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公开(公告)号：EP1310593A4
公开(公告)日：2005-04-20
申请号：EP00950005
申请日：2000-08-04
Applicant: TEIJIN LTD
Inventor： MURAYAMA SADAMITSU , MATSUI MICHIKAGE , WADA MASANORI , ISHIHARA SHIGERU
IPC: D21H13/26 , D04H1/42 , D04H1/4334 , D04H1/4342 , D04H1/54 , D04H1/549 , D04H1/58 , D04H1/64 , D21H13/24 , H05K1/03
CPC classification number: D04H1/4334 , D04H1/4342 , D04H1/549 , D04H1/64 , D21H13/24 , D21H13/26 , H05K1/0366 , H05K2201/0251 , H05K2201/0278 , H05K2201/0293 , Y10T428/249921 , Y10T428/249924 , Y10T428/2904 , Y10T428/2969 , Y10T442/609 , Y10T442/61 , Y10T442/611 , Y10T442/69
Abstract: A heat-resistant fibrous paper which is formed mainly from short fibers made of a heat-resistant organic polymer, short fibers made of an unstretched or lowly stretched para-aromatic polyamide, and an organic resin binder and/or fibrids made of a heat-resistant organic polymer, wherein the amount of the short fibers is 45 to 97 wt.% based on the whole paper, the amount of the organic resin binder and/or the fibrids is 3 to 55 wt.%, and the organic resin binder has been cured and/or the short fibers of an unstretched or lowly stretched para-aromatic polyamide and the fibrids were partly softened and/or deformed and melted to make them serve as a binder. This heat-resistant fibrous paper is excellent in heat resistance, thermal dimensional stability, interlaminar peel strength, electrical insulating properties in a high-humidity atmosphere, etc. and can be satisfactorily impregnated with a resin despite its high bulk density. It is especially suitable for use as a substrate for electrical insulating materials or a substrate for layered products for electrical circuits.
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公开(公告)号：EP0633295B1
公开(公告)日：2002-01-02
申请号：EP94905218.7
申请日：1994-01-27
Applicant: OTSUKA KAGAKU KABUSHIKI KAISHA
IPC: C08L101/00 , C08K7/04
CPC classification number: C08K7/08 , C08K7/10 , H05K1/0373 , H05K2201/0129 , H05K2201/0209 , H05K2201/0248 , H05K2201/0251
Abstract: The invention aims at providing a resin composition for electronic parts which is in great demand as a circuit board material for electric and electronic equipments, and which has a low dielectric constant, low dielectric dissipation factor and a thermal resistance. This resin consists of a thermoplastic resin or a thermosetting resin, and wollastonite or zonotolite, fibrous material containing CaO.SiO2 as a main component, mixed as reinforcing fiber with the resin at a mixing ratio of 5-60 % based on the total weight of the resin and fiber.
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公开(公告)号：EP0763562A2
公开(公告)日：1997-03-19
申请号：EP96306669.1
申请日：1996-09-13
Applicant: Hitachi Chemical Co., Ltd.
Inventor： Okano, Norio , Kobayashi, Kazuhito , Nakaso, Akishi
CPC classification number: C08K7/02 , C08J5/24 , H05K1/0373 , H05K2201/0145 , H05K2201/0209 , H05K2201/0212 , H05K2201/0248 , H05K2201/0251 , H05K2201/0278 , Y10S428/901 , Y10T428/24917 , Y10T428/24994 , Y10T428/249995 , Y10T428/26 , Y10T428/268 , Y10T428/269 , Y10T428/2949 , Y10T428/31529
Abstract: A prepreg comprising a semi-cured thermosetting resin and electrically insulating whiskers or electrically insulating short fibers dispersed in the semi-cured thermosetting resin and, if necessary, the prepreg being provided on a carrier film is suitable for producing multi-layer printed circuit boards of reduced thickness, high wiring density and high connection reliability with high productivity and low production cost.
Abstract translation: 包含半固化热固性树脂和分散在半固化热固性树脂中的电绝缘晶须或电绝缘短纤维以及必要时在载体膜上提供预浸料坯的预浸料坯适用于制造多层印刷电路板 厚度减少，布线密度高，连接可靠性高，生产率高，生产成本低。
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34.发明公开Polybutadiene and polyisopropene based thermosetting compositions and method of manufacture thereof 失效基于聚丁二烯和聚异戊二烯，以及用于制备热固性组合物
公开(公告)号：EP0707038A1
公开(公告)日：1996-04-17
申请号：EP95114852.7
申请日：1995-09-21
Applicant: ROGERS CORPORATION
Inventor： St. Lawrence, Michel E. , Landi, Vincent R. , Hand, Doris I. , Walker, Robert H. , Gazit, Samuel , Miskiavitch, Raymond R.
CPC classification number: C08J5/24 , C08J2309/00 , C08K3/22 , C08K3/34 , C08K3/40 , C08K5/0066 , C08K7/14 , C08L7/00 , C08L9/00 , C08L9/02 , C08L9/06 , C08L15/00 , C08L23/04 , C08L53/00 , H05K1/0203 , H05K1/032 , H05K1/0366 , H05K1/0373 , H05K1/162 , H05K2201/012 , H05K2201/0133 , H05K2201/0158 , H05K2201/0209 , H05K2201/0212 , H05K2201/0251 , H05K2201/0278 , H05K2201/029 , H05K2201/0293 , Y10T442/3431 , Y10T442/3569 , C08L2666/06 , C08L2666/08 , C08L2666/24
Abstract: An electrical circuit material is presented which comprises:
(a) a thermosetting composition comprising a polybutadiene or polyisoprene resin and an unsaturated butadiene or isoprene containing polymer capable of participating in crosslinking with said polybutadiene or polyisoprene resin in an amount of from 25 to 50 volume percent;
(b) a woven fabric in an amount from 10 to 40 volume percent;
(c) a particulate filler in an amount of from 5 to 60 volume percent; and
(d) a free radical cure initiator.Abstract translation: 被呈现的电路材料，其包括：（a）一种热固性组合物，包括聚丁二烯或聚异戊二烯树脂和不饱和的丁二烯或异戊二烯含聚合物能够以25〜50％（体积）的量参与交联与所述聚丁二烯或聚异戊二烯树脂在 ; （B）的机织织物在10％到40％的体积量; （C）在5〜60体积％的量的颗粒填料; 和（d）自由基固化引发剂。
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公开(公告)号：EP0407129A3
公开(公告)日：1991-09-25
申请号：EP90307223.9
申请日：1990-07-02
Applicant: POLYPLASTICS CO. LTD.
Inventor： Suzuki, Yoshiharu , Aketa, Tomoyuki
CPC classification number: H05K3/14 , H05K1/0373 , H05K3/02 , H05K3/108 , H05K3/381 , H05K3/388 , H05K2201/0141 , H05K2201/0209 , H05K2201/0251 , H05K2201/09118 , H05K2203/095
Abstract: A molding capable of forming a precision fine-line circuit by the subtractive method is produced from a liquid-crystal polyester resin composition comprising a melt-processable polyester (liquid-crystal polyester) capable of forming an anisotropic molten phase and an inorganic filler added thereto, the molded composition is etched and a metallic coating is then formed on the etched surface by sputtering, ion plating or vacuum deposition.
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Patent Agency Ranking36.发明公开Process for producing printed circuit boards 失效Verfahren zur Herstellung von gedruckten Leiterplatten。
公开(公告)号：EP0416518A2
公开(公告)日：1991-03-13
申请号：EP90116931.8
申请日：1990-09-04
Applicant: IDEMITSU KOSAN COMPANY LIMITED
Inventor： Nakano, Akikazu
IPC: H05K1/03
CPC classification number: H05K1/0373 , H05K1/0366 , H05K3/022 , H05K2201/0129 , H05K2201/0209 , H05K2201/0212 , H05K2201/0239 , H05K2201/0248 , H05K2201/0251 , H05K2201/09118 , Y10T29/4916
Abstract: A process for producing a printed circuit board is disclosed, in which the following steps are sequentially conducted:
(1) a step for dispersing in at least one of the mediums of water and an organic solvent
(A) 95 to 20% by weight of a styrene polymer having a syndiotactic structure,
(B) 5 to 80% by weight of a fibrous filler having a fiber length of 1 to 50 mm, and
(C) 0.1 to 30 parts by weight of at least one of a binder and a binding fiber in proportion to 100 parts by weight of the total amount of said components (A) and (B), to make a slurry having a concentration of 0.5 to 100 g/l,
(2) a sedimentation step of the dispersed solids in said slurry,
(3) a step for removing at least one of the mediums of water and an organic solvent in the slurry by filtration and drying and molding the residue,
(4) a step for melting with heating and pressure forming the molded product, and
(5) a step for providing a metal layer on the molded article.
The printed circuit board obtained by the process is excellent in impact resistance, heat resistance, mechanical strength and size stability as well as dielectric properties.Abstract translation: 公开了一种制造印刷电路板的方法，其中依次进行以下步骤：（1）将水和有机溶剂（A）的至少一种介质分散在95〜20重量％的 具有间同立构结构的苯乙烯聚合物，（B）5-80重量％的纤维长度为1-50毫米的纤维填料，和（C）0.1-30重量份至少一种粘合剂和 与所述组分（A）和（B）的总量的100重量份成比例的粘合纤维，以制备浓度为0.5-100g / l的浆料，（2）分散固体的沉降步骤 所述浆料，（3）通过过滤并干燥和成型残渣来除去浆料中的至少一种水和有机溶剂的步骤，（4）通过加热和加压成型模制物进行熔融的步骤， 和（5）在模制品上提供金属层的步骤。 通过该方法获得的印刷电路板具有优异的耐冲击性，耐热性，机械强度和尺寸稳定性以及介电性能。
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公开(公告)号：EP0379514A4
公开(公告)日：1991-01-30
申请号：EP88907970
申请日：1988-08-18
Applicant: OLIN CORPORATION
Inventor： BRIDGES, WILLIAM, G. , ARMER, THOMAS, A.
CPC classification number: B32B15/08 , B32B15/06 , B32B15/085 , B32B15/09 , B32B15/20 , B32B2311/12 , B32B2319/00 , B32B2323/04 , B32B2323/10 , B32B2327/18 , B32B2367/00 , B32B2371/00 , H05K1/032 , H05K1/0326 , H05K1/034 , H05K1/0346 , H05K1/036 , H05K2201/0129 , H05K2201/0133 , H05K2201/0141 , H05K2201/015 , H05K2201/0158 , H05K2201/0209 , H05K2201/0251 , H05K2201/0278 , H05K2201/0355
Abstract: Polymer/metal laminates and a method for their manufacture employing smooth, untreated, wrought-metal and characterized by cohesive and adhesive strength in the resulting laminates.
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38.发明公开Process for producing molding for precision fine line-circuit 失效Verfahren zur Herstellung vonFormstückenfürPräzisionsfernleiterschaltungen。
公开(公告)号：EP0407129A2
公开(公告)日：1991-01-09
申请号：EP90307223.9
申请日：1990-07-02
Applicant: POLYPLASTICS CO. LTD.
Inventor： Suzuki, Yoshiharu , Aketa, Tomoyuki
CPC classification number: H05K3/14 , H05K1/0373 , H05K3/02 , H05K3/108 , H05K3/381 , H05K3/388 , H05K2201/0141 , H05K2201/0209 , H05K2201/0251 , H05K2201/09118 , H05K2203/095
Abstract: A molding capable of forming a precision fine-line circuit by the subtractive method is produced from a liquid-crystal polyester resin composition comprising a melt-processable polyester (liquid-crystal polyester) capable of forming an anisotropic molten phase and an inorganic filler added thereto, the molded composition is etched and a metallic coating is then formed on the etched surface by sputtering, ion plating or vacuum deposition.
Abstract translation: 由能够形成各向异性熔融相的可熔融加工的聚酯（液晶聚酯）和添加无机填料的液晶聚酯树脂组合物制成能够通过减色法形成精密细线电路的成型体。 ，蚀刻成型组合物，然后通过溅射，离子镀或真空沉积在蚀刻表面上形成金属涂层。
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公开(公告)号：EP0313961A3
公开(公告)日：1990-09-05
申请号：EP88117300.9
申请日：1988-10-18
Applicant: ROGERS CORPORATION
Inventor： McGinnis, Leon W. , Carroll, James R. , Miller, Terry L. , Norris, Michael B.
CPC classification number: B32B15/04 , B32B5/024 , B32B5/26 , B32B15/14 , B32B15/20 , B32B27/322 , B32B2260/023 , B32B2260/046 , B32B2262/101 , B32B2457/08 , H05K1/036 , H05K1/167 , H05K2201/015 , H05K2201/0251 , Y10S428/901 , Y10T428/24917 , Y10T428/252 , Y10T428/254 , Y10T428/26 , Y10T428/31544 , Y10T442/3439
Abstract: A fluoropolymeric circuit laminate consisting of one or more layers of fluoropolymer impregnated woven glass cloth (18) sandwiched between one or more layers (14,16) of "random" microfiberglass reinforced fluoropolymer is presented. This composite of fluoropolymer, woven glass fabric and random glass microfibers may be clad on one or both outer surfaces with a suitable conductive material (20,22) such as copper or certain known resistive foils.
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公开(公告)号：EP0379514A1
公开(公告)日：1990-08-01
申请号：EP88907970.0
申请日：1988-08-18
Applicant: OLIN CORPORATION
Inventor： BRIDGES, William, G. , ARMER, Thomas, A.
CPC classification number: B32B15/08 , B32B15/06 , B32B15/085 , B32B15/09 , B32B15/20 , B32B2311/12 , B32B2319/00 , B32B2323/04 , B32B2323/10 , B32B2327/18 , B32B2367/00 , B32B2371/00 , H05K1/032 , H05K1/0326 , H05K1/034 , H05K1/0346 , H05K1/036 , H05K2201/0129 , H05K2201/0133 , H05K2201/0141 , H05K2201/015 , H05K2201/0158 , H05K2201/0209 , H05K2201/0251 , H05K2201/0278 , H05K2201/0355
Abstract: Laminés de polymère/métal ainsi qu'un procédé de fabrication utilisant un métal ouvré, lisse, non traité conférant au laminé obtenu des caractéristiques de résistance à la cohésion et à l'adhésion.
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