Abstract:
A memory device (50) having a cross point array (100) of memory cells (130) includes a temperature sensor (150) and a reference memory cell (160), the temperature sensor (150) sensing the temperature (T) of the memory device (50) and data from the temperature sensor (150) and the reference memory cell (160) being used to update write currents (IxPA, IyPA, IxAP, IyAP, Ix, Iy) used to program the array (100) of memory cells (130). A method of calibrating the memory device (50) involves detecting a temperature (T) of the memory device (50), determining whether the temperature of the memory device has changed by a threshold value (ΔT), and updating write current values (IxPA, IyPA, IxAP, IyAP, Ix, Iy) if the temperature (T) of the memory device changes by the threshold value (ΔT). The write current values can be updated by data from the reference memory cell (160), or from write current values stored in a lookup table.
Abstract:
A memory array test and characterization capability is disclosed which allows DC characterization of the memory cells, the bit lines, and the sense amplifiers. A row decoder is provided which includes a static wordline select signal to disable self-resetting logic within the row decoder and allow the word line to remain active for a user-controlled length of time. An analog wordline drive capability allows the active wordline to be driven to a user-controllable analog level. Direct access to a pair of bitlines is provided by a multiplexer which is statically decoded to couple a pair of isolated terminals to the respective bitlines within the decoded column. This allows DC voltage levels to be impressed upon each of the two bitlines within the decoded column and/or the two bitline currents to be sensed. A separate power connection is provided for the memory array which allows operating the memory array at a different power supply voltage than the remainder of the circuit. By utilizing one or more of these features together, several tests of the memory array may be performed, including characterizing the DC transfer function of the memory cells, the standby power of the memory array, the static noise margin of the memory cells, the alpha particle susceptibility of the memory cells as a function of memory cell supply voltage, the offset voltage of bitline sense amplifiers, and others.
Abstract:
A method for testing virgin memory cells in a multilevel memory device which comprises a plurality of memory cells, the particularity of which consists of the fact that it comprises the steps of:
reading the individual memory cells that constitute a memory device and comparing each one of these memory cells with at least one reference memory cell at a time, so as to determine whether the threshold of the memory cells is lower than the threshold of the at least one reference memory cell or not; determining the number of the memory cells whose threshold is higher than the threshold of the at least one reference cell; the at least one reference memory cell being chosen with a gradually higher threshold; when the number of memory cells whose threshold is higher than a given reference threshold is found to be sufficiently lower than the number of redundancy memory cells provided in the memory device, assuming the given reference threshold as lower reference threshold for the memory device, determining a statistical distribution of the thresholds of the memory cells.
Abstract:
An object of the present invention is to provide a semiconductor device that permits easy and efficient testing. A nonvolatile semiconductor memory comprises word lines WLi and bit lines BLi, a memory cell matrix 17 consisting of nonvolatile memory cells Cij, a sense amplifier 15, a write/erase timing circuit 9 for performing timing control necessary for write and erase operations, and a status register 2 for storing the operating state of the memory at the completion of the operation of the circuit 9, wherein there are provided, outside the address of the memory cell matrix 17, two kinds of dummy cells, D1, D2, D3,..., whose values are fixed to different values that induce different outputs from the sense amplifier 15. A pass condition or a fail condition is generated by accessing the dummy cells.
Abstract:
A manufacturing defect which causes a memory cell load device to be non-functional is frequently difficult to test. Such a defective memory cell can be written and subsequently read successfully even without the missing load device. But if the delay between the write and the subsequent read is long enough, the internal node of the memory cell leaks down to a degraded high level, and only then will the memory cell fail. The delay required to detect such a failure may easily reach tens of seconds, which is entirely inconsistent with the required economies of manufacturing test. A data retention circuit and method allows high speed test of a static memory cell to ensure that the load devices within the cell are actually present and functioning. An analog word line drive capability allows the active word line to be driven to a user-controllable analog level. This is accomplished by connecting the "VDD" and N-well of the final PMOS stage of the row decoder to an isolated terminal which is normally connected to VDD when assembled , but which is independently available prior to packaging. By lowering the analog word line voltage compared to the memory array power supply voltage, a written high level in a memory cell lacking a load device is not pulled high (because the load device in question is missing) and is already low enough to cause a subsequent read to immediately fail. Consequently, the memory array can be tested without requiring long delays between the write and read of each memory cell. Advantageously, the row and column support circuits and sensing circuits operate at the normal power supply levels for which they were designed and which may be independently margin tested.
Abstract:
A semiconductor memory having a sense amplifier, characterised in that the sense amplifier (41) contains a load resistance section (42) comprising a plurality of load transistors (TP8, TP9) having different load characteristics which are selectable for connection.
Abstract:
PCT No. PCT/DE94/00521 Sec. 371 Date Jan. 20, 1995 Sec. 102(e) Date Jan. 20, 1995 PCT Filed May 6, 1994 PCT Pub. No. WO94/28555 PCT Pub. Date Dec. 8, 1994A self-test device for memory arrangements, decoders or the like for use during on-line operation, the word lines and/or the column lines of a memory matrix being connected to a check matrix. An error detector which generates an error signal if more than one line is activated simultaneously is connected to the check matrix. Since multiple word lines or column lines are activated in the decoder for most errors which occur, a simple self-test can be performed during on-line operation by this check matrix which can be implemented in a relatively simple and cost-effective manner.
Abstract:
A semiconductor memory comprises a dynamic type memory cell array (10) arranged to form a matrix and provided with word lines (WL1 to WLm) commonly connected to memory cells (MC) of respective columns and bit lines (BLl through BLn) commonly connected to memory cells of respective rows, a dummy cell section (11) having a first set of dummy word lines (DWL) connected to respective complimentary bit line pairs (BL, /BL) of said memory cell array by way of respective first capacitances (C) and a second set of dummy word lines (/DWL) connected to respective complementary bit line pairs of said memory cell array by way of respective second capacitances (C), a dummy word line potential control circuit (15) capable of optionally controlling the mode of driving selected dummy word lines when said word lines of said memory cell array are activated and sense amplifiers (SAl to SAn) connected to the respective complementary bit line pairs of said memory cell array for reading data from selected memory cells of the memory cell array onto the related bit line.