公开(公告)号：EP0137981B1

公开(公告)日：1991-08-07

申请号：EP84110077.9

申请日：1984-08-23

Applicant: SHIPLEY COMPANY INC.

Inventor： Deckert, Cheryl A. ,  Couble, Edward C. ,  Bonetti, William F.

IPC: H05K3/42 ,  H05K3/38 ,  C23C18/22

CPC classification number: H05K3/381 ,  C23C18/22 ,  H05K3/0055 ,  H05K2203/0783 ,  H05K2203/0793 ,  H05K2203/0796

公开(公告)号：EP0421123A1

公开(公告)日：1991-04-10

申请号：EP90116660.3

申请日：1990-08-30

Applicant: SHIPLEY COMPANY INC.

Inventor： Rychwalski, James ,  Ciccolo, Paul J. ,  Couble, Edward C.

IPC: C23C18/26

CPC classification number: C23C26/00 ,  C23C18/26 ,  H05K1/0346 ,  H05K3/181 ,  H05K3/381 ,  Y10T428/31681

Abstract: A process for promoting the adhesion of metal to thermoplastic substrates such as polyimides. The improvement comprises conditioning the substrate by treating with a lactone and aqueous rinse prior to subsequent steps of etching and deposition of a metal coating. Use of the conditioner promotes increased adhesion between the substrate and the metal without loss of the cohesive integrity of the substrate throughout subsequent processing steps.

Abstract translation: 促进金属与热塑性基材如聚酰亚胺粘合的方法。 改进之处在于在蚀刻和沉积金属涂层之后的步骤之前，用内酯和含水漂洗液处理底物。 使用这种调理剂促进了基材和金属之间增加的粘合性，而在后续的加工步骤中不损失基材的内聚完整性。

公开(公告)号：EP0273026A3

公开(公告)日：1990-06-13

申请号：EP87870199.4

申请日：1987-12-22

Applicant: SHIPLEY COMPANY INC.

Inventor： Daniels, Brian Kenneth ,  Madoux, David Charles ,  Templeton, Michael Karpovich ,  Trefonas III, Peter ,  Woodbrey, James Calvin ,  Zampani, Anthony

IPC: G03F7/004 ,  G03F7/022

CPC classification number: G03F7/0226 ,  G03F7/0048 ,  G03F7/022

Abstract: This invention is directed to novel photoresist processes and compositions having high resolution novalac resins, high resolution photoactive components with several diazoquinone groups per molecule, and solvents having a high solvency power, better safety, improved photospeed, higher contrast and equivalent cast film thickness from lower percent sofids formulations.

公开(公告)号：EP0320601A3

公开(公告)日：1990-04-25

申请号：EP88117392.6

申请日：1988-10-19

Applicant: SHIPLEY COMPANY INC.

Inventor： Gulla, Michael ,  Foust, Donald F. ,  Philipose, George K.

IPC: C25D5/54

CPC classification number: C25D5/54 ,  H05K3/188 ,  H05K3/424 ,  H05K3/427 ,  H05K2203/0716 ,  Y10S205/92

Abstract: A method for metal plating the surface of an article formed from an organic plastic. The method includes a step of passing a current between two electrodes immersed in an electrolyte containing dissolved plating metal. One of the electrodes is the article to be plated and is provided with a surface having areas of a transition metal sulfide adjacent to and in contact with conductive areas. The method is especially useful for the formation of printed circuit boards and is sufficiently versatile to permit formation of a printed circuit board by a process that involves pattern plating.

公开(公告)号：EP0326655A1

公开(公告)日：1989-08-09

申请号：EP88117391.8

申请日：1988-10-19

Applicant: SHIPLEY COMPANY INC.

Inventor： Rodriguez, Stephen S. ,  Harris, Martin J. ,  Smith, Wayne T. University of Pennsylvania

IPC: C25D13/22

CPC classification number: H05K3/0091 ,  C25D13/22 ,  H05K2203/135 ,  H05K2203/1518 ,  H05K2203/1572

Abstract: A method and apparatus for electrodeposition of insulating coatings such as photoresists having uniform thickness throughout the coating. The apparatus comprises one or more cathodes (30) disposed in a bath containing an electrophoretic depositing composition (50), one or more anodes (10) disposed in said bath in face to face relationship with the cathode, and means for applying a voltage between the anode and the cathode to produce a current whereby a current density gradient is formed on the cathode, the gradient comprising high and low current density areas. The anode is concentrated opposite the high current density areas of the cathode, thereby controlling the thickness of deposition by controlling the amount of current flowing to the cathode.

Abstract translation: 一种用于电沉积绝缘涂层的方法和装置，例如在整个涂层中具有均匀厚度的光致抗蚀剂。 该装置包括设置在包含电泳沉积组合物（50）的浴中的一个或多个阴极（30），与阴极面对面地设置在所述浴中的一个或多个阳极（10），以及用于在阴极之间施加电压的装置 阳极和阴极产生电流，由此在阴极上形成电流密度梯度，梯度包括高电流和低电流密度区域。 阳极与阴极的高电流密度区域相反地集中，从而通过控制流向阴极的电流量来控制沉积厚度。

公开(公告)号：EP0313013A2

公开(公告)日：1989-04-26

申请号：EP88117390.0

申请日：1988-10-19

Applicant: SHIPLEY COMPANY INC.

Inventor： Ausschnitt, Christopher P. ,  McFadden, Edward A. ,  Tan, Raul V.

IPC: B41M1/06

CPC classification number: G03F7/70558 ,  G03F7/70641 ,  G03F7/708

Abstract: A lithographic process analysis and control system which provides a modeled version of a lithographic process in the dimensions of feature width, focus and exposure. This system uses the model to quickly determine the range of focus and exposure limits for obtaining the desired feature width. The system has flexible graphic display capability for displaying graphic representations of the data as measured and modeled.

Abstract translation: 光刻工艺分析和控制系统，其提供了特征宽度，焦距和曝光尺寸的光刻工艺的建模版本。 该系统使用该模型来快速确定获得所需特征宽度的焦距范围和曝光极限。 该系统具有灵活的图形显示功能，用于显示测量和建模的数据的图形表示。

公开(公告)号：EP0309682A2

公开(公告)日：1989-04-05

申请号：EP88112223.8

申请日：1988-07-28

Applicant: SHIPLEY COMPANY INC.

Inventor： Fisher, Thomas A.

IPC: G03F7/26 ,  G03F7/08

CPC classification number: G03F7/36 ,  G03F7/0226 ,  Y10S438/948 ,  Y10T428/24802

Abstract: The invention provides a method for forming a photoresist mask on a substrate resistant to reticulation during plasma etching. The method comprises the steps of forming an imaged and developed photoresist coating over an integrated circuit substrate where the photoresist contains an essentially unreacted acid activated cross linking agent, and subjecting said substrate to an etching plasma in a gaseous stream that contains a Lewis acid. Contact of the surface of the photoresist film with the Lewis acid causes cross linking of the surface of the photoresist film during plasma etching with the formation of a reticulation resistant surface layer.

Abstract translation: 本发明提供了一种在等离子体蚀刻过程中在抗网状结构的衬底上形成光刻胶掩模的方法。 该方法包括以下步骤：在集成电路衬底上形成成像和显影的光致抗蚀剂涂层，其中光致抗蚀剂含有基本上未反应的酸活化的交联剂，并使所述衬底在含有路易斯酸的气流中经受蚀刻等离子体。 光致抗蚀剂膜表面与路易斯酸的接触导致在等离子体蚀刻期间光致抗蚀剂膜表面的交联与形成抗网状表面层。

公开(公告)号：EP0298298A2

公开(公告)日：1989-01-11

申请号：EP88109859.4

申请日：1988-06-21

Applicant: SHIPLEY COMPANY INC.

Inventor： Bladon, Dr. John J.

IPC: C25D5/54 ,  C23C18/00 ,  H05K3/18

CPC classification number: C25D5/54 ,  H05K3/188 ,  H05K3/424 ,  H05K3/427 ,  H05K2203/0716

Abstract: A method for metal plating the surface of an article formed from a nonconductor. The method includes a step of passing a current between two electrodes immersed in an electrolyte containing dissolved plating metal. One of the electrodes is the article to be plated and is provided with a surface having areas of a catalytic metal chalcogenide conversion coating adjacent to and in contact with conductive areas. The method is especially useful for the formation of printed circuit boards and is sufficiently versatile to permit formation of a printed circuit board by a process that involves pattern plating.

Abstract translation: 一种用于对由非导体形成的制品的表面进行金属电镀的方法。 该方法包括使浸入含有溶解电镀金属的电解质中的两个电极之间的电流通过的步骤。 其中一个电极是待镀的制品，并且具有与导电区域相邻并与导电区域接触的具有催化金属硫族化物转化膜的区域的表面。 该方法对印刷电路板的形成特别有用，并且通过涉及图案电镀的工艺能够形成印刷电路板是足够通用的。

公开(公告)号：EP0244567A2

公开(公告)日：1987-11-11

申请号：EP87101903.0

申请日：1987-02-11

Applicant: SHIPLEY COMPANY INC.

Inventor： Vidusek, David A. ,  Legenza, Michael ,  Vincent, Jeffery L.

IPC: G03F7/26 ,  G03F7/02

CPC classification number: G03F7/322 ,  G03F7/094

Abstract: The invention is for a developer for a bilayer photoresist film comprising a first relatively thick layer of a polyglutarimide and a second relatively thin layer of a diazo sensitized novolak resin. The developer is an aqueous solution of a tetra alkyl ammonium hydroxide where at least two of the alkyl groups have two or more carbon atoms. The developer of the invention permits development of the bottom resist layer without erosion of the top resist layer.

Abstract translation: 本发明涉及用于双层光致抗蚀剂膜的显影剂，其包含第一相对较厚的聚戊二酰亚胺层和第二相对较薄的重氮敏感酚醛清漆树脂层。 显影剂是四烷基氢氧化铵的水溶液，其中至少两个烷基具有两个或更多个碳原子。 本发明的显影剂允许底层抗蚀剂层的开发而不会侵蚀顶层抗蚀剂层。

公开(公告)号：EP0163831A2

公开(公告)日：1985-12-11

申请号：EP85103389.4

申请日：1985-03-22

Applicant: SHIPLEY COMPANY INC.

Inventor： Gulla, Michael ,  Dutkewych, Oleh Borys ,  Bladon, John James

IPC: C23C18/30

CPC classification number: C23C18/30

Abstract: A catalytic adsorbate suspended in an aqueous solution comprising reduced catalytic metal on an organic suspending agent where the reduced catalytic metal has a maximum dimension not exceeding 500 angstroms. The catalytic adsorbate is useful for the electroless metal deposition of substrates that are non-catalytic to electroless metal deposition.