公开(公告)号：EP1911860A4

公开(公告)日：2009-11-11

申请号：EP06766606

申请日：2006-06-12

Applicant: MITSUI MINING & SMELTING CO

Inventor： MATSUNAGA T

IPC: C23C28/00 ,  H05K1/00 ,  H05K1/05 ,  H05K3/02 ,  H05K3/38

CPC classification number: C23C28/00 ,  B05D2202/45 ,  B05D2350/65 ,  H05K3/384 ,  H05K3/386 ,  H05K3/389 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0307 ,  H05K2203/0723 ,  Y10T428/12438 ,  Y10T428/12556 ,  Y10T428/12569 ,  Y10T428/12715 ,  Y10T428/12722 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/2495 ,  Y10T428/24967 ,  Y10T428/265 ,  Y10T428/27 ,  Y10T428/31663

公开(公告)号：EP1876873A4

公开(公告)日：2009-07-22

申请号：EP06732461

申请日：2006-04-28

Applicant: NIPPON KAYAKU KK

Inventor： AKATSUKA YASUMASA ,  MOTEKI SHIGERU ,  UCHIDA MAKOTO ,  ISHIKAWA KAZUNORI

IPC: H05K3/00 ,  B32B15/088 ,  H05K1/03

CPC classification number: H05K1/0346 ,  H05K3/022 ,  H05K2201/0358 ,  H05K2203/0759 ,  Y10T156/10

Abstract: [PROBLEMS] To provide a process for producing a double-sided flexible printed board having sufficient heat resistance, flame retardancy, and adhesion through simple steps without necessitating a complicated apparatus. [MEANS FOR SOLVING PROBLEMS] The process for double-sided flexible printed board production comprises: a step in which a varnish comprising an aromatic polyamide resin represented by the following formula (1), an epoxy resin, and an organic solvent is directly applied to a metal foil; a step in which the solvent is removed to form a resin layer; and a step in which another metal foil is applied to the resin-layer side and the resin layer is cured. (1) (In the formula, m and n are average values, m+n is a positive number of 2-200, and n is a positive number of 0.1 or larger; Ar1 and Ar3 each is a divalent aromatic group; and Ar2 is a divalent aromatic residue having a phenolic hydroxy group.)

公开(公告)号：EP1795336A1

公开(公告)日：2007-06-13

申请号：EP05782330.4

申请日：2005-09-09

Applicant: MITSUI MINING & SMELTING CO., LTD.

Inventor： MATSUNAGA, T., MITSUI MINING & SMELTING CO., LTD. ,  MATSUSHIMA, T., MITSUI MINING & SMELTINGCO., LTD. ,  SATO, Tetsuro, MITSUI MINING & SMELTING CO., LTD. ,  NAKAMURA, K., MITSUI MINING & SMELTING CO., LTD. ,  KON, Hiroyuki, MITSUI MINING & SMELTING CO., LTD. ,  IWAKIRI, K., MITSUI MINING & SMELTING CO., LTD.

IPC: B32B15/04 ,  C25D7/06 ,  C23C28/00 ,  H05K1/09

CPC classification number: C25D7/0614 ,  B32B7/06 ,  B32B15/01 ,  B32B15/08 ,  B32B15/14 ,  B32B15/20 ,  B32B27/08 ,  B32B27/26 ,  B32B27/285 ,  B32B27/286 ,  B32B27/38 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2255/24 ,  B32B2255/28 ,  B32B2270/00 ,  B32B2457/08 ,  C22C19/002 ,  C23C28/00 ,  C25D3/562 ,  H05K3/025 ,  H05K3/384 ,  H05K3/389 ,  H05K2201/0358 ,  H05K2203/0723 ,  Y10T428/12569 ,  Y10T428/24355

Abstract: Present invention provides an electrodeposited copper foil with carrier foil that assure high bonding strength between a surface of the bulk copper layer and a resin substrate layer even when surface roughness is low, and hardly occurs delamination even when pin holes and the like remain in a bulk copper layer or in the side wall of the through holes or via holes and the like after contact with a desmear solution and the like. To solve such a problem, electrodeposited copper foil with carrier foil with a primer resin layer comprising a bonding interface layer, a bulk copper layer, a plated Ni-Zn alloy layer and a primer resin layer which is formed in this order at least on one surface of the carrier foil is applied.

Abstract translation: 本发明在电解铜箔提供附有载体箔做保证块状铜层的表面和树脂基材层即使当表面粗糙度低之间粘接强度高，并且几乎没有发生脱层即使当销孔等保持在散装 铜层或通孔或通孔的侧壁和与去污溶液等接触后等。 为了解决寻求与有底漆树脂层包括被以该顺序形成的至少一个的接合界面层，基体铜层，镀Ni-Zn合金层和底漆树脂层中的所有载体箔的一个问题，电解铜箔 载体箔的表面被应用。

公开(公告)号：EP1791409A1

公开(公告)日：2007-05-30

申请号：EP06256011.5

申请日：2006-11-23

Applicant: TDK Corporation

Inventor： Kawabata, Kenichi, c/o TDK Corporation ,  Morita, Takaaki, c/o TDK Corporation

IPC: H05K3/46

CPC classification number: H05K3/4652 ,  H01L23/49822 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24226 ,  H01L2224/2518 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H05K1/185 ,  H05K3/0044 ,  H05K3/0058 ,  H05K3/4602 ,  H05K3/4682 ,  H05K3/4688 ,  H05K2201/0358 ,  H05K2201/09518 ,  H05K2201/09527 ,  H05K2201/09563 ,  H05K2203/0152 ,  H05K2203/025 ,  H05K2203/0554 ,  H05K2203/1105 ,  H05K2203/1476 ,  H05K2203/1572 ,  Y10T29/49128 ,  Y10T428/24917 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00

Abstract: A multilayer circuit board comprises core layers 101 and 102 made of a core material impregnated with resin, resin layers 111 and 112 interposed between the core layers 101 and 102, a wiring pattern 140 embedded in the resin layers 111 and 112. The core layers 101 and 102 have a thickness of 100 µm or smaller, whereby the entire board can significantly be thinned. Furthermore, the less strong resin layers 111 and 112 are interposed between the hard core layers 101 and 102, whereby the entire board has increased strength.

Abstract translation: 多层电路板包括由浸渍有树脂的芯材制成的芯层101和102，插入在芯层101和102之间的树脂层111和112，嵌入在树脂层111和112中的布线图案140.芯层101 102的厚度为100μm以下，由此能够使整个基板变薄。 此外，较不强的树脂层111和112插入在硬芯层101和102之间，由此整个板具有增加的强度。

公开(公告)号：EP1260359B1

公开(公告)日：2005-12-07

申请号：EP02011363.5

申请日：2002-05-23

Applicant: SUMITOMO BAKELITE CO., LTD.

Inventor： Ilda, Takahisa, Sumitomo Bakelite Co. Ltd.

IPC: B32B31/08 ,  B32B31/20

CPC classification number: B32B15/14 ,  B32B7/14 ,  B32B15/04 ,  B32B15/20 ,  B32B27/08 ,  B32B37/203 ,  B32B38/0036 ,  B32B2038/0076 ,  B32B2305/076 ,  B32B2309/02 ,  B32B2309/12 ,  B32B2311/00 ,  B32B2311/12 ,  B32B2398/10 ,  B32B2457/08 ,  H05K3/022 ,  H05K3/386 ,  H05K2201/0129 ,  H05K2201/0358 ,  H05K2203/1545

公开(公告)号：EP1599079A1

公开(公告)日：2005-11-23

申请号：EP05703984.4

申请日：2005-01-21

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： NISHII, Toshihiro

IPC: H05K3/46 ,  H05K1/11 ,  H05K3/40

CPC classification number: H05K3/4069 ,  H05K3/382 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/0382 ,  H05K2201/091 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

Abstract: A conductive portion is formed in a hole formed in a material sheet. A metal foil is placed on a surface of the material sheet to provide a laminated sheet. The laminated sheet is heated and pressed to provide a circuit-forming board. The metal foil includes a pressure absorption portion and a hard portion adjacent to the pressure absorption portion. The pressure absorption portion has a thickness changing according to a pressure applied thereto. The circuit-forming board provided by this method provides a high-density circuit board of high quality having reliable electrical connection.

Abstract translation: 导电部分形成在材料片中形成的孔中。 将金属箔放置在材料片的表面上以提供层压片。 层压片被加热和压制以提供电路形成板。 金属箔包括压力吸收部分和与压力吸收部分相邻的硬质部分。 压力吸收部分的厚度根据施加于其上的压力而变化。 由该方法提供的电路形成板提供具有可靠电连接的高质量高密度电路板。

公开(公告)号：EP1555121A1

公开(公告)日：2005-07-20

申请号：EP05007899.7

申请日：2002-05-23

Applicant: SUMITOMO BAKELITE CO., LTD.

Inventor： Iida, Takahisa, c/o Sumitomo Bakelite Co. Ltd.

IPC: B32B31/08 ,  B32B31/20

CPC classification number: B32B15/14 ,  B32B7/14 ,  B32B15/04 ,  B32B15/20 ,  B32B27/08 ,  B32B37/203 ,  B32B38/0036 ,  B32B2038/0076 ,  B32B2305/076 ,  B32B2309/02 ,  B32B2309/12 ,  B32B2311/00 ,  B32B2311/12 ,  B32B2398/10 ,  B32B2457/08 ,  H05K3/022 ,  H05K3/386 ,  H05K2201/0129 ,  H05K2201/0358 ,  H05K2203/1545

Abstract: A method for manufacturing a laminated board having high quality with high productivity is disclosed. In this manufacturing method, a prepreg (2) that has been supplied from a prepreg supply section (1) is fed vertically using feed rolls. Further, metal foils (4) are supplied from a metal foil supply section (3) using feed rolls. The prepreg (2) and the metal foil (4) are heated at a heating section (7), and then they pass through between the rolls (5) so that the metal foils are bonded to the prepreg. Thus obtained laminated board is fed to a rolling section (6) using feed rolls, and the laminated is continuously rolled up at the rolling section (6), thereby continuously manufacturing the laminated board.

Abstract translation: 公开了一种高生产率且高品质的层压板的制造方法。 在该制造方法中，使用进料辊将从预浸料坯供给部（1）供给的预浸料坯（2）垂直输送。 此外，使用进料辊从金属箔供应部分（3）供应金属箔（4）。 预浸料坯（2）和金属箔（4）在加热部（7）中加热后，通过辊（5）之间，使金属箔与预浸料粘合。 将这样得到的层压板利用进料辊供给到轧制部分（6），并且在轧制部分（6）处连续卷绕层压材料，由此连续制造层压板。

公开(公告)号：EP1146101B1

公开(公告)日：2004-03-31

申请号：EP99959924.4

申请日：1999-12-20

Applicant: Hitachi Chemical Company, Ltd.

Inventor： ARATA, Michitoshi ,  TAKANO, Nozomu ,  KOBAYASHI, Kazuhito

IPC: C09J163/00 ,  C09J7/02 ,  H05K3/38 ,  B32B7/12 ,  B32B15/08 ,  H05K3/46

CPC classification number: H05K3/4655 ,  C08G59/621 ,  C08L61/04 ,  C08L2666/36 ,  C09J7/28 ,  C09J163/00 ,  C09J2463/00 ,  H05K3/386 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/124 ,  Y10S428/901 ,  Y10T428/24331 ,  Y10T428/31511 ,  Y10T428/31529 ,  Y10T428/31547

Abstract: A resin coated copper foil obtained by disposing on one side of a copper foil a layer of an adhesive composition having as essential components (a) an epoxy resin, (b) a polyfunctional phenol, (c) a curing accelerator as required, and (d) a compound having a triazine ring or an isocyanuric ring, has low water absorption, high heat resistance and good adhesion to the copper foils, and by using this resin coated copper foil it is possible to obtain a copper-clad laminate and a printed circuit board having excellent properties.

公开(公告)号：EP1307075A2

公开(公告)日：2003-05-02

申请号：EP02023716.0

申请日：2002-10-23

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Nakagiri, Yasushi ,  Suzuki, Takeshi ,  Echigo, Fumio

IPC: H05K1/03 ,  H05K3/40 ,  B32B27/04 ,  C08J5/24

CPC classification number: B32B5/26 ,  B32B3/266 ,  B32B5/022 ,  B32B15/14 ,  B32B2250/05 ,  B32B2250/40 ,  H05K1/036 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/10378 ,  H05K2203/0759 ,  H05K2203/1461 ,  Y10T428/24917 ,  Y10T428/249971

Abstract: The present invention provides a prepreg and a circuit board that can achieve, e.g., low interstitial via connection resistance, excellent connection stability, and high durability, regardless of materials, physical properties, and a combination of the materials of an insulating layer. The present invention also provides a method for manufacturing the prepreg and the circuit board. The prepreg of the present invention includes a laminate (3) including at least one first layer (2) and at least one second layer (1).
The first layer (2) is an insulating layer that includes a resin. The second layer (1) has pores that connect an upper and a lower surface of the second layer (1), and the upper and the lower surface of the second layer (1) differ from each other in at least one selected from open are ratio and average pore diameter. Using this prepreg makes it possible to provide a circuit board that is characterized, e.g., by low interstitial via connection resistance, excellent connection stability, and high durability.

Abstract translation: 本发明提供了一种预浸料和电路板，其可以通过连接电阻实现例如低间隙，优异的连接稳定性和高耐久性，而不管材料，物理性质以及绝缘层的材料的组合。 本发明还提供了一种用于制造预浸料和电路板的方法。 本发明的预浸料包括包括至少一个第一层（2）和至少一个第二层（1）的层压体（3）。 第一层（2）是包括树脂的绝缘层。 第二层（1）具有连接第二层（1）的上表面和下表面的孔，并且第二层（1）的上表面和下表面在选自开口中的至少一个中彼此不同 比率和平均孔径。 使用该预浸料可以提供例如通过连接电阻低间隙，优异的连接稳定性和高耐久性来表征的电路板。

公开(公告)号：EP1227710A1

公开(公告)日：2002-07-31

申请号：EP01945698.7

申请日：2001-06-29

Applicant: Mitsui Mining & Smelting Co., Ltd.

Inventor： KUWAKO, Fujio, MITSUI MINING & SMELTING CO., LTD. ,  ISHINO, Tomohiro, MITSUI MINING & SMELTING CO.LTD

IPC: H05K3/46 ,  B32B15/08

CPC classification number: B32B15/08 ,  B32B15/20 ,  B32B37/0023 ,  B32B2311/12 ,  B32B2457/08 ,  H05K1/09 ,  H05K3/025 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/09509 ,  Y10S428/914 ,  Y10T428/1438 ,  Y10T428/24843 ,  Y10T428/24917 ,  Y10T428/2804

Abstract: An object of the invention is to prevent dent faults generated during bonding of an outer copper foil layer onto an inner layer substrate having a through hole or a cavity serving as an interlayer electrical connection means such as an interstitial via hole (IVH) or a blind via hole (BVH). In order to attain the object, there is provided a method for producing a copper-clad laminate employing the following copper foil serving as an outer layer: (1) a resin-coated copper foil being formed of copper foil having a thickness of 15 µm or more and a rupture strength of 275 kN/m 2 or more as measured through a bulge test performed after the foil is heated, wherein the resin-coated copper foil has a resin layer on one side of the copper foil; (2) a copper foil with etchable carrier, wherein the total thickness of the carrier layer and the copper foil layer is 20 µm or more; or (3) a copper foil with peelable carrier, wherein the total thickness of the carrier layer and the copper foil layer is 20 µm or more, the releasing layer formed between the carrier layer and the copper foil layer having a peel strength of 5 gf/cm to 300 gf/cm as measured after heating.