公开(公告)号：EP2255408B1

公开(公告)日：2012-07-04

申请号：EP09721532.1

申请日：2009-03-13

Applicant: Günther Heisskanaltechnik GmbH

Inventor： GÜNTHER, Herbert ,  SOMMER, Siegrid ,  KRETZSCHMAR, Christel ,  PARTSCH, Uwe

IPC: H05K3/32 ,  H01R4/62

CPC classification number: H01R4/625 ,  H05K1/092 ,  H05K3/245 ,  H05K3/321 ,  H05K2201/10992 ,  H05K2203/1131

Abstract: The invention relates to an electrical connection (50; 60) between a first electrically conductive component (44) made of a first material and a second electrically conductive component (48; 62; 70) made of a second material. According to the invention, said electrical connection comprises between the electrically conductive components (44, 48; 62; 70) at least two electrically conductive adhesive layers (52, 54, 56) made of different adhesive layer materials and generating said electrical connection.

公开(公告)号：EP2440024A1

公开(公告)日：2012-04-11

申请号：EP10783253.7

申请日：2010-05-18

Applicant: Sumitomo Electric Industries, Ltd. ,  Sumitomo Electric Printed Circuits, Inc.

Inventor： Yamamoto, Masamichi ,  Nakatsugi, Kyouichirou ,  Yamaguchi, Takashi ,  Kawakami, Shigeki ,  Kimura, Michihiro

IPC: H05K3/36 ,  H05K1/14 ,  H05K3/34

CPC classification number: H05K3/361 ,  C23F11/149 ,  H01L2924/0002 ,  H05K3/282 ,  H05K3/305 ,  H05K3/323 ,  H05K3/3431 ,  H05K3/4007 ,  H05K2201/0248 ,  H05K2201/0373 ,  H05K2201/094 ,  H05K2201/10977 ,  H05K2201/10992 ,  H05K2203/308 ,  Y10T156/10 ,  H01L2924/00

Abstract: [Object] Provided are a connection method and an electronic device, in which the manufacturing process can be simplified, and a connection structure using an adhesive can be produced at low cost.
[Solution] A connection method according to the present invention includes a step (a1) of preparing base materials 10 and 21 each including an electrode for connection using an adhesive, a step (b1) of covering electrodes 12 and 22 for connection using an adhesive with organic films 15 configured to prevent oxidation, the electrodes 12 and 22 being located on the base materials, a step (c1) of removing or thinning the organic films, and after the step (c1), a step (d1) of bonding the electrodes for connection using an adhesive to each other with an adhesive 30 mainly containing a thermosetting resin to establish electrical connection.

公开(公告)号：EP1808265A4

公开(公告)日：2009-10-21

申请号：EP05805313

申请日：2005-10-27

Applicant: PANASONIC CORP

Inventor： MAEDA TADASHI ,  SAKAI TADAHIKO

IPC: B23K35/362 ,  B23K35/02 ,  B23K35/28 ,  B23K35/30 ,  B23K35/36 ,  H05K3/34

CPC classification number: H05K3/3484 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/282 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/3613 ,  H05K3/3436 ,  H05K3/3463 ,  H05K3/3489 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/10992 ,  Y02P70/613

公开(公告)号：EP1324389B1

公开(公告)日：2008-12-10

申请号：EP03003230.4

申请日：1999-07-06

Applicant: Infineon Technologies AG

Inventor： Hacke, Hans-Jürgen ,  Galuschki, Klaus-Peter

IPC: H01L23/48 ,  H01L23/482 ,  H01L23/485 ,  H01L21/60 ,  H01L23/532 ,  H01L23/31

CPC classification number: H01L24/10 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/351 ,  H05K3/321 ,  H05K3/3436 ,  H05K2201/0212 ,  H05K2201/10234 ,  H05K2201/10992 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49798 ,  Y10T156/1089 ,  H01L2924/00

公开(公告)号：EP1912485A1

公开(公告)日：2008-04-16

申请号：EP06781339.4

申请日：2006-07-20

Applicant: Sharp Kabushiki Kaisha

Inventor： KINOSHITA, Kazuo

IPC: H05K3/34 ,  H05K1/18

CPC classification number: H05K3/3436 ,  H05K3/3463 ,  H05K3/363 ,  H05K3/368 ,  H05K2201/094 ,  H05K2201/10234 ,  H05K2201/10992 ,  H05K2201/2036 ,  H05K2203/048 ,  Y02P70/613

Abstract: The camera module structure (10) of the present invention is arranged such that a board electrode (2) of a printed board (1) and a mounting electrode (4) of a camera module (3) mounted on the printed board (1) are joined with each other through a solder joint section (5), and the board electrode (2) and the mounting electrode (4) are aligned by self-alignment. The solder joint section (5) includes a solder section (16) for solder-joining, and a supporting section (17) for supporting the camera module (3). The present invention realizes a solder mounting structure wherein a heavy-weight component is joined on the board with solder by self-alignment.

Abstract translation: 本发明的照相机模块结构（10）被布置成使得印刷电路板（1）的电路板电极（2）和安装在印刷电路板（1）上的照相机模块（3）的安装电极（4） 通过焊料接合部（5）彼此接合，并且板电极（2）和安装电极（4）通过自对准而对齐。 焊接部（5）包括用于焊接的焊接部分（16）和用于支撑照相机模块（3）的支撑部分（17）。 本发明实现了一种焊料安装结构，其中重量较大的部件通过自对准与焊料结合在板上。

公开(公告)号：EP1729343A2

公开(公告)日：2006-12-06

申请号：EP06011142.4

申请日：2006-05-30

Applicant: HITACHI, LTD. ,  HITACHI HARAMACHI ELECTRONICS CO., LTD.

Inventor： Toyoda, Yasushi ,  Saito, Katsuaki ,  Koike, Yoshihiko ,  Ookubo, Shinji

IPC: H01L23/498 ,  H01L23/373

CPC classification number: H01L23/3735 ,  H01L23/24 ,  H01L23/488 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/80 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H05K3/3421 ,  H05K3/3463 ,  H05K2201/10992 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The object of the invention is to provide a power semiconductor module having solder joints that are highly reliable for temperature cycles.
In a power semiconductor module of the present invention, a solder joint between a metal circuit pattern and metal terminal on an insulation substrate is formed by covering, from above, a high melting point solder, which is joined on the metal circuit pattern and has a prescribed thickness, with a low melting point solder and then joining the metal terminal with the low melting point solder.

Abstract translation: 本发明的目的是提供一种具有对温度循环高度可靠的焊点的功率半导体模块。 在本发明的功率半导体模块中，通过从上方覆盖连接在金属电路图案上的高熔点焊料形成绝缘基板上的金属电路图案与金属端子之间的焊点， 规定厚度，具有低熔点焊料，然后将金属端子与低熔点焊料接合。

公开(公告)号：EP1654916A1

公开(公告)日：2006-05-10

申请号：EP04750598.7

申请日：2004-04-23

Applicant: Teradyne, Inc.

Inventor： KHILCHENKO, Leon, M. ,  GAILUS, Mark, W.

IPC: H05K3/00

CPC classification number: H05K3/4038 ,  H05K1/0298 ,  H05K3/321 ,  H05K3/3447 ,  H05K3/4046 ,  H05K3/4069 ,  H05K2201/0305 ,  H05K2201/0919 ,  H05K2201/10234 ,  H05K2201/1059 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/1446 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49147 ,  Y10T29/49165

Abstract: What is provided is a multi-layer PCB having a plurality of stacked dielectric layers, a conductor disposed on at least one of the plurality of dielectric layers, and a non-conductive via extending through at least a portion of the plurality of dielectric layers to intersect the conductor. A conductive body in an activated state is introduced into the non-conductive via, and upon contacting the conductor, the activated state conductive body adheres to the conductor. The activated state conductive body is then effected to a deactivated state, wherein the conductive body is affixed to the conductor to provide an electrical connection thereto.

公开(公告)号：EP1488880A3

公开(公告)日：2006-04-05

申请号：EP04012883.7

申请日：2004-06-01

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Akamatsu, Hiroshi ,  Kawamura, Yukinori ,  Kai, Hiroshi ,  Kuramoto, Osamu ,  Iwasaki, Shigeru ,  Asai, Kenji ,  Hibino, Minoru

IPC: B23K1/19

CPC classification number: H05K3/3415 ,  B23K3/0638 ,  B23K2201/42 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/035 ,  H05K2201/10992 ,  H05K2203/0545 ,  H05K2203/111 ,  H05K2203/1121 ,  H05K2203/1476 ,  Y02P70/613 ,  Y10T428/12493

Abstract: A structure of solder joint structure formed of zinc-based lead-free solder having excellent characteristics is disclosed. Between a first lead-free solder layer and a soldering pad, the following layers are formed: a tin-copper alloy layer formed on the pad; a first alloy layer formed of second lead-free layer of which main ingredients are tin and silver; and a second alloy layer formed between the first alloy layer and the first lead-free solder. This structure allows forming the solder joint structure formed of zinc-based lead-free solder having high joint strength.

公开(公告)号：EP1198162A3

公开(公告)日：2004-01-21

申请号：EP01115885.4

申请日：2001-06-29

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Mitani, Tsutomu ,  Takezawa, Hiroaki ,  Ishimaru, Yukihiro ,  Kitae, Takashi ,  Suzuki, Yasuhiro

IPC: H05K3/32

CPC classification number: H05K3/321 ,  H05K2201/0129 ,  H05K2201/10992 ,  H05K2203/176 ,  H05K2203/306 ,  Y10T29/49172

Abstract: An electronic component mounted member includes a circuit board, an electronic component connected to the circuit board and an electrically conductive adhesive interposed between the electronic component and the circuit board. In a joining interface of the electrically conductive adhesive 4 and an electrode 2 of the circuit board, an intermediate layer 3 that is formed of a thermoplastic insulating adhesive with a softening temperature of 100°C to 300°C is interposed between the electrically conductive adhesive 4 and the electrode 2. An electrically conductive filler contained in the electrically conductive adhesive is present partially in the intermediate layer 3, thus allowing an electrical conduction between the electrically conductive adhesive 4 and the electrode 2 of the circuit board. This electronic component mounted member is used, and when a repair is necessary, a portion of the intermediate layer 3 corresponding to the electronic component to be repaired is heated so as to raise a temperature of this portion to at least a melting point of the thermoplastic insulating adhesive, thereby melting the thermoplastic insulating adhesive. Then, the electronic component 5 is removed with this state maintained.

Abstract translation: 安装构件的电子部件包括电路板，连接到所述电路板和在所述电子部件和所述电路板之间的导电粘合剂的电子部件。 在所述电路板的电极2的导电粘接剂4和一接合界面，中间层3上没有形成的热塑性绝缘粘合剂的具有100℃的软化温度到300℃的导电性粘接剂之间 4和电极2，一种包含在导电性粘接剂导电性填料的存在部分在中间层3，因此允许电导通的导电性粘接剂4与电路板的电极2之间。 这种电子部件安装构件被使用，并且当需要维修，要被修复对应于电子部件的中间层3的一部分被加热，以便该部分的温度提高到至少热塑性塑料的熔点 绝缘性粘接剂，从而熔化所述热塑性绝缘粘合剂。 然后，将电子部件5与保持该状态下除去。

公开(公告)号：EP1097478B9

公开(公告)日：2004-01-07

申请号：EP99947194.9

申请日：1999-07-06

Applicant: Infineon Technologies AG

Inventor： HACKE, Hans-Jürgen ,  GALUSCHKI, Klaus-Peter

IPC: H01L23/48 ,  H01L23/482 ,  H01L23/485 ,  H01L21/60 ,  H01L23/532 ,  H01L23/31

CPC classification number: H01L24/10 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/351 ,  H05K3/321 ,  H05K3/3436 ,  H05K2201/0212 ,  H05K2201/10234 ,  H05K2201/10992 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49798 ,  Y10T156/1089 ,  H01L2924/00

Abstract: The invention relates to a semiconductor component in a chip format, comprising a chip with at least one first insulating layer (3) and electric contact surfaces (2) devoid of said insulating layer. Conductors (5) run from the electric contact surfaces (2) to the foot areas (10) of external connection elements (12) along the insulating layer (3). Another insulating layer (8) is also provided with through openings (9) leading from the outside to the foot areas (10) of the external connection elements (12). A conductive adhesive (11) is placed in said openings (9) and metallic globules (12) are placed at least on the outside thereon. The semiconductor element can also contain a solder paste instead of the conductive adhesive in the through openings (9), whereby the metallized synthetic globules are placed thereon. The invention also relates to a method for producing the semiconductor element thus described.