公开(公告)号：EP1544320B1

公开(公告)日：2009-10-14

申请号：EP04029929.9

申请日：2004-12-17

Applicant: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.

Inventor： Hegemann, Dirk, Dr. ,  Oehr, Christian, Dr. ,  Müller, Michaela, Dr.

IPC: C23C16/50 ,  C23C16/02 ,  H05K3/28

CPC classification number: C23C16/26 ,  C23C16/0236 ,  H05K3/282 ,  H05K3/3489 ,  H05K2201/0179 ,  H05K2203/095

公开(公告)号：EP2025210A1

公开(公告)日：2009-02-18

申请号：EP07718465.3

申请日：2007-05-25

Applicant: Ab Mikroelektronik Gesellschaft Mit Beschränkter Haftung

Inventor： HAEGELE, Bernd

IPC: H05K1/05 ,  H05K3/28 ,  H05K3/44

CPC classification number: H05K1/053 ,  C03C3/064 ,  C23C4/18 ,  H05K1/092 ,  H05K2201/0116 ,  H05K2201/017 ,  H05K2201/0179 ,  H05K2203/1147 ,  H05K2203/1366 ,  Y10T29/49126 ,  Y10T29/49146

Abstract: Circuit carrier having a metal support layer, at least some portions of which are covered by a dielectric layer, the latter having a plurality of pores, with the pores being sealed by glass at least on the opposite side of the dielectric layer to the support layer.

公开(公告)号：EP1983532A1

公开(公告)日：2008-10-22

申请号：EP08251275.7

申请日：2008-03-31

Applicant: Samsung Electro-Mechanics Co., Ltd

Inventor： Lim, Sung-Taek 1001, West Wing Hyundai I-Park ,  Chung, Yul-Kyo ,  Woon-Chun, Kim

IPC: H01G4/33 ,  H01G4/10 ,  H01G2/06

CPC classification number: H01G4/33 ,  H01G2/06 ,  H01G4/10 ,  H05K1/162 ,  H05K3/048 ,  H05K3/244 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2203/0315 ,  Y10T29/435

Abstract: A capacitor and a method of manufacturing the capacitor. The capacitor may include a board, a polymer layer formed on one side of the board, a circuit pattern selectively formed over the polymer layer, and a titania nanosheet corresponding with the circuit pattern. Embodiments of the invention can provide flatness in the board, and allows the copper of the board to maintain its functionality as an electrode while increasing the adhesion to the titania nanosheet. The titania nanosheet may thus be implemented on a patterned board in a desired shape, number of layers, and thickness.

Abstract translation: 一种电容器及其制造方法。 电容器可以包括板，形成在板的一侧上的聚合物层，选择性地形成在聚合物层上的电路图案，以及与电路图案对应的二氧化钛纳米片。 本发明的实施例可以提供板中的平坦度，并且允许板的铜保持其作为电极的功能，同时增加与二氧化钛纳米片的粘合性。 因此，二氧化钛纳米片可以在图案化的板上实现所需的形状，层数和厚度。

公开(公告)号：EP1123988B1

公开(公告)日：2008-07-09

申请号：EP00204364.4

申请日：2000-12-07

Applicant: Nikko Materials USA, Inc.

Inventor： Wang, Jiangtao ,  Callahan, John ,  Lillie, Dan

IPC: C23C14/02 ,  H05K3/14 ,  C23C28/00

CPC classification number: H05K1/167 ,  C23C2/02 ,  C23C2/26 ,  C23C14/024 ,  C23C14/025 ,  C23C28/321 ,  C23C28/322 ,  C23C28/3225 ,  C23C28/345 ,  C23C28/3455 ,  H05K3/384 ,  H05K3/388 ,  H05K2201/0179 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2203/0361 ,  Y10T428/12438

公开(公告)号：EP1909321A1

公开(公告)日：2008-04-09

申请号：EP06756534.1

申请日：2006-05-24

Applicant: DOWA Electronics Materials Co., Ltd.

Inventor： OSHIKA, Yoshikazu, DOWA ELECTRONICS MATERIALS CO., LTD.

IPC: H01L23/12 ,  H01L23/36 ,  H01S5/022

CPC classification number: H05K1/053 ,  H01L23/142 ,  H01L23/15 ,  H01L23/3735 ,  H01L24/28 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/29144 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/8546 ,  H01L2224/85466 ,  H01L2224/85469 ,  H01L2224/85484 ,  H01L2924/00011 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/14 ,  H01S5/02272 ,  H01S5/02476 ,  H05K2201/0179 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/00 ,  H01L2924/01047 ,  H01L2924/01004

Abstract: A metal-ceramic composite substrate having excellent heat dissipation and a method of manufacturing such a metal-ceramic composite substrate at low cost are disclosed. A metal-ceramic composite substrate (10) comprises a metal substrate (11), a ceramic layer (12) formed on the metal substrate (11), an electrode layer (13) formed on the ceramic layer (12) and a solder layer (14) formed on the electrode layer (13) wherein the ceramic layer (12) is in the form of a thin film of a ceramic. Forming the ceramic layer (12) in the form of a thin film of aluminum nitride provides a metal-ceramic composite substrate (10) of excellent heat dissipating property for an electronic circuit.

Abstract translation: 公开了一种具有优异的散热性的金属陶瓷复合基板和低成本地制造这种金属 - 陶瓷复合基板的方法。 金属陶瓷复合基板（10）包括金属基板（11），形成在金属基板（11）上的陶瓷层（12），形成在陶瓷层（12）上的电极层（13）和焊料层 （14），其形成在所述电极层（13）上，其中所述陶瓷层（12）为陶瓷薄膜的形式。 形成氮化铝薄膜形式的陶瓷层（12）提供了一种电子电路具有优异散热特性的金属陶瓷复合衬底（10）。

公开(公告)号：EP1897103A1

公开(公告)日：2008-03-12

申请号：EP06785199.8

申请日：2006-06-21

Applicant: E. I. DU PONT DE NEMOURS AND COMPANY

Inventor： BORLAND, William J. ,  BURN, Ian ,  IHLEFELD, Jon, Fredrick ,  MARIA, Jon-Paul ,  SUH, Seigi

IPC: H01G4/33 ,  H01G4/10 ,  H01G4/12

CPC classification number: H01L21/02197 ,  C01G23/006 ,  C01P2004/82 ,  C01P2006/40 ,  H01G4/1227 ,  H01G4/33 ,  H01L21/02337 ,  H01L21/31691 ,  H05K1/162 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0355 ,  Y10T29/417 ,  Y10T29/435 ,  Y10T29/4913 ,  Y10T428/31678

Abstract: The present invention is directed to a dielectric thin film composition comprising: (1) one or more barium/titanium-containing selected from (a) barium titanate, (b) any composition that can form barium titanate during firing, and (c) mixtures thereof; dissolved in (2) organic medium; and wherein said thin film composition is doped with 0.002 to 0.05 atom percent of a manganese-containing additive.

公开(公告)号：EP1777713A3

公开(公告)日：2007-10-24

申请号：EP06255336.7

申请日：2006-10-17

Applicant: E.I. du Pont de Nemours and Company

Inventor： Borland, William J. ,  Maria, Jon-Paul ,  Ihlefeld, Jon Frederick

IPC: H01G4/12

CPC classification number: C01G23/006 ,  C01G25/00 ,  C01P2006/42 ,  C04B35/4682 ,  C04B35/49 ,  C04B35/632 ,  C04B2235/3215 ,  C04B2235/3293 ,  C04B2235/441 ,  C04B2235/449 ,  C04B2235/6584 ,  C04B2235/663 ,  C23C18/1216 ,  C23C18/1241 ,  C23C18/1279 ,  C23C18/1295 ,  H01G4/1227 ,  H01G4/33 ,  H01L21/31691 ,  H01L28/55 ,  H05K1/162 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0355

Abstract: Disclosed are high permittivity (dielectric constant), thin film CSD barium titanate based dielectric precursor solution comprising barium acetate, a titanium source and a B site cation source. The dielectrics show capacitance as a function of temperature that better satisfies the X7R requirements. A method of making a capacitor with this barium titanate based dielectric precursor solution is disclosed.

公开(公告)号：EP1544320A3

公开(公告)日：2006-12-27

申请号：EP04029929.9

申请日：2004-12-17

Applicant: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.

Inventor： Hegemann, Dirk, Dr. ,  Oehr, Christian, Dr. ,  Müller, Michaela, Dr.

IPC: C23C16/50 ,  C23C16/02 ,  H05K3/28

CPC classification number: C23C16/26 ,  C23C16/0236 ,  H05K3/282 ,  H05K3/3489 ,  H05K2201/0179 ,  H05K2203/095

Abstract: Die Erfindung betrifft ein Verfahren zur Passivierung einer für die Verlötung vorgesehenen Endoberfläche im Plasma sowie eine verbesserte passivierte Endoberfläche, die durch dieses Verfahren erhältlich ist.

公开(公告)号：EP1665915A1

公开(公告)日：2006-06-07

申请号：EP04782987.4

申请日：2004-09-02

Applicant: Medtronic MiniMed, Inc.

Inventor： PENDO, Shaun ,  SHAH, Rajiv

IPC: H05K3/46 ,  H01L21/48

CPC classification number: H05K3/467 ,  H01L21/4857 ,  H01L21/4867 ,  H01L2924/0002 ,  H01L2924/19107 ,  H05K1/162 ,  H05K3/048 ,  H05K3/4053 ,  H05K3/4061 ,  H05K3/4664 ,  H05K2201/0179 ,  H05K2203/0278 ,  H05K2203/085 ,  H05K2203/1476 ,  H05K2203/308 ,  H01L2924/00

Abstract: A multilayer circuit substrate for multi-chip modules or hybrid circuits includes a dielectric base substrate, conductors formed on the base substrate and a vacuum deposited dielectric thin film formed over the conductors and the base substrate. The vacuum deposited dielectric thin film is patterned using sacrificial structures formed by shadow mask techniques. Substrates formed in this manner enable significant increases in interconnect density and significant reduction of over-all substrate thickness.

公开(公告)号：EP1622433A1

公开(公告)日：2006-02-01

申请号：EP05254523.3

申请日：2005-07-20

Applicant: Endicott Interconnect Technologies, Inc.

Inventor： Desai, Subahu D. ,  Lin, How T. ,  Lauffer, John M. ,  Markovich, Voya R. ,  Thomas, David L.

IPC: H05K1/16

CPC classification number: G11C11/22 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3011 ,  H05K1/16 ,  H05K2201/0166 ,  H05K2201/0179 ,  H05K2201/09763 ,  H05K2201/10159 ,  H01L2224/0401

Abstract: A circuitized substrate (11) comprised of at least one dielectric material (13) having an electrically conductive pattern thereon. At least part of the pattern is used as the first layer of an organic memory device (35) which further includes at least a second dielectric layer over the pattern and a second pattern aligned with respect to the lower part for achieving several points of contact to thus form the device. The substrate (11) is preferably combined with other dielectric-circuit layered assemblies to form a multilayered substrate on which can be positioned discrete electronic components (e.g., a logic chip) coupled to the internal memory device to work in combination therewith. An electrical assembly (71) capable of using the substrate is also provided, as is an information handling system (101) adapted for using one or more such electrical assemblies as part thereof.

Abstract translation: 由至少一个其上具有导电图案的介电材料（13）组成的电路化基板（11）。 图案的至少一部分被用作有机存储器件（35）的第一层，该有机存储器件（35）还包括至少第二电介质层，并且相对于下部部分对准第二电介质层，以实现几个接触点 从而形成设备。 衬底（11）优选地与其它介质电路分层组件组合以形成多层衬底，其上可以将耦合到内部存储器件的分立电子部件（例如，逻辑芯片）放置在其中以与之组合工作。 还提供能够使用基板的电气组件（71），以及适于使用一个或多个这样的电气组件作为其一部分的信息处理系统（101）。