公开(公告)号：EP2055162A4

公开(公告)日：2014-08-06

申请号：EP07836859

申请日：2007-08-16

Applicant: DELPHI TECH INC

Inventor： SNIDER CHRIS R ,  GUPTA VINEET ,  HUNTZINGER JOSEPH K ,  COADY MICHAEL G

IPC: H05K9/00

CPC classification number: H05K9/0007 ,  B29C59/16 ,  B60R11/02 ,  G06F11/00 ,  H04B1/082 ,  H04R1/02 ,  H05K1/0215 ,  H05K1/141 ,  H05K5/0217 ,  H05K5/0221 ,  H05K5/0226 ,  H05K7/20409 ,  H05K7/20418 ,  H05K7/20436 ,  H05K9/0047 ,  H05K9/0079 ,  H05K9/0081 ,  H05K13/00 ,  H05K2201/09081 ,  H05K2201/10386 ,  H05K2201/10446 ,  Y10T16/547 ,  Y10T16/5476 ,  Y10T29/49002 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49169 ,  Y10T29/49172 ,  Y10T29/4957 ,  Y10T29/49826 ,  Y10T29/49861 ,  Y10T29/5313 ,  Y10T74/20396 ,  Y10T403/70 ,  Y10T403/77 ,  Y10T428/24289

Abstract: A lightweight radio/CD player for vehicular application is virtually "fastenerless" and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration. The major components and subassemblies are self-fixturing during the final assembly process, eliminating the need for dedicated tools, fixtures and assembly equipment. The major components and subassemblies self-interconnect by integral guide and connection features effecting "slide lock" and "snap lock" self-interconnection. The radio architecture includes improved push buttons employing 4-bar living hinge linkage and front loaded decorative trim buttons.

公开(公告)号：EP2654105B1

公开(公告)日：2014-06-18

申请号：EP13164038.5

申请日：2013-04-17

Applicant: SAFT GROUPE SA

Inventor： Guidal, Laurent ,  Susset, Pascal ,  Vigier, Nicolas

IPC: H01M2/12 ,  H01M10/48 ,  H01M2/34 ,  H05K1/02 ,  H01M2/02 ,  H01M10/0525 ,  H01M10/34 ,  H01M10/42 ,  H01M2/10

CPC classification number: H01M10/48 ,  H01M2/105 ,  H01M2/12 ,  H01M2/1241 ,  H01M2/1276 ,  H01M2/345 ,  H01M10/0525 ,  H01M10/34 ,  H01M10/425 ,  H01M10/482 ,  H01M10/488 ,  H01M2200/20 ,  H05K1/0268 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/0909 ,  H05K2201/10037 ,  H05K2203/175

公开(公告)号：EP2434846B1

公开(公告)日：2014-03-05

申请号：EP11182522.0

申请日：2011-09-23

Applicant: Herrler, Manfred

Inventor： Herrler, Manfred

IPC: H05K1/02 ,  H05K3/32 ,  H05K1/11

CPC classification number: H05K1/0271 ,  H01M2/206 ,  H01M10/425 ,  H01M10/482 ,  H05K1/113 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/10037 ,  H05K2201/1031 ,  Y02P70/611

公开(公告)号：EP2601439A1

公开(公告)日：2013-06-12

申请号：EP11728256.6

申请日：2011-06-24

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： SINGER, Frank ,  HAUG, Thomas ,  SAUERER, Alexander

IPC: F21V19/00 ,  F21S8/12 ,  F21V29/00

CPC classification number: H01L33/64 ,  B60Q1/04 ,  F21K9/00 ,  F21S41/141 ,  F21S41/19 ,  F21V29/70 ,  F21Y2115/10 ,  H01L33/641 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/021 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/10106 ,  H01L2924/00

Abstract: In at least one embodiment of the optoelectronic lighting module (1), said lighting module comprises a printed circuit board (3) through which an opening (2) extends. The printed circuit board has fixing devices (6) for mechanically fixing the lighting module (1) to an external cooling body. A substrate (4) of the lighting module (1) is arranged in the opening (2). At least one optoelectronic semiconductor chip (5) is located on a substrate upper face (40) and is electrically connected to the printed circuit board (3) by means of the substrate (4). The printed circuit board (3) is further connected to the substrate (4) in a mechanically fixed manner. Furthermore, the printed circuit board (3) is designed to exert a mechanical force onto the substrate (4) and to press the substrate (4) against the external cooling body. The substrate (4) is designed to rest on the external cooling body in a planar manner with a substrate lower face (45).

Abstract translation: 在至少一个实施例中，光电子照明模块包括电路板，开口通过电路板。 电路板包括用于将照明模块机械地紧固到外部散热器的紧固装置。 照明模块的载体安装在开口中。 至少一个光电子半导体芯片位于载体顶部并且经由载体与电路板电连接。 此外，电路板与载体牢固地机械连接。 电路板另外设计成在载体上施加机械力并将载体压靠在外部散热器上。 载体被设计成将载体底部平放在外部散热器上。

公开(公告)号：EP2529409A1

公开(公告)日：2012-12-05

申请号：EP11704487.5

申请日：2011-01-31

Applicant: Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO

Inventor： DE KOK, Margaretha Maria ,  VAN DEN BRAND, Jeroen ,  VAN HECK, Gerardus Titus

IPC: H01L31/042 ,  H05K1/02

CPC classification number: H05K1/0277 ,  G09F9/00 ,  G09F19/22 ,  H01L27/3293 ,  H01L31/0392 ,  H01L31/042 ,  H01L51/5203 ,  H01L2251/5338 ,  H01L2251/5361 ,  H01R4/04 ,  H01R4/70 ,  H01R12/7076 ,  H05B33/0896 ,  H05B33/10 ,  H05K1/0283 ,  H05K1/038 ,  H05K1/147 ,  H05K1/189 ,  H05K3/321 ,  H05K3/325 ,  H05K3/365 ,  H05K13/04 ,  H05K2201/029 ,  H05K2201/0311 ,  H05K2201/046 ,  H05K2201/083 ,  H05K2201/09081 ,  H05K2201/09281 ,  H05K2201/10106 ,  H05K2201/10287 ,  H05K2201/10484 ,  Y02E10/50 ,  Y10T29/4913

Abstract: An assembly of a plurality of tiles (1) with a carrier (40). The tiles (1) comprise a foil (20) with an electro-physical transducer (10) and electrical connectors (24, 28) to said transducer. The tiles are mechanically and electrically coupled to the carrier in a connection portion (1c) of said tiles.

公开(公告)号：EP2305010B1

公开(公告)日：2012-12-05

申请号：EP09779748.4

申请日：2009-06-15

Applicant: Robert Bosch GmbH

Inventor： LISCHECK, Andre ,  STEIN, Juergen

IPC: H05K1/02 ,  H05K7/14

CPC classification number: H05K1/0271 ,  H05K1/02 ,  H05K7/1417 ,  H05K2201/09081 ,  H05K2201/10598

公开(公告)号：EP2401178A4

公开(公告)日：2012-07-25

申请号：EP10746893

申请日：2010-02-26

Applicant: DELPHI TECH INC

Inventor： SNIDER CHRIS R ,  HASSLER EDGAR GLENN

IPC: B60R11/02

CPC classification number: H04B1/082 ,  H05K1/0215 ,  H05K1/141 ,  H05K7/20436 ,  H05K2201/09081 ,  H05K2201/10386 ,  H05K2201/10446

公开(公告)号：EP2408279A8

公开(公告)日：2012-02-29

申请号：EP11173981.9

申请日：2011-07-14

Applicant: FELA Hilzinger GmbH

Inventor： Heiser, Eberhard

IPC: H05K1/02

CPC classification number: H05K1/0278 ,  H05K1/056 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/09745 ,  H05K2203/302

Abstract: Metallkernleiterplatte (1) mit einem metallischen Träger (2), auf dem auf mindestens einer seiner Hauptflächen (A, B) eine Isolierschicht (3) mit darüber angeordneten elektrischen Leiterbahnen (7a, 7b) sitzt, wobei die Metallkernleiterplatte einen Biegebereich (BB) aufweist, in welchen der metallische Träger (2) im Vergleich zur übrigen Metallkernleiterplatte (1) zumindest verdünnt ausgebildet ist. Darüber hinaus betrifft die Erfindung auch ein Verfahren zum Herstellen einer solchen Metallkernleiterplatte (1).
Vorteile: Durch das Vorsehen von Biegebereichen (BB) können die elektrischen Bauelemente (10, 100) der Metallkernleiterplatte (1) in zueinander verschiedenen Ebenen angeordnet werden.

公开(公告)号：EP2337225A1

公开(公告)日：2011-06-22

申请号：EP10195064.0

申请日：2010-12-15

Applicant: Whirpool Corporation

Inventor： Anorozo, Benedito G.

IPC: H03K17/96 ,  H05K3/00 ,  H05K1/00

CPC classification number: H03K17/962 ,  H03K2217/96076 ,  H03K2217/96079 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/0067 ,  H05K2201/09081 ,  H05K2201/10106 ,  H05K2201/2036

Abstract: A capacitive touch switch is disclosed which includes a substrate (102) having a channel (120) formed between a first surface (116) and a second surface (118) thereof, thereby defining a flexible section (122) of the substrate. The capacitive touch switch also includes an insulating panel (104) having a first face and a second face, the second face adapted to be touched by a user. The capacitive touch switch may further include a capacitive electrode (128) disposed on the flexible section, a light source (132) coupled to the first surface of the flexible section, and one or more spacers (334) secured to the first surface of the flexible section. Either the light source or the one or more spacers cause the flexible section of the substrate to be deflected away from the insulating panel when the substrate and the insulating panel are urged into contact. Deflection of the flexible section creates a gap which allows the light source to illuminate an icon disposed on the insulating panel. A method of manufacturing a capacitive touch switch is also disclosed.

Abstract translation: 公开了一种电容式触摸开关，其包括具有在第一表面（116）和第二表面（118）之间形成的通道（120）的衬底（102），从而限定衬底的柔性部分（122）。 电容式触摸开关还包括具有第一面和第二面的绝缘面板（104），第二面适于被使用者触摸。 电容式触摸开关还可以包括设置在柔性部分上的电容电极（128），耦合到柔性部分的第一表面的光源（132）和固定到柔性部分的第一表面的一个或多个间隔物（334） 灵活部分。 当基板和绝缘板被迫接触时，光源或一个或多个间隔件使得基板的柔性部分偏离绝缘板。 柔性部分的偏转产生允许光源照亮设置在绝缘板上的图标的间隙。 还公开了制造电容式触摸开关的方法。

公开(公告)号：EP1931184B8

公开(公告)日：2011-02-09

申请号：EP07023655.9

申请日：2007-12-06

Applicant: Würth Elektronik FLATcomp Systems GmbH & Co. KG

Inventor： Dietrich, Frank

IPC: H05K1/14

CPC classification number: H05K1/167 ,  G01K5/72 ,  G01L1/044 ,  G01L3/108 ,  G01L9/006 ,  H05K1/0268 ,  H05K2201/09081 ,  H05K2203/302