公开(公告)号：EP0376924A3

公开(公告)日：1990-08-22

申请号：EP90102033.9

申请日：1988-05-16

Applicant: RAYCHEM CORPORATION (a Delaware corporation)

Inventor： Cray, Seymour R. ,  Krajewsky, Nicholas J.

IPC: H01L21/603

CPC classification number: H05K3/308 ,  B23K20/007 ,  H01L23/5384 ,  H01L24/45 ,  H01L24/49 ,  H01L24/81 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4943 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85045 ,  H01L2224/85205 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2225/06593 ,  H01L2225/06596 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H05K3/368 ,  H05K2201/096 ,  H05K2201/1059 ,  H05K2201/10825 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K2203/0495 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/20757 ,  H01L2924/01204 ,  H01L2224/05599

Abstract: A method of attaching flying leads to integrated circuit chips. This method comprises the steps of:
(a) forming a gold ball (106) on the end of a gold lead (101) by rapidly heating the end of the lead; (b) pressing the gold ball against the bonding pad (105) of an integrated circuit chip (104) so that the gold lead forms an electrical and mechanical bond to the bonding pad to the integrated circuit chip; (c) notching the gold lead at a height above the gold ball; and (d) stretching the gold lead so that it breaks at the notched position and straightens the gold lead forming a flying lead.

公开(公告)号：EP0376924A2

公开(公告)日：1990-07-04

申请号：EP90102033.9

申请日：1988-05-16

Applicant: RAYCHEM CORPORATION (a Delaware corporation)

Inventor： Cray, Seymour R. ,  Krajewsky, Nicholas J.

IPC: H01L21/603

CPC classification number: H05K3/308 ,  B23K20/007 ,  H01L23/5384 ,  H01L24/45 ,  H01L24/49 ,  H01L24/81 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4943 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85045 ,  H01L2224/85205 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2225/06593 ,  H01L2225/06596 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H05K3/368 ,  H05K2201/096 ,  H05K2201/1059 ,  H05K2201/10825 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K2203/0495 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/20757 ,  H01L2924/01204 ,  H01L2224/05599

Abstract: A method of attaching flying leads to integrated circuit chips. This method comprises the steps of:

(a) forming a gold ball (106) on the end of a gold lead (101) by rapidly heating the end of the lead;
(b) pressing the gold ball against the bonding pad (105) of an integrated circuit chip (104) so that the gold lead forms an electrical and mechanical bond to the bonding pad to the integrated circuit chip;
(c) notching the gold lead at a height above the gold ball; and
(d) stretching the gold lead so that it breaks at the notched position and straightens the gold lead forming a flying lead.

Abstract translation: 将飞行引线连接到集成电路芯片的方法。 该方法包括以下步骤：（a）通过快速加热引线的端部，在金引线（101）的端部上形成金球（106） （b）将金球压在集成电路芯片（104）的焊盘（105）上，使得金引线与焊盘形成电和机械结合到集成电路芯片; （c）在金球高度上切割金铅; 和（d）拉伸金铅，使其在切口位置处断裂并拉直形成飞铅的金铅。 p

公开(公告)号：EP0100175B1

公开(公告)日：1988-06-01

申请号：EP83304018.1

申请日：1983-07-11

Applicant: Corning Glass Works

Inventor： Womack, Billy Bob

IPC: H01G1/147

CPC classification number: H01G4/2325 ,  H05K3/3442 ,  H05K2201/10636 ,  H05K2201/10909 ,  Y02P70/611 ,  Y02P70/613

公开(公告)号：EP0250450A1

公开(公告)日：1988-01-07

申请号：EP86905650.0

申请日：1986-09-15

Applicant: MOTOROLA, INC.

Inventor： LIN, Paul, T.

IPC: H01L23 ,  H05K3

CPC classification number: H01L23/49555 ,  H01L23/3107 ,  H01L23/3135 ,  H01L2924/0002 ,  H05K3/3426 ,  H05K2201/10689 ,  H05K2201/10909 ,  H05K2201/2081 ,  Y02P70/613 ,  H01L2924/00

Abstract: Un boîtier de montage en surface (60) comprend plusieurs conducteurs de boîtiers extérieurs (64) à double surface finie (66, 68). La partie inférieure du conducteur qui doit être liée à un bloc de liaison (74) d'un substrat (70), tel qu'un tableau de circuit imprimé, est pourvue d'une surface (68) mouillable avec de la soudure, ladite surface s'étendant uniquement sur une partie de la longueur du conducteur (64) afin de rencontrer une partie (66) de surface non mouillable. Alternativement ou additionnellement, les parties supérieures des conducteurs (64) peuvent être revêtues à l'aide d'une composition chimique, d'une composition plastique ou d'une autre composition rejetant la soudure (84), permettant d'obtenir la partie (66) de surface non mouillable. Les liens obtenus grâce à l'utilisation desdits conducteurs (64) sont plus résistants et plus fiables, grâce à l'affinité de la soudure (72) pour le conducteur (64) au niveau de la zone de contact (74) et grâce à la réticence de la soudure (72) à amener le conducteur, telle une mèche, dans la zone non mouillable (66) du conducteur (64) plus près du boîtier (60) éloignant ainsi la soudure (72) de la zone de liaison (74). La configuration de la liaison de soudure peut être modifiée rapidement et aisément en régulant la surface ou la profondeur de la région (68) revêtue par la soudure uniquement sur la partie inférieure des conducteurs (64) du boîtier de montage en surface (60) pour circuits intégrés.

公开(公告)号：EP0117111A3

公开(公告)日：1986-03-26

申请号：EP84300895

申请日：1984-02-13

Applicant: FUJITSU LIMITED

Inventor： Sugimoto, Masahiro ,  Wakabayashi, Tetsushi ,  Muratake, Kiyoshi Musashinakahara Royaruparesu

IPC: H01L23/48 ,  H01L23/04 ,  H05K03/32 ,  H01L23/52

CPC classification number: H01L24/32 ,  H01L23/057 ,  H01L23/49811 ,  H01L23/5385 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/351 ,  H05K3/3426 ,  H05K2201/10704 ,  H05K2201/10909 ,  H05K2201/2081 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/3512 ,  H01L2924/00

Abstract: A semiconductor device for mounting directly on a circuit board comprises a semiconductor chip 5, a package 1,7,8 in which the semiconductor chip 5 is mounted, a plurality of conductor pads 3 provided on the outer surface of the package 1,7,8 and a plurality of conductor pins 40, fixed to the conductor pads and projecting substantially normally away from them. The conductor pins 40 are fixed to contact pads 9 on a circuit board 2 and electrically and mechanically interconnect the package 1, 7, 8 and the circuit board 2. The pins 40 accommodate the differing thermal expansion of the package 1, 7, 8 and the circuit board 2.

公开(公告)号：EP3262667A1

公开(公告)日：2018-01-03

申请号：EP16708957.2

申请日：2016-02-25

Applicant: Epcos AG

Inventor： KOINI, Markus ,  AUER, Christoph ,  KONRAD, Jürgen ,  RINNER, Franz ,  PUFF, Markus ,  STADLOBER, Monika ,  WIPPEL, Thomas

IPC: H01G4/232 ,  H01G4/38 ,  H01G2/06 ,  H05K1/18

CPC classification number: H01G4/38 ,  H01G2/06 ,  H01G4/228 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/248 ,  H01G4/30 ,  H01R43/26 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10757 ,  H05K2201/10818 ,  H05K2201/10909 ,  Y02P70/613

Abstract: The invention relates to an electrical connection contact (5) for a ceramic component (2). Said connection contact (5) comprises a first material (M1) and a second material (M2) that is arranged thereupon, said first material (M1) having a high degree of electrical conductivity, and said second material (M2) having a low coefficient of thermal expansion.

公开(公告)号：EP2434859A2

公开(公告)日：2012-03-28

申请号：EP10777921.7

申请日：2010-05-17

Applicant: Doo Sung Industrial Co., Ltd.

Inventor： KIM, Seon Tae ,  LEE, Hyung Chun ,  LEE, Sang Won

IPC: H05K9/00 ,  H05K3/30

CPC classification number: H05K3/3421 ,  H01R13/03 ,  H01R13/2414 ,  H05K2201/10909 ,  Y02P70/613

Abstract: The present invention provides a conductive contact terminal for surface mounting on a substrate. In the conductive contact terminal, an elastic core imparts elasticity to the contact terminal. A metal layer covers the outer portion of the elastic core. A conductive adhesive layer is interposed between the elastic core and the metal layer to bond the elastic core and the metal layer to each other. The conductive contact terminal has a low electrical resistance, does not exhibit a deformation in the material even in a high-temperature reflow soldering process, and does not lose conductivity even though a metal layer, which imparts electrical conductivity to the conductive contact terminal, is broken.

Abstract translation: 本发明提供一种用于表面安装在基板上的导电接触端子。 在导电接触端子中，弹性芯向接触端子施加弹性。 金属层覆盖弹性芯的外部。 在弹性芯和金属层之间插入导电粘合剂层，以将弹性芯和金属层彼此粘合。 导电接触端子具有低电阻，即使在高温回流焊接工艺中也不会在材料中发生变形，并且即使向导电接触端子赋予导电性的金属层为 破碎。

公开(公告)号：EP1441232A3

公开(公告)日：2009-11-04

申请号：EP04005887.7

申请日：1995-11-15

Applicant: FormFactor, Inc.

Inventor： Khandros, Igor Y. ,  Mathieu, Gaetan L. ,  Eldridge, Benjamin N. ,  Grube, Gary W.

IPC: G01R1/073 ,  G01R1/04

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0483 ,  G01R31/2863 ,  H01L21/288 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05082 ,  H01L2224/05644 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13582 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45644 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48644 ,  H01L2224/48699 ,  H01L2224/48844 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2224/48744 ,  H01L2924/20751 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/20754

Abstract: A method of making a temporary connection between a first electronic component and a second electronic component, and subsequently making a permanent connection between the first electronic component and a third electronic component, comprising permanently mounting a plurality of resilient contact structures to a surface of the first electronic component; urging the first electronic component against the second electronic component to effect a temporary connection between the first electronic component and the second electronic component; removing the second electronic component; and mounting the first electronic component to the third electronic component.

公开(公告)号：EP1909541A1

公开(公告)日：2008-04-09

申请号：EP07021310.3

申请日：2004-12-15

Applicant: MATSUSHITA ELECTRIC WORKS, LTD.

Inventor： Kambara, Yasushi ,  Motoyama, Akira ,  Nakajima, Masayuki

IPC: H05B41/282 ,  H05B41/02 ,  H01G2/06

CPC classification number: H01G4/228 ,  H01G2/06 ,  H01G4/18 ,  H05B41/2827 ,  H05K3/3447 ,  H05K3/3463 ,  H05K2201/062 ,  H05K2201/10909 ,  H05K2203/304

Abstract: A lighting device for a lamp device is provided. The lighting device includes a circuit board and film capacitors packaged on the circuit board by using leadless flow solders. Each film capacitor comprises polypropylene films and lead wires, and a material of the lead wires has a thermal conductivity lower than a thermal conductivity of copper, and terminals and internal materials of the film capacitors are leadless. A diameter of the lead wires is 0.6~ (mm) or less, a cross-sectional area is 35mm 2 or less, and a temperature at a terminal and of the lead wires in the film capacitors during a soldering process is 130°C or less.

Abstract translation: 提供了一种用于灯装置的照明装置。 照明装置包括通过使用无铅流动焊料封装在电路板上的电路板和薄膜电容器。 每个薄膜电容器包括聚丙烯薄膜和导线，并且导线的材料的导热率低于铜的热导率，薄膜电容器的端子和内部材料是无引线的。 引线的直径为0.6〜（mm）以下，截面积为35mm 2以下，焊接工序中的薄膜电容器的端子温度和引线的温度为130℃， 减。

公开(公告)号：EP1878038A1

公开(公告)日：2008-01-16

申请号：EP06742657.7

申请日：2006-04-24

Applicant: DBK David + Baader GmbH

Inventor： GSCHWIND, Thomas ,  BAUER, Hans-Peter

IPC: H01H85/10

CPC classification number: H05K1/0201 ,  H01H37/761 ,  H01H85/10 ,  H01H2085/0275 ,  H01H2085/0555 ,  H05K3/308 ,  H05K2201/10181 ,  H05K2201/10878 ,  H05K2201/10909

Abstract: A safety fuse for printed circuit board assembly has leads that can be electrically connected to printed circuits on the printed circuit board, and at least one conductive and fusible connection between the leads. The safety fuse is designed in such a way that it can be cost-effectively produced in a single piece from sheet metal or conductive plastics. The safety fuse can prevent overheating of a heating device in which it is used, in that it is adapted to cut the at least one conductive and fusible connection in the event of thermal overload.