公开(公告)号：EP2963655A4

公开(公告)日：2016-11-02

申请号：EP14756789

申请日：2014-02-28

Applicant: SEKISUI CHEMICAL CO LTD

Inventor： ISHIDA HIROYA ,  MATSUSHITA KIYOTO

IPC: H01B5/00 ,  B22F1/02 ,  H01B1/00 ,  H01B1/22 ,  H01B5/16 ,  H01R11/01

CPC classification number: H01B1/22 ,  B22F1/025 ,  B23K35/0244 ,  B23K35/262 ,  C22C13/00 ,  C23C18/1635 ,  C23C18/1651 ,  C23C18/1653 ,  C25D5/12 ,  H01B1/02 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/27334 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29411 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29455 ,  H01L2224/29457 ,  H01L2224/29464 ,  H01L2224/29466 ,  H01L2224/29469 ,  H01L2224/29481 ,  H01L2224/29487 ,  H01L2224/32227 ,  H01L2224/83191 ,  H01L2224/834 ,  H01L2224/83447 ,  H01L2224/83815 ,  H01L2224/83851 ,  H01L2924/3512 ,  H01L2924/3651 ,  H05K3/323 ,  H05K2201/0218 ,  H05K2201/0221 ,  H05K2203/0425 ,  H01L2924/00014 ,  H01L2924/04941 ,  H01L2924/05342 ,  H01L2924/01015 ,  H01L2924/01005 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/01032 ,  H01L2924/01013 ,  H01L2924/0103 ,  H01L2924/01028 ,  H01L2924/01027 ,  H01L2924/01029

Abstract: The present invention aims to provide electroconductive microparticles which are less likely to cause disconnection due to breakage of connection interfaces between electrodes and the electroconductive microparticles even under application of an impact by dropping or the like and are less likely to be fatigued even after repetitive heating and cooling, and an anisotropic electroconductive material and an electroconductive connection structure each produced using the electroconductive microparticles. The present invention relates to electroconductive microparticles each including at least an electroconductive metal layer, a barrier layer, a copper layer, and a solder layer containing tin that are laminated in said order on a surface of a core particle made of a resin or metal, the copper layer and the solder layer being in contact with each other directly, the copper layer directly in contact with the solder layer containing copper at a ratio of 0.5 to 5 % by weight relative to tin contained in the solder layer.

公开(公告)号：EP2792721A4

公开(公告)日：2015-05-06

申请号：EP12857139

申请日：2012-12-10

Applicant: DEXERIALS CORP

Inventor： ODAKA RYOSUKE ,  SATO DAISUKE

IPC: C09J4/02 ,  C08F220/32 ,  C09J5/06 ,  C09J163/10 ,  H01R11/01 ,  H01R43/00 ,  H05K1/14

CPC classification number: C09J4/00 ,  C08F220/32 ,  C09J4/06 ,  C09J163/10 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0221

公开(公告)号：EP2211354A4

公开(公告)日：2014-04-09

申请号：EP08841309

申请日：2008-10-21

Applicant: NIPPON CHEMICAL IND

Inventor： ABE SHINJI

IPC: H01B5/00 ,  C09J9/02 ,  C09J201/00 ,  H01B1/22 ,  H01R11/01 ,  H05K3/32

CPC classification number: H05K3/323 ,  C08K3/017 ,  C08K9/02 ,  C09J9/02 ,  C09J11/04 ,  H01B1/22 ,  H01R4/04 ,  H05K2201/0209 ,  H05K2201/0221 ,  H05K2201/0224 ,  Y10T428/2991

Abstract: The present invention provides a coated conductive powder in which the aggregation of conductive particles is suppressed and which is also excellent in electrical reliability, and a conductive adhesive using the same that can provide connection with high electrical reliability even for the connection of the electrodes of miniaturized electronic parts, such as IC chips, and circuit boards. The coated conductive powder of the present invention is a coated conductive powder obtained by coating the surfaces of conductive particles with insulating inorganic fine particles, wherein the volume resistivity value of the coated conductive powder is 1 ©·cm or less, the specific gravity of the insulating inorganic fine particles is 5.0 g/ml or less, the particle diameter ratio of the insulating inorganic fine particles to the conductive particles (the insulating inorganic fine particles/the conductive particles) is 1/100 or less, and the insulating inorganic fine particles adhere to the surfaces of the conductive particles.

公开(公告)号：EP2139009B1

公开(公告)日：2013-06-26

申请号：EP08739514.1

申请日：2008-03-31

Applicant: Sekisui Chemical Co., Ltd.

Inventor： SUN, Ren-de ,  MATSUSHITA, Kiyoto ,  SASAKI, Taku ,  UENOYAMA, Shinya ,  OKUDA, Masaki ,  OKINAGA, Nobuyuki

IPC: H01B5/00 ,  B22F1/02 ,  B23K35/26 ,  C22C13/00 ,  C25D5/12 ,  C25D7/00 ,  H01L21/60 ,  C23C18/16 ,  C23C18/32 ,  C25D5/10 ,  C25D5/56 ,  C23C28/00 ,  C23C18/48 ,  C23C18/40 ,  C23C28/02 ,  H05K3/34 ,  C23C18/34

CPC classification number: C25D5/12 ,  B22F1/025 ,  B23K35/26 ,  C23C18/1635 ,  C23C18/1653 ,  C23C18/1692 ,  C23C18/30 ,  C23C18/34 ,  C23C28/023 ,  C25D5/10 ,  C25D5/56 ,  C25D7/00 ,  H01L24/13 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/2989 ,  H01L2224/81101 ,  H01L2224/81801 ,  H01L2224/83851 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/3436 ,  H05K2201/0221 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2224/13111 ,  H01L2924/00014

公开(公告)号：EP2057006A4

公开(公告)日：2012-07-18

申请号：EP06844998

申请日：2006-12-08

Applicant: TRILLION SCIENCE INC

Inventor： LIANG RONG-CHANG ,  HO SHIH-WEI ,  LIU ERIC H ,  XU QIANFEI

IPC: H05K3/32 ,  B32B27/00 ,  H01B1/22 ,  H01B1/24 ,  H01R13/24

CPC classification number: H05K3/323 ,  H01B1/22 ,  H01B1/24 ,  H01L2224/73204 ,  H01L2924/07811 ,  H01R13/2414 ,  H05K2201/0221 ,  H05K2201/10378 ,  H05K2203/0113 ,  H05K2203/0338 ,  Y10T428/24612 ,  Y10T428/2462 ,  H01L2924/00

公开(公告)号：EP2282328A4

公开(公告)日：2011-12-21

申请号：EP09754513

申请日：2009-03-31

Applicant: SONY CHEM & INF DEVICE CORP

Inventor： SUGA YASUHIRO

IPC: H01L21/60 ,  C08K3/36 ,  C08K9/04 ,  C09J9/02 ,  C09J11/04 ,  C09J163/00

CPC classification number: H05K3/323 ,  C08K3/36 ,  C08K9/04 ,  C09J163/00 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83851 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K2201/0209 ,  H05K2201/0221 ,  H01L2924/00 ,  H01L2924/05442 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/05341 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: An adhesive film can ensure reliable continuity even if a filler and a binder composition are not sufficiently removed from between a wiring board and a semiconductor chip during flip-chip mounting of the semiconductor chip on the wiring board using an adhesive film containing a non-conductive filler. The adhesive film is formed from a binder composition including an epoxy compound, a curing agent, and the filler. The amount of the filler contained with respect to a total amount of the epoxy compound, the curing agent, and the filler is 10 to 70 mass%. The filler includes first non-conductive inorganic particles having an average particle size of 0.5 to 1.0 µm, and conductive particles formed by subjecting second non-conductive inorganic particles having an average particle size of 0.5 to 1.0 µm to an electroless plating treatment so that the average particle size of the conductive particles does not exceed 1.5 µm. The conductive particles is contained in an amount of 10 to 60 mass% of the filler.

Abstract translation: 即使在使用包含不导电材料的粘合剂膜将半导体芯片倒装安装在布线板期间，从布线板和半导体芯片之间填充物和粘合剂组合物没有充分去除的情况下，粘合剂膜也可以确保可靠的连续性 填料。 粘合剂膜由包含环氧化合物，固化剂和填料的粘合剂组合物形成。 相对于环氧化合物，固化剂和填充剂的总量，填充剂的含量为10〜70质量％。 所述填料包含平均粒径为0.5〜1.0μm的第一非导电性无机粒子和对平均粒径为0.5〜1.0μm的第二非导电性无机粒子进行非电解镀覆处理而形成的导电性粒子， 导电颗粒的平均粒径不超过1.5μm。 导电颗粒的含量为填料的10至60质量％。

公开(公告)号：EP2120525A4

公开(公告)日：2011-05-25

申请号：EP08721360

申请日：2008-03-05

Applicant: BRIDGESTONE CORP

Inventor： KOTSUBO HIDEFUMI ,  FUNAKI TATSUYA ,  SASAKI KIYOMI ,  HANZAWA KENTARO

IPC: H05K9/00 ,  B32B15/08 ,  E04B1/92 ,  G09F9/00

CPC classification number: H05K9/0096 ,  C23C18/1608 ,  C23C18/1653 ,  C23C18/1669 ,  C23C18/30 ,  C23C18/31 ,  C23C18/405 ,  H05K9/0005 ,  H05K2201/0221 ,  Y10T428/2991 ,  Y10T428/2998

公开(公告)号：EP2308904A1

公开(公告)日：2011-04-13

申请号：EP09802911.9

申请日：2009-07-27

Applicant: Sekisui Chemical Co., Ltd.

Inventor： WADA, Takuya ,  NAGATANI, Naoyuki

IPC: C08F220/10 ,  C08J3/12

CPC classification number: H05K3/323 ,  C01P2004/84 ,  C08F220/18 ,  C08F222/1006 ,  C09C3/10 ,  H05K2201/0218 ,  H05K2201/0221

Abstract: An object of the present invention is to provide a polymer particulate material with a low compression modulus and a high recovery rate from compression deformation.
The present invention provides a polymer particulate material obtainable by co-polymerizing comonomer components including a polyfunctional (meth)acrylate having a structure represented by the below formulas (1), (2) or (3), and a monofunctional (meth)acrylate monomer having a structure represented by the below formula (4), the polymer particulate material shows a recovery rate from compressive deformation of 70% or higher:

In the formula (1), n represents an integer within the range of 4 to 10. In the formula (2), R11 represents a hydrogen atom or a C1-4 alkyl group, R12, R13 and R14 each represent a C1-4 alkylene group, and R15, R16 and R17 each represent a hydrogen atom or a methyl group. In the formula (3), R3, R4, R5 and R6 each represent a C1-4 alkylene group, and R7, R8, R9 and R10 each represent a hydrogen atom or a methyl group. In the formula (4), R1 represents a hydrogen atom or a methyl group, and R2 represents a C5-18 alkyl group.

Abstract translation: 本发明的目的是提供一种具有低压缩模量和高压缩变形回收率的聚合物颗粒材料。 本发明提供一种聚合物颗粒材料，其可通过共聚单体组分包括具有由下式（1），（2）或（3）表示的结构的多官能（甲基）丙烯酸酯和单官能（甲基）丙烯酸酯单体 具有由下式（4）表示的结构，聚合物颗粒材料表现出从压缩变形的回收率为70％以上：在式（1）中，n表示4〜10的整数。在 式（2）中，R11表示氢原子或C1-4烷基，R12，R13和R14各自表示C1-4亚烷基，R15，R16和R17各自表示氢原子或甲基。 在式（3）中，R 3，R 4，R 5和R 6各自表示C 1-4亚烷基，R 7，R 8，R 9和R 10各自表示氢原子或甲基。 在式（4）中，R 1表示氢原子或甲基，R 2表示C 5-18烷基。

公开(公告)号：EP2282328A1

公开(公告)日：2011-02-09

申请号：EP09754513.1

申请日：2009-03-31

Applicant: Sony Chemical & Information Device Corporation

Inventor： SUGA, Yasuhiro

IPC: H01L21/60 ,  C09J9/02 ,  C09J11/04

CPC classification number: H05K3/323 ,  C08K3/36 ,  C08K9/04 ,  C09J163/00 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83851 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K2201/0209 ,  H05K2201/0221 ,  H01L2924/00 ,  H01L2924/05442 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/05341 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: An adhesive film can ensure reliable continuity even if a filler and a binder composition are not sufficiently removed from between a wiring board and a semiconductor chip during flip-chip mounting of the semiconductor chip on the wiring board using an adhesive film containing a non-conductive filler. The adhesive film is formed from a binder composition including an epoxy compound, a curing agent, and the filler. The amount of the filler contained with respect to a total amount of the epoxy compound, the curing agent, and the filler is 10 to 70 mass%. The filler includes first non-conductive inorganic particles having an average particle size of 0.5 to 1.0 µm, and conductive particles formed by subjecting second non-conductive inorganic particles having an average particle size of 0.5 to 1.0 µm to an electroless plating treatment so that the average particle size of the conductive particles does not exceed 1.5 µm. The conductive particles is contained in an amount of 10 to 60 mass% of the filler.

Abstract translation: 即使在使用含有非导电性的粘合剂膜将半导体芯片倒装芯片安装到布线板上时，即使在布线板和半导体芯片之间没有充分地去除填料和粘合剂组合物，粘合膜也可确保可靠的连续性 填料。 粘合膜由包含环氧化合物，固化剂和填料的粘合剂组合物形成。 相对于环氧化合物，固化剂和填料的总量，填充剂的含量为10〜70质量％。 填充剂包括平均粒径为0.5〜1.0μm的第一非导电性无机粒子和将平均粒径为0.5〜1.0μm的第二非导电性无机粒子进行化学镀处理而形成的导电粒子， 导电粒子的平均粒径不超过1.5μm。 导电粒子的含量为填料的10〜60质量％。

公开(公告)号：EP2053615A4

公开(公告)日：2010-10-06

申请号：EP07791966

申请日：2007-08-03

Applicant: IST CORP

Inventor： HAMA NOBUYUKI ,  TAKEDA YASUAKI ,  MORIUCHI KOJI

IPC: H01B1/22 ,  C09D179/08

CPC classification number: H01B1/22 ,  C08K5/378 ,  C08K9/02 ,  C08L79/08 ,  C09D179/08 ,  C09J9/02 ,  C09J11/04 ,  C09J11/06 ,  C09J179/08 ,  H05K1/095 ,  H05K2201/0154 ,  H05K2201/0221 ,  H05K2203/124