公开(公告)号：EP1459408A1

公开(公告)日：2004-09-22

申请号：EP02799351.8

申请日：2002-12-30

Applicant: MOLEX INCORPORATED

Inventor： BRUNKER, David, L. ,  DAWIEDCZYK, Daniel, L. ,  LOPATA, John, E. ,  DUTTA, Arindum

IPC: H01P3/02 ,  H01R12/16

CPC classification number: H05K1/024 ,  H01P3/02 ,  H01R12/716 ,  H01R12/79 ,  H01R13/658 ,  H05K1/0284 ,  H05K1/145 ,  H05K3/107 ,  H05K3/403 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2201/09236 ,  H05K2201/09645 ,  H05K2201/09981 ,  H05K2201/10189 ,  H05K2201/10893

Abstract: Termination assemblies for terminating high-frequency data signal transmission lines include housings with one or more cavities that receive ends of the transmission line therein. The transmission line typically includes a dielectric body and a plurality of conductive elements disposed thereon, with the plurality of conductive elements being arranged in pairs for differential signal transmission. The termination assemblies, in one embodiment include hollow end caps that are formed from a dielectric and which have one or more conductive contacts or plated surfaces disposed on or within the cavity so that they will frictionally mate with the conductive traces on the transmission line. In another embodiment, a connector housing is provided with a center slot and a plurality of dual loop contacts to provide redundant circuit paths and low inductance to the termination assembly. A coupling element may be utilized in the slot to achieve a desired level of coupling between the termination contacts.

公开(公告)号：EP1191635B1

公开(公告)日：2009-01-14

申请号：EP01122202.3

申请日：2001-09-17

Applicant: NISSAN MOTOR CO., LTD.

Inventor： Murakami, Yoshinori

IPC: H01R12/04 ,  H05K3/36 ,  H05K7/14

CPC classification number: H05K3/368 ,  H01L2224/48091 ,  H01L2224/49111 ,  H01L2924/13091 ,  H01R12/52 ,  H05K1/0216 ,  H05K1/145 ,  H05K1/148 ,  H05K1/162 ,  H05K3/36 ,  H05K2201/0792 ,  H05K2201/09672 ,  H05K2201/1028 ,  H05K2201/10818 ,  H05K2201/10893 ,  H01L2924/00014 ,  H01L2924/00

公开(公告)号：EP1191635A3

公开(公告)日：2003-10-15

申请号：EP01122202.3

申请日：2001-09-17

Applicant: NISSAN MOTOR CO., LTD.

Inventor： Murakami, Yoshinori

IPC: H01R12/04 ,  H05K3/36 ,  H05K7/14

CPC classification number: H05K3/368 ,  H01L2224/48091 ,  H01L2224/49111 ,  H01L2924/13091 ,  H01R12/52 ,  H05K1/0216 ,  H05K1/145 ,  H05K1/148 ,  H05K1/162 ,  H05K3/36 ,  H05K2201/0792 ,  H05K2201/09672 ,  H05K2201/1028 ,  H05K2201/10818 ,  H05K2201/10893 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An interconnect structure has a plurality of planar interconnects (1, 2) mutually superposed with a prescribed distance therebetween and serving as interconnects between two circuit boards (A, B), each of the planar interconnects (1, 2) having at least two connection terminals (1A, 1B, 2A, 2B) at the circuit boards (1, 2). Rather than using rigid wire interconnects as done in the past to make interconnections, planar interconnects having relatively large surface areas are used to increase the line-to-line capacitance, thereby enhancing the filtering function that reduces high-frequency noise.

Abstract translation: 互连结构具有多个互相重叠的平面互连（1,2），它们之间具有规定的距离并且用作两个电路板（A，B）之间的互连，每个平面互连（1,2）具有至少两个连接 在电路板（1,2）处的端子（1A，1B，2A，2B）。 与过去使用刚性导线互连进行互连相比，使用具有相对较大表面积的平面互连来增加线间电容，从而增强了降低高频噪声的滤波功能。

公开(公告)号：EP0467698A3

公开(公告)日：1992-07-15

申请号：EP91306594.2

申请日：1991-07-19

Applicant: NORTHERN TELECOM LIMITED

Inventor： Barnhouse, Robert L. ,  Estes, H. Scott

IPC: H05K3/42

CPC classification number: H05K3/403 ,  H05K3/0047 ,  H05K3/043 ,  H05K3/061 ,  H05K3/108 ,  H05K3/308 ,  H05K3/427 ,  H05K2201/09181 ,  H05K2201/09645 ,  H05K2201/10295 ,  H05K2201/10893 ,  H05K2203/0557

Abstract: A printed circuit board having holes provided with two or more electrical conductors (16,34) on the surface of each hole. The conductors are circumferentially spaced apart around each hole so as to electrically isolate them from one another and each conductor is connected to an individual circuit line of the board. The conductors may be through-hole conductors. Alternatively, the holes are pin receiving holes for insertion of pins having two or more conductor lines for electrical contact with the conductors within the holes.

Abstract translation: 一种印刷电路板，具有在每个孔的表面上设置有两个或多个电导体（16,34）的孔。 导体围绕每个孔周向间隔开，以便将它们彼此电隔离，并且每个导体连接到板的单独电路线。 导体可以是通孔导体。 或者，孔是用于插入具有两个或更多个导线的销的销接收孔，用于与孔内的导体电接触。

公开(公告)号：EP2332396A1

公开(公告)日：2011-06-15

申请号：EP09781217.6

申请日：2009-07-29

Applicant: Robert Bosch GmbH

Inventor： STRUCHHOLZ, Michael ,  JOBERT, Tristan ,  OFFTERDINGER, Klaus ,  KLAUS, Thomas ,  DITTMANN, Dirk

IPC: H05K3/34

CPC classification number: H01L23/495 ,  G01L19/0084 ,  H01L23/49558 ,  H01L2924/0002 ,  H05K3/303 ,  H05K3/3426 ,  H05K2201/09781 ,  H05K2201/10151 ,  H05K2201/10689 ,  H05K2201/10893 ,  Y02P70/613 ,  H01L2924/00

Abstract: The present invention relates to a housing for an electrical circuit, particularly for a sensor, wherein pins protrude from the housing for electrically contacting the circuit, wherein additional pins are provided which are not electrically connected to the circuit, but rather are used as mechanical fastening means of the housing particularly on a circuit board. The present invention further relates to a housing having an electrical circuit, particularly a sensor, wherein pins protrude from the housing for electrically contacting the circuit, wherein at least two pins are mechanically connected to each other through a connecting piece.

公开(公告)号：EP1855512B1

公开(公告)日：2011-06-08

申请号：EP07105046.2

申请日：2007-03-27

Applicant: Siemens Aktiengesellschaft

Inventor： Petricek, Martin

IPC: H05K1/14 ,  H05K3/36 ,  H01R12/51

CPC classification number: H01R12/515 ,  H01R12/57 ,  H05K3/325 ,  H05K2201/10409 ,  H05K2201/10651 ,  H05K2201/10893 ,  H05K2203/167

公开(公告)号：EP1191635A2

公开(公告)日：2002-03-27

申请号：EP01122202.3

申请日：2001-09-17

Applicant: NISSAN MOTOR CO., LTD.

Inventor： Murakami, Yoshinori

IPC: H01R12/04

CPC classification number: H05K3/368 ,  H01L2224/48091 ,  H01L2224/49111 ,  H01L2924/13091 ,  H01R12/52 ,  H05K1/0216 ,  H05K1/145 ,  H05K1/148 ,  H05K1/162 ,  H05K3/36 ,  H05K2201/0792 ,  H05K2201/09672 ,  H05K2201/1028 ,  H05K2201/10818 ,  H05K2201/10893 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An interconnect structure has a plurality of planar interconnects (1, 2) mutually superposed with a prescribed distance therebetween and serving as interconnects between two circuit boards (A, B), each of the planar interconnects (1, 2) having at least two connection terminals (1A, 1B, 2A, 2B) at the circuit boards (1, 2). Rather than using rigid wire interconnects as done in the past to make interconnections, planar interconnects having relatively large surface areas are used to increase the line-to-line capacitance, thereby enhancing the filtering function that reduces high-frequency noise.

Abstract translation: 互连结构具有多个平面互连（1,2），它们之间具有规定距离并且彼此叠置并且用作两个电路板（A，B）之间的互连，每个平面互连（1,2）具有至少两个连接 电路板（1,2）上的端子（1A，1B，2A，2B）。 不像以往那样使用刚性的电线互连来形成互连，而是使用具有相对大的表面积的平面互连来增加线对线电容，从而增强降低高频噪声的滤波功能。

公开(公告)号：EP2865052A1

公开(公告)日：2015-04-29

申请号：EP13806722.8

申请日：2013-06-19

Applicant: Lexmark International, Inc.

Inventor： HARDIN, Keith, Bryan ,  HALL, Paul, Kevin ,  KRATZER, Zachary, Charles, Nathan ,  ZHANG, Qing ,  FESSLER, John, Thomas

IPC: H01R12/58

CPC classification number: H05K3/301 ,  H05K1/0222 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/0251 ,  H05K1/0298 ,  H05K1/184 ,  H05K3/306 ,  H05K3/4046 ,  H05K2201/09645 ,  H05K2201/09809 ,  H05K2201/10015 ,  H05K2201/10893 ,  H05K2201/10984 ,  Y10T29/4913 ,  Y10T29/49135

Abstract: A Z-directed component for mounting in a mounting hole in a printed circuit board according to one example embodiment includes a main body portion and a tapered end portion that facilitates insertion of the Z-directed component into the mounting hole in the printed circuit board. The tapered end portion is removably attached to the main body portion such that the tapered end portion may be removed after the Z-directed component is inserted into the mounting hole in the printed circuit board. A method for installing a Z-directed component having a removable tapered lead-in into the mounting hole according to one example embodiment includes inserting the Z- directed component into the mounting hole in the printed circuit board with the removable tapered lead-in leading the insertion and after the Z-directed component is inserted into the mounting hole, removing the removable lead-in from the rest of the Z-directed component.

Abstract translation: 根据一个示例性实施例的用于安装在印刷电路板的安装孔中的Z指向部件包括主体部分和锥形端部，其有助于将Z定向部件插入到印刷电路板中的安装孔中。 锥形端部可移除地附接到主体部分，使得在Z指向部件插入印刷电路板的安装孔中之后，锥形端部可以被移除。 根据一个示例性实施例的用于将具有可移除的锥形引入件的Z指向部件安装到安装孔中的方法包括将Z定向部件插入印刷电路板中的安装孔中，其中可移除的锥形引入引导 插入，并且在将Z定向部件插入到安装孔中之后，从Z定向部件的其余部分移除可移除引入线。

公开(公告)号：EP1855512A1

公开(公告)日：2007-11-14

申请号：EP07105046.2

申请日：2007-03-27

Applicant: Siemens AG Österreich

Inventor： Petricek, Martin

IPC: H05K1/14 ,  H05K3/36 ,  H01R12/04

CPC classification number: H01R12/515 ,  H01R12/57 ,  H05K3/325 ,  H05K2201/10409 ,  H05K2201/10651 ,  H05K2201/10893 ,  H05K2203/167

Abstract: Die Erfindung betrifft eine Anordnung einer Leiterplatte (1) und einem dazu in einem festen Abstand gehaltenen Kontaktträger, bei welcher eine dem Kontaktträger zugewandte Anschlussfläche (4) der Leiterplatte (1) mit einem an dem Kontaktträger ausgebildeten Gegenkontakt mittels einer Kontaktbrücke (2) elektrisch leitend verbunden ist, wobei die Kontaktbrücke (2) als Kunststoffteil (6) mit wenigstens einem von diesem Kunststoffteil (6) gehaltenen Drahtelement (5a, 5b) ausgebildet ist und wobei ein Ende des wenigstens einen Drahtelements (5a, 5b) auf einer Stirnfläche des Kunststoffteils (6) aufliegt und wobei des Weiteren der Kunststoffteil (6) mit der Leiterplatte (1) in der Weise mittels einer Verschraubung verbunden ist, dass das Ende des wenigstens einen Drahtelements (5a, 5b) zwischen Stirnfläche des Kunststoffteils (6) und Anschlussfläche (4) der Leiterplatte (1) geklemmt ist.

Abstract translation: 该装置具有一个接触桥（2）设计为塑料部件（6）包括线单元（5A，5B），其中在单元的导线的一端位于所述塑料部的前表面上。 塑料部件通过使用检查的螺纹连接与印刷电路板（1），其连接做了线单元的端部的塑料部件的前表面和所述印刷电路板的连接面之间。

公开(公告)号：EP1476914A1

公开(公告)日：2004-11-17

申请号：EP02806282.6

申请日：2002-12-30

Applicant: MOLEX INCORPORATED

Inventor： BRUNKER, David ,  DAWIEDCZYK, Daniel, L. ,  LOPATA, John, E. ,  DUTTA, Arindum

IPC: H01P3/02

CPC classification number: H05K1/024 ,  H01P3/02 ,  H01R12/716 ,  H01R12/79 ,  H01R13/658 ,  H05K1/0284 ,  H05K1/145 ,  H05K3/107 ,  H05K3/403 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2201/09236 ,  H05K2201/09645 ,  H05K2201/09981 ,  H05K2201/10189 ,  H05K2201/10893

Abstract: An engineered transmission line for transmitting high-frequency data signal s between two points of connection includes a dielectric body and a plurality of conductive elements disposed thereon, with the plurality of conductive elements being arranged in pairs for differential signal transmission. In one embodiment, the dielectric body is solid and has its conductive elements supported on its exterior surface. In another embodiment, the dielectric body is extruded and has grooves or raised lands formed therein. The grooves or lands support conductive elements formed thereon by a suitable plating process. A ground plane may be provided as a base layer of the dielectric body. Enlarged conductive surfaces may also be provided on the body which have a greater surface area than those intended for use with the signal channels. The enlarged surfaces are utilized to carry power.