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    WIRING BOARD AND PRODUCTION METHOD THEREOF
    43.
    发明公开
    WIRING BOARD AND PRODUCTION METHOD THEREOF 审中-公开
    LEEDRPLATTE UND IHRE HERSTELLUNG

    公开(公告)号：EP1156707A1

    公开(公告)日：2001-11-21

    申请号：EP00977895.2

    申请日：2000-11-24

    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

    Inventor： Suzuki, Takeshi ,  Ogawa, Tatsuo ,  Tomekawa, Satoru ,  Bessho, Yoshihiro ,  Nishiyama, Tousaku ,  Ogura, Tetsuyoshi

    IPC: H05K1/11 ,  H05K3/40 ,  H05K3/46

    CPC classification number: H05K3/462 ,  H05K1/0373 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4652 ,  H05K3/4658 ,  H05K2201/0116 ,  H05K2201/0212 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/1461 ,  Y10T29/49165

    Abstract: The present invention aims to provide a wiring substrate highly reliable in insulation and connection and a method for manufacturing the wiring substrate. The wiring substrate comprises two or more wiring layers, insulation layers interposed between the neighboring wiring layers and containing an organic resin, and via formed in the insulation layers and extended between neighboring wiring layers. The via contain functional substances, as well as some of the voids (first voids) where at least the organic resins from the insulation layers exist and the remaining voids (second voids) where a gas exists. Consequently, so-called paste bleed, which is penetration of an insulation layer with a conductive paste, does not takes place and the elasticity modulus in the entire via becomes low and the flexibility is improved attributed to the second voids in the via. The expansion and the contraction well respond to the mechanical stress applied to the wiring substrate and thus disconnected of wiring layers hardly takes place and the reliability of electric and mechanical connection between the wiring layers is heightened.

    Abstract translation: 本发明的目的在于提供一种在绝缘和连接方面高可靠性的布线基板和制造布线基板的方法。 布线基板包括两个或多个布线层，介于相邻布线层之间并包含有机树脂的绝缘层，以及形成在绝缘层中并在相邻布线层之间延伸的通孔。 通孔含有功能性物质，以及至少存在绝缘层的有机树脂和存在气体的剩余空隙（第二空隙）的一些空隙（第一空隙）。 因此，不会发生所谓的糊状渗出，即通过导电浆料的绝缘层的渗透，并且整个通孔中的弹性模量变低，并且由于通孔中的第二空隙导致的柔软性得到改善。 膨胀和收缩很好地响应于施加到布线基板的机械应力，因此几乎不发生布线层的断开，并且布线层之间的电气和机械连接的可靠性提高。

    Prepreg, process for producing the same and printed circuit substrate using the same
    45.
    发明公开
    Prepreg, process for producing the same and printed circuit substrate using the same 失效
    预浸料，制备过程和印刷电路板基板及其用途

    公开(公告)号：EP0768334A2

    公开(公告)日：1997-04-16

    申请号：EP96116329.2

    申请日：1996-10-11

    Applicant: SUMITOMO CHEMICAL COMPANY LIMITED

    Inventor： Takahashi, Tsutomu ,  Tsujimoto, Yoshifumi ,  Kumada, Hiroaki ,  Sato, Hiroyuki

    IPC: C08J5/24 ,  C08J5/04 ,  H05K1/03

    CPC classification number: B32B15/14 ,  B32B5/022 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2305/026 ,  B32B2457/08 ,  C08J5/04 ,  C08J5/24 ,  H05K1/0366 ,  H05K2201/0116 ,  H05K2201/0129 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2201/068 ,  Y10S428/901 ,  Y10S428/902 ,  Y10S428/91 ,  Y10T428/24917 ,  Y10T428/24993 ,  Y10T428/24994 ,  Y10T428/249944 ,  Y10T428/249953 ,  Y10T428/249955 ,  Y10T428/2907 ,  Y10T428/2938 ,  Y10T428/2969 ,  Y10T428/2971 ,  Y10T428/30 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31725 ,  Y10T442/2008 ,  Y10T442/2893 ,  Y10T442/2902

    Abstract: The present invention provides a lightweight prepreg having uniform formation, low linear thermal expansion coefficient and good mechanical strength, comprising a porous para-oriented aromatic polyamide film and a thermoplastic resin and/or a thermosetting resin, the porous para-oriented aromatic polyamide film being impregnated with the thermoplastic resin and/or the thermosetting resin, a process for producing the same, and a printed circuit substrate/board using the same.
    A process for producing for producing a prepreg comprising a porous para-oriented aromatic polyamide film and a thermoplastic resin and/or a thermosetting resin, the porous para-oriented aromatic polyamide film being impregnated with the thermoplastic resin and/or thermosetting resin, which comprises the following steps (a) to (d):

    step (a) of forming a film-like material from a solution containing 1 to 10% by weight of a para-oriented aromatic polyamide having an inherent viscosity of 1.0 to 2.8 dl/g and 1 to 10% by weight of a chloride of an alkaline metal or an alkaline earth metal in a polar amide solvent or a polar urea solvent;
    step (b) of maintaining the film-like material at a temperature of not less than 20°C or not more than -5°C to deposit the para-oriented aromatic polyamide from the film-like material;
    step (c) of immersing the film-like material obtained in the step (b) in an aqueous solution or an alcoholic solution to elute the solvent and the chloride of the alkaline metal or alkaline earth metal, followed by drying to obtain a para-aramid porous film; and
    step (d) of impregnating the porous film obtained in the step (c) as a substrate with the thermoplastic resin and/or thermosetting resin to produce a prepreg.

    Abstract translation: 本发明提供具有均匀形成，低线性热膨胀系数和良好的机械强度，包括多孔对位取向芳香族聚酰胺薄膜和热塑性树脂和/或热固性树脂，该多孔对位取向芳香族聚酰胺薄膜感轻质预浸渍体 浸渍有热塑性树脂和/或热固性树脂，其制造方法，以及使用其的印刷电路基板/电路板。 一种生产用于生产预浸料，其包括多孔对位取向芳香族聚酰胺薄膜和热塑性树脂和/或热固性树脂，处理该多孔对位取向的芳族聚酰胺薄膜中浸渍有热塑性树脂和/或热固性树脂，该方法包括 以下步骤（a）至（d）：工序（a）形成由（重量）具有以1.0固有粘度的对位取向芳香族聚酰胺的含有1至10％的溶液的薄膜状材料制成，以2.8升/克 和1〜10％（重量）的碱金属或碱土金属的氯化物在极性酰胺系溶剂或极性尿素溶剂; 步骤（b）在不低于20℃的温度或不膜状材料的保持超过-5℃来沉积从薄膜状材料的对位取向芳香族聚酰胺; 在浸渍步骤（b）中得到的薄膜状材料以wässrige溶液或在醇溶液中进行干燥以获得一个对位，以洗脱溶剂和碱金属或碱土金属的氯化物，随后的步骤（c） 芳族聚酰胺多孔膜; 和浸渍的步骤（d）的多孔膜得到的在步骤（c）为与热塑性树脂和/或热固性树脂以生产的预浸料的基片。

    Tin lead treatment
    47.
    发明公开
    Tin lead treatment 失效
    锡铅治疗

    公开(公告)号：EP0524422A3

    公开(公告)日：1994-04-13

    申请号：EP92110053.3

    申请日：1992-06-15

    Applicant: SHIPLEY COMPANY INC.

    Inventor： Shipley, Charles R. ,  Staniunas, Richard

    IPC: C23C18/48 ,  C23C18/52

    CPC classification number: C23C18/52 ,  C23C18/48 ,  H05K3/3473 ,  H05K2201/0116 ,  H05K2203/043 ,  H05K2203/072 ,  H05K2203/073

    Abstract: A process for increasing the reflow capability of a tin lead alloy deposit and increasing its adhesion to an underlying substrate, said process comprising impregnating a tin lead immersion deposit with tin prior to reflow. The process is useful in the manufacture of printed circuit boards.

    Abstract translation: 一种提高锡铅合金沉积物的回流能力并增加其对下面基底的粘附性的方法，所述方法包括在回流之前用锡浸渍锡铅浸渍沉积物。 该工艺在制造印刷电路板时非常有用。

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