公开(公告)号：EP1315594A1

公开(公告)日：2003-06-04

申请号：EP01969240.9

申请日：2001-08-11

Applicant: Forschungszentrum Jülich GmbH

Inventor： DIEKMANN, Uwe ,  GÖBBELS, Heinz ,  SIGISMUND, Egon

IPC: B23K35/00 ,  H01M8/02

CPC classification number: B23K35/007 ,  B23K2201/36 ,  H01M8/0206 ,  H01M8/0228 ,  H01M2008/1293

Abstract: The invention relates to a method for producing an electroconductive contact layer on a metallic substrate, for example a bipolar plate and/or an electrode of a fuel cell. A layer with aluminium is first applied to the metallic substrate, followed by a silver contact element. In the vacuum and when heated, the silver from the silver contact element and the aluminium are transformed into a eutectic Ag-Al soldering compound. The method is especially suitable for creating a material connection between the silver contact elements on the anode side and those on the cathode side in a high temperature fuel cell.

公开(公告)号：EP0931618B1

公开(公告)日：2003-05-14

申请号：EP99420020.2

申请日：1999-01-22

Applicant: Garidel, Jean-Paul

Inventor： Garidel, Jean-Paul

IPC: B23K1/015

CPC classification number: B23K1/015 ,  B23K2201/36

公开(公告)号：EP1304198A2

公开(公告)日：2003-04-23

申请号：EP02257216.8

申请日：2002-10-17

Applicant: Xerox Corporation

Inventor： Biegelsem, David K. ,  Swartz, Lars-Erik

IPC: B26D7/08 ,  B23K26/38

CPC classification number: B23K26/0661 ,  B23K26/38 ,  B23K2201/36 ,  B26D7/08 ,  H01L51/0021 ,  Y10T156/1052 ,  Y10T156/1064 ,  Y10T156/1082

Abstract: A method and apparatus for improved cutting of an object (12) is provided. The object can take the form of many different structures including thin formations that require cutting precision, support, and dimensional control. In accordance with one example embodiment of the present invention, the method of cutting a member uses a laser and begins with the step of providing a template (16) removably adhered to the member (12). The laser then projects through the template, without intersecting with the template, to cut the member and manufacture the desired formation. The laser does not intersect with, and therefore does not cut, the template structure and cause excess laser cutting dust.

Abstract translation: 提供了一种用于改进对象（12）的切割的方法和装置。 该物体可以采取许多不同结构的形式，包括要求切割精度，支撑和尺寸控制的薄层。 根据本发明的一个示例性实施例，切割构件的方法使用激光，并且开始于提供可移除地粘附到构件（12）的模板（16）的步骤。 然后，激光器通过模板突出，而不与模板相交，以切割构件并制造所需的地层。 激光与模板结构不相交，因此不会切割，导致激光切割灰尘过多。

公开(公告)号：EP1188506A1

公开(公告)日：2002-03-20

申请号：EP01119888.4

申请日：2001-08-17

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Yamaguchi, Atsushi ,  Hirano, Masato ,  Sakai, Yoshinori

IPC: B23K1/08 ,  B23K3/06 ,  H05K3/34 ,  B23K31/02

CPC classification number: B23K1/08 ,  B23K1/0016 ,  B23K2201/36 ,  H05K3/3447 ,  H05K3/3468 ,  H05K2203/1121

Abstract: There is provided a flow soldering process for mounting an electronic component onto a board (13) by means of a lead-free solder material, wherein the molten solder material is supplied and attached to a predetermined portion of the board (13) in a solder material supplying zone (6), and thereafter the board (13) is cooled by a cooling unit in a cooling zone (7) such that the solder material adhering to the board (13) is rapidly cooled to solidify.

Abstract translation: 提供了一种用于通过无铅焊料将电子部件安装在基板（13）上的流动焊接工艺，其中熔融的焊料材料被供应并且以焊料的形式附着在板（13）的预定部分上 材料供给区域（6），然后在冷却区域（7）中通过冷却单元冷却基板（13），使得粘附在基板（13）上的焊料材料迅速冷却固化。

公开(公告)号：EP1163971A1

公开(公告)日：2001-12-19

申请号：EP01302086.2

申请日：2001-03-07

Applicant: Hitachi, Ltd.

Inventor： Soga, Tasao ,  Hata, Hanae ,  Nakatsuka, Tetsuya ,  Nakamura, Masato ,  Fujita, Yuji ,  Ishida, Toshiharu ,  Okamoto, Masahide ,  Serizawa, Koji ,  Hachiya, Toshihiro ,  Kusuno, Hideki

IPC: B23K35/26 ,  H05K3/34

CPC classification number: H01L24/32 ,  B23K35/262 ,  B23K2201/36 ,  H01L24/33 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/05155 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/1319 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/291 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/15311 ,  H01L2924/15738 ,  H01L2924/1576 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/20106 ,  H05K3/3463 ,  Y10T428/12528 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00012 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199

Abstract: An electronic equipment is capable of improving falling down shock resistance or impact resistance in an electronic equipment and of improving reliability of a solder joint (8) in a semiconductor device die-bonded Si chip or the like to which thermal shock causing large deformation may act, bump mounting of BGA, CSP, WPP, flip-chip and so forth, a power module acting large stress and so forth. The electronic equipment has a circuit board (6) and an electronic parts to be electrically connected to an electrode of the circuit board. The electrode of the circuit board (6) and an electrode of the electronic part are connected by soldering using a lead free solder (8) consisted of Cu: 0 ∼ 2.0 mass%, In: 0.1 ∼ 10 mass%, and Sn: remaining amount.

Abstract translation: 电子设备能够改善电子设备中的抗冲击性或抗冲击性，并且提高半导体器件芯片接合Si芯片等中引起大变形的热冲击可能起作用的焊点（8）的可靠性的可靠性 ，BGA，CSP，WPP，倒装芯片等的凸块安装，功能模块的应力大等等。 电子设备具有电路板（6）和电连接到电路板的电极的电子部件。 电路板（6）的电极和电子部件的电极通过焊接使用由Cu：0〜2.0质量％，In：0.1〜10质量％，Sn：残留物构成的无铅焊料（8）进行焊接而连接 量。

公开(公告)号：EP1153698A1

公开(公告)日：2001-11-14

申请号：EP00309571.8

申请日：2000-10-30

Applicant: LUCENT TECHNOLOGIES INC.

Inventor： Jin, Sungho ,  Kammlott, Guenther Wilhelm ,  Mavoori, Hareesh

IPC: B23K35/30 ,  C22C5/02

CPC classification number: C22C5/02 ,  B23K35/3013 ,  B23K2201/36 ,  H01S5/02252 ,  H01S5/02272 ,  H01S5/02284 ,  Y10T428/12889

Abstract: The invention relates to use of a solder composition exhibiting a desired combination of high creep resistance at typical operating temperatures and low stress in formed solder joints. The invention uses a solder containing 82 to 85 wt.% Au, 12 to 14 wt.% Sn, and 3 to 4 wt.% Ga (optionally with up to 2 wt.% additional elements). The small amount of added Ga induces a significant depression in the liquidus temperatures of both Au and Sn, and thus a depressed melting point (about 27°C less than eutectic Au-Sn solder), and also provides an enhanced temperature-sensitivity of the solder's creep resistance.

Abstract translation: 本发明涉及在典型工作温度下表现出高耐蠕变性和在形成的焊点中低应力的期望组合的焊料组合物的用途。 本发明使用包含82至85重量％的Au，12至14重量％的Sn和3至4重量％的Ga（任选具有至多2重量％的附加元素）的焊料。 少量添加的Ga在Au和Sn的液相线温度下引起明显的凹陷，因此熔点低（比共晶Au-Sn焊料低约27℃），并且还提供了增强的温度敏感性 焊料的抗蠕变性。

公开(公告)号：EP1121218A1

公开(公告)日：2001-08-08

申请号：EP99951764.2

申请日：1999-10-05

Applicant: Speedline Technologies, Inc.

Inventor： FREEMAN, Gary ,  NOWAK, Thomas, Jr. ,  PURCELL, Thomas ,  MIRABITO, A., Jason ,  SULLIVAN, Thomas, M.

IPC: B23K3/06

CPC classification number: H01L21/4853 ,  B23K3/0623 ,  B23K2201/36 ,  B23K2201/40 ,  H05K3/3478

Abstract: An apparatus for placing spheres at predetermined positions on a substrate. The apparatus includes a platform (112) to support the substrate at a first sphere placement position in the apparatus, and a placement station (107) disposed above the platform (112) that places spheres at locations on the substrate. The placement station (107) includes a first container (190) having a chamber to contain spheres, and a first carrier tray (182) having a substantially horizontal upper surface that forms a lower surface of the chamber. The upper surface has a first section and a second section, the second section having a plurality of holes (209) formed therein to receive spheres. The first carrier tray (182) is movable to position the second section between a fill position beneath the first container (190) and a place position disposed over the first sphere placement position. The placement station is constructed and arranged to fill the plurality of holes (209) with spheres when the second section is in the fill position, and place the spheres at the predetermined positions on the substrate when the second section is in the place position.

公开(公告)号：EP1084790A1

公开(公告)日：2001-03-21

申请号：EP00122960.8

申请日：1997-05-01

Applicant: FORD MOTOR COMPANY LIMITED ,  Ford Motor Company

Inventor： Parachuri, Mohan R. ,  Shangguan, Dong Kai ,  Achari, Achyuta

IPC: B23K35/26 ,  B23K35/14 ,  H05K3/34

CPC classification number: H01L24/32 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B23K2201/36 ,  H01L24/29 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29298 ,  H01L2224/325 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/181 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0272 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: A soldered composition formed as a paste by use of a fugitive carrier medium including up to 5-15% (by weight) flux, the solder composition being useful for soldering electronic components and packages to a circuit on a substrate consisting of a low cost thermoplastic or polymer having a heat deflection temperature. The composition comprises: (a) a ternary or binary eutectic powder of the alloy system Sn-Bi-In that melts below the heat deflection temperature, (b) a second powder admixed with the first, the second powder consisting of a tin-based powder that reacts with the first powder at 150°C or less in 15 minutes or less and has a melting temperature above the heat deflection temperature, said powders containing less than .1% Pb as an impurity and being proportioned in a weight ratio of 3:1 to 1:3, and (c) other alloying additives selected from the group of Cu, Ni, Ag, Ce, In, Bi, and Au which enhance the mechanical properties of the soldered joints at elevated temperatures and which do not inhibit metallurgical interactions of the first and second powders during soldering. A method of soldering electronic components to a substrate is also disclosed.

Abstract translation: 通过使用包含高达5-15％（重量）助熔剂的短效载体介质形成为糊剂的焊接组合物，该焊料组合物可用于将电子元件和封装焊接到衬底上的电路，该衬底由低成本热塑性塑料 或具有热挠曲温度的聚合物。 该组合物包含：（a）合金体系Sn-Bi-In的三元或二元共晶粉末，其在热变形温度以下熔融，（b）与第一粉末混合的第二粉末，第二粉末由锡基 所述粉末在150℃以下与所述第一粉末在15分钟或更短时间内反应并且具有高于所述热变形温度的熔化温度，所述粉末含有作为杂质的小于0.1％的Pb并且以3 ：（c）选自Cu，Ni，Ag，Ce，In，Bi和Au的其它合金添加剂，其在升高的温度下增强焊接接头的机械性能并且不会抑制 在焊接期间第一和第二粉末的冶金相互作用。 还公开了一种将电子元件焊接到衬底的方法。

公开(公告)号：EP1008414A2

公开(公告)日：2000-06-14

申请号：EP99125772.6

申请日：1994-09-16

Applicant: International Business Machines Corporation

Inventor： Acocella, John ,  Banks, Donald Ray ,  Benenati, Joseph Angelo ,  Caulfield, Thomas ,  Corbin, John Saunders, Jr. ,  Hoebener, Karl Grant ,  Watson, David P.

IPC: B23K1/00

CPC classification number: B23K1/0008 ,  B23K1/0016 ,  B23K2201/36 ,  B23K2201/40 ,  B23K2201/42 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/81191 ,  H01L2224/814 ,  H01L2924/00013 ,  H01L2924/09701 ,  H05K1/114 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/3478 ,  H05K3/42 ,  H05K3/429 ,  H05K2201/0215 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/0195 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/0415 ,  H05K2203/0455 ,  H05K2203/082 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49144 ,  H01L2224/29099 ,  H01L2924/014

Abstract: High melting temperature Pb/Sn 95/5 solder balls (18) are connected to copper pads on the bottom of a ceramic chip carrier substrate (10) by low melting temperature eutectic Pb/Sn solder. The connection is made by quick reflow to prevent dissolving Pb into the eutectic solder and raising its melting temperature. Then the module is placed on a fiberglass-epoxy circuit board with the solder balls on eutectic Pb/Sn solder bumps on copper pads of the board. The structure is reflowed to simultaneously melt the solder on both sides of the balls to allow each ball to center between the carrier pad and circuit board pad to form a more symmetric joint. This process results in structure that are more reliable under high temperature cycling. Also, to further improve reliability, the balls are made as large as the I/O spacing allows without bridging beam on balls; the two pads are about the same size with more solder on the smaller pad; the pads are at least 75% of the ball diameter; and the eutectic joints are made as large as possible without bridging between pads. For reliability at even higher temperature cycles or larger substrate sizes columns are used instead of balls.

公开(公告)号：EP0930149A3

公开(公告)日：2000-04-12

申请号：EP99300193.2

申请日：1999-01-12

Applicant: Huberman, Michelle

Inventor： Huberman, Michelle

IPC: B29C65/18 ,  D06F75/30

CPC classification number: B29C66/861 ,  A47G27/0443 ,  B23K3/0473 ,  B23K2201/36 ,  B29C65/18 ,  B29C66/0044 ,  B29C66/1122 ,  B29C66/41 ,  B29C66/472 ,  B29C66/8122 ,  D06F75/30 ,  B29K2827/18

Abstract: A hand-held heating tool (10) comprises a handle (12), a heating applicator (15) attached to the handle (12), and means (14,16) for electrically heating the heat applicator (15). The heat applicator (15) comprises a metal sole plate (20) of generally planar shape having: a generally planar first surface (21) that in use is lowermost to contact a substrate (31-38) to be heated; a generally planar second surface (22), substantially parallel to the first and closely adjacent thereto, to be exposed to the surrounding ambient air; and first and second extensions (23,24) of the first and second planar surfaces (21,22), said extensions (23,24) being each directed upwardly and forwardly to define a shape for the leading end of the tool - when it is in use moved forwardly over the substrate - in the form of an upwardly and forwardly directed lip (26).

Abstract translation: 手持加热工具（10）包括手柄（12），附接到手柄（12）的加热施加器（15）和用于对加热器（15）进行电加热的装置（14,16）。 热施加器（15）包括大致平面形状的金属底板（20），其具有：大致平面的第一表面（21），其在使用中最低以接触待加热的基底（31-38）; 大致平行的第二表面（22），其基本上平行于第一表面并紧密地邻近第二表面暴露于周围环境空气; 以及第一和第二平面（21,22）的第一和第二延伸部（23,24），所述延伸部分（23,24）各自向上和向前指向以限定用于工具前端的形状 在使用中向前移动在基底上 - 呈向上和向前定向的唇缘（26）的形式。