摘要:
Provided is an adhesive composition containing the following components (A) and (B), wherein as a result of measuring a storage elastic modulus of a solid content, a storage elastic modulus at 23°C is 0.1 to 600 MPa, and a storage elastic modulus at 80°C is 0.1 MPa or lower: Component (A): modified polyolefin-based resin Component (B): polyfunctional epoxy compound. Also provided are: a sealing sheet having an adhesive layer formed using the adhesive composition, and a sealed body comprising a seal object that is sealed with the sealing sheet. An aspect of the present invention provides an adhesive composition which is easy to form into a sheet and excellent in unevenness followability, a sealing sheet having an adhesive layer which is formed of this adhesive composition and excellent in unevenness followability, and a sealed body having a seal object sealed with the sealing sheet.
摘要:
Provided are a novel polymer that has a high glass transition temperature, and is excellent in solubility in various organic solvents, heat resistance, and mechanical characteristics, and a composition, a molded body, a cured product, and a laminate each using the polymer. The polymer according to the present invention includes: a first structural unit represented by the formula (1); a second structural unit represented by at least one of the formulae (2-1) and (2-2); and a third structural unit represented by at least one of the formulae (3-1) and (3-2).
摘要:
To provide an antifouling coating composition capable of forming an antifouling coating film that exhibits an antifouling performance against fouling with microorganisms for a prolonged period of time even under an environment where the coating film is exposed to a dynamic water flow, and has good adhesiveness to the underlying material. To provide an antifouling coating film formed with the antifouling coating composition, a laminated antifouling coating film, a substrate with an antifouling coating film and a method for producing the same, and an antifouling method. The antifouling coating composition of the present invention contains: a curable organopolysiloxane (A); and a polymer (B) containing a constituent unit derived from at least one selected from the group consisting of an unsaturated monomer (b1) represented by the following formula (I), a tetrahydrofurfuryl (meth)acrylate (b2), a 4-(meth)acryloylmorpholine (b3), and a vinylpyrrolidone (b4), wherein in the formula (I), R 1 represents a hydrogen atom or a monovalent hydrocarbon group having 1 to 10 carbon atoms; R 2 represents an ethylene group or a propylene group; R 3 represents a divalent hydrocarbon group having 4 to 10 carbon atoms; R 4 represents a hydrogen atom or a monovalent hydrocarbon group having 1 to 30 carbon atoms; m represents an integer of 1 to 50; n represents an integer of 0 to 50; and X represents an ester bond, an amide bond, or a single bond.
摘要:
An electromagnetic shielding material 50 comprising a plurality of copper foil composites 10 connected together in a longitudinal direction L, the composite having a copper foil 2 and a resin film 4 which are laminated, wherein an overlapped part 50k of the copper foil composites is adhered with an epoxy based adhesive 6 comprising as main components an epoxy resin and one or more of flexibility providing resins selected from the group consisting of nitrile butadiene rubber, natural rubber, styrene butadiene rubber, butadiene rubber, ethylene propylene rubber, isoprene rubber, urethane rubber and acrylic rubber, and wherein the epoxy based adhesive disposed at the overlapped part of the copper foil composites has a length LA in the longitudinal direction of 1 to 6 mm.
摘要:
The present invention provides a resin composition including an epoxy resin monomer, a novolac resin containing a compound having a structural unit represented by the following general Formula (I), and a filler, in which a particle size distribution of the filler, measured using laser diffractometry, has peaks in the respective ranges of from 0.01 µm to less than 1 µm, from 1 µm to less than 10 µm, and from 10 µm to 100 µm, and the filler contains boron nitride particles having particle sizes of from 10 µm to 100 µm. In the general Formula (I), R 1 represents an alkyl group, an aryl group, or an aralkyl group. Each of R 2 and R 3 independently represents a hydrogen atom, an alkyl group, aryl group, or an aralkyl group. m represents a number from 0 to 2; and n represents a number from 1 to 7.
摘要:
The invention relates to methods of bonding and a conductively bonded joint, provided by high loadings of conductively coated nano scale particulate fillers in a conductive adhesive in combination with a conductive intermediary structure, more particularly to a lightning strike resilient bonded joint between fibre reinforced polymer composites. A method of joining a first fibre reinforced polymer composite surface and a second fibre reinforced polymer composite surface, comprising the steps of providing a conductive intermediary structure between said first and second surfaces, filling the void between said surfaces and enveloping said intermediary structure with a conductive adhesive, curing the conductive adhesive to form a bonded first and second surface. A conductive adhesive comprising a curable binder and a high aspect ratio nanoscale carbon particulate filler present in the range of from 0.1 to 40% wt, wherein said particulate filler comprises a metal coating.
摘要:
The present application discloses improved lignocellulosic composite materials comprising a lignocellulosic component, a bis-electrophile, and a polynucleophile. Exemplary embodiments comprise a dianhydride and a polyol.
摘要:
Provided are an epoxy resin composition including hexagonal boron nitride particles having an aspect ratio of 2 or more, a liquid crystalline epoxy monomer, and a curing agent, and the epoxy resin composition being capable of forming a resin matrix having a smectic domain by reacting the liquid crystalline epoxy monomer with the curing agent, and a thermally-conductive material precursor, a B-stage sheet, a prepreg, a heat dissipation material, a laminate, a metal substrate, and a printed circuit board, which use the epoxy resin composition.