the component (2) has a shape that increases the size of its surface. The shape is outwardly arched and can be provided with a ribbing.

公开(公告)号：EP1121005A1

公开(公告)日：2001-08-01

申请号：EP00610009.3

申请日：2000-01-25

Applicant: TELEFONAKTIEBOLAGET LM ERICSSON (publ)

Inventor： Axelsson, Christian ,  Renmark, Ulrika

IPC: H05K3/30 ,  H05K3/34

CPC classification number: H05K3/301 ,  H05K3/341 ,  H05K2201/10772 ,  Y02P70/613

Abstract: A component carrier for an electronic component, said component carrier being made in one piece of a metal sheet material and provided with means for surface mounting on a printed circuit board (PCB) and with holding flanges (2a, 2b) for holding an electronic component. The component carrier has a base (1) provided with a central soldering platform for surface mounting on the PCB. The holding flanges (2a, 2b) extend from the base (1) and are connected to the base (1) via tongues (4a-4d) of the metal sheet material, said tongues (4a-4d) extending in a plane parallel with the base (1).

Abstract translation: 一种用于电子部件的部件载体，所述部件载体制成一片金属片材料，并且具有用于表面安装在印刷电路板（PCB）上的装置和用于保持电子部件的保持凸缘（2a，2b） 。 部件载体具有设置有用于表面安装在PCB上的中心焊接平台的基座（1）。 保持凸缘（2a，2b）从基座（1）延伸，并通过金属片材的舌片（4a-4d）与基座（1）连接，所述舌片（4a-4d）在平行于 基座（1）。

公开(公告)号：EP1044082A1

公开(公告)日：2000-10-18

申请号：EP98956935.5

申请日：1998-11-19

Applicant: Leica Geosystems AG ,  MTA Automation AG

Inventor： REMY DE GRAFFENRIED, Christian

IPC: B23K1/005

CPC classification number: B23K1/0056 ,  B23K2201/40 ,  G02B6/4238 ,  G02B7/00 ,  H05K3/341 ,  H05K3/3494 ,  H05K2201/0373 ,  H05K2201/10772 ,  H05K2201/10969 ,  H05K2203/101 ,  Y02P70/613 ,  Y10T29/4913

Abstract: The invention relates to a method for fixing an especially modularly mounted, miniaturised component (2) onto a base plate (1) by means of a soldered joint. One side (4) of the component (2) is coated with a layer (5) of soldering material and the base plate (1) is coated at least partially with a layer of metal (6, 6', 6''). The component (2) is positioned above the base plate (1) with the metal layer and the layer of soldering material (5) facing each other without touching, at a vertical distance from each other. Heat energy is then supplied from the side of the base plate (1) in order to melt the soldering material of the soldering material layer (5) on the side (4) of the component (2) until a drop is formed. The component (2) and the base plate (1) are mutually fixed to each other when the drop of soldering material (5') fills the gap between them.

公开(公告)号：EP0749674B1

公开(公告)日：1999-01-20

申请号：EP95913541.9

申请日：1995-03-09

Applicant: THE PANDA PROJECT

Inventor： CRANE, Stanford, W., Jr. ,  PORTUONDO, Maria, M.

IPC: H05K3/34 ,  H05K3/40

CPC classification number: H01L23/49861 ,  H01L23/49811 ,  H01L2924/0002 ,  H01L2924/181 ,  H05K1/112 ,  H05K3/308 ,  H05K3/321 ,  H05K3/3421 ,  H05K3/4623 ,  H05K2201/09472 ,  H05K2201/09536 ,  H05K2201/09645 ,  H05K2201/10189 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10704 ,  H05K2201/10772 ,  H05K2201/10893 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An apparatus comprising a multi-layer substrate (10) including a plurality of layers of insulative material (12), at least one well (15) formed in at least one of the layers, the well (15) extending from an outer surface of the multi-layer substrate to an inner surface of the multi-layer substrate, and an electrically conductive component (13) formed within the well (15) on the inner surface of the multi-layer substrate; and a device having at least one electrically conductive lead or wire (11) extending into the well (15) and being in direct physical contact with the electrically conductive component (13) formed on the inner surface of the multi-layer substrate. Also, a method of manufacturing an apparatus comprising the steps of forming a multi-layer substrate (10) including a plurality of layers of insulative material (12), at least one well (15) formed in at least one of the layers, the well (15) extending from an outer surface of the multi-layer substrate to an inner surface of the multi-layer substrate, and an electrically conductive component (13) formed within the well (15) on the inner surface of the multi-layer substrate; and extending at least one electrically conductive lead or wire (11) from a device into the well (15) such that the lead or wire is in direct physical contact with the electrically conductive component (13) formed on the inner surface of the multi-layer substrate.

Abstract translation: 半导体管芯封装（30）包括多个导电引线（11）和用于承载电信号的多层结构（10），所述多层结构（10）包括多层绝缘材料（12a-12d） ），每个层包括在该层的相对侧上的第一表面和第二表面。 每个引线（11）延伸到完全延伸通过至少一个层的对应的阱（15），并且在一个层的一个表面上底部，阱（15）不通过该表面延伸并且电耦合 涉及形成在其对应的井（15）内的导电接合结构（13）。

公开(公告)号：EP0783775A1

公开(公告)日：1997-07-16

申请号：EP95937430.0

申请日：1995-09-28

Applicant: NORTH AMERICAN SPECIALITIES CORPORATION

Inventor： SEIDLER, Jack ,  POLLOCK, Leonard, J.

IPC: H01R12 ,  H01R43 ,  H05K3 ,  H01R4

CPC classification number: H01R12/57 ,  H01R4/02 ,  H01R43/0256 ,  H05K3/3405 ,  H05K3/3426 ,  H05K3/3478 ,  H05K2201/10386 ,  H05K2201/10772 ,  H05K2201/10984 ,  Y02P70/613

Abstract: A solder-bearing metallic (114), and methods of fabricating and using it, where the lead is formed with a solder-retaining portion (125) having a cross-sectional profile with undercuts, which may be in a V-shape or flat, where solder (133) surrounds said solder-retaining portion and undercuts, and extends outwardly from the lead while leaving a portion of the lead uncovered by solder to permit the lead metal to form direct contact with a susbstrate or other conductive pad.

公开(公告)号：EP0749674A1

公开(公告)日：1996-12-27

申请号：EP95913541.0

申请日：1995-03-09

Applicant: THE PANDA PROJECT

Inventor： CRANE, Stanford, W., Jr. ,  PORTUONDO, Maria, M.

IPC: H05K1 ,  H01L23 ,  H05K3

CPC classification number: H01L23/49861 ,  H01L23/49811 ,  H01L2924/0002 ,  H01L2924/181 ,  H05K1/112 ,  H05K3/308 ,  H05K3/321 ,  H05K3/3421 ,  H05K3/4623 ,  H05K2201/09472 ,  H05K2201/09536 ,  H05K2201/09645 ,  H05K2201/10189 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10704 ,  H05K2201/10772 ,  H05K2201/10893 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An apparatus comprising a multi-layer substrate (10) including a plurality of layers of insulative material (12), at least one well (15) formed in at least one of the layers, the well (15) extending from an outer surface of the multi-layer substrate to an inner surface of the multi-layer substrate, and an electrically conductive component (13) formed within the well (15) on the inner surface of the multi-layer substrate; and a device having at least one electrically conductive lead or wire (11) extending into the well (15) and being in direct physical contact with the electrically conductive component (13) formed on the inner surface of the multi-layer substrate. Also, a method of manufacturing an apparatus comprising the steps of forming a multi-layer substrate (10) including a plurality of layers of insulative material (12), at least one well (15) formed in at least one of the layers, the well (15) extending from an outer surface of the multi-layer substrate to an inner surface of the multi-layer substrate, and an electrically conductive component (13) formed within the well (15) on the inner surface of the multi-layer substrate; and extending at least one electrically conductive lead or wire (11) from a device into the well (15) such that the lead or wire is in direct physical contact with the electrically conductive component (13) formed on the inner surface of the multi-layer substrate.