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71.STRUCTURE AND METHOD FOR MOSFET GATE ELECTRODE LANDING PAD 审中-公开
Title translation: 结构及方法MOSFET栅极电极着陆区公开(公告)号:EP1994563A4
公开(公告)日:2011-06-22
申请号:EP07797080
申请日:2007-01-16
Applicant: IBM
Inventor: CLEVENGER LAWRENCE A , DALTON TIMOTHY J , HSU LOUIS C , RADENS CARL , WONG KWONG-HON , YANG CHIH-CHAO
IPC: H01L27/01 , H01L21/8234
CPC classification number: H01L27/1203 , H01L21/28114 , H01L21/823456 , H01L21/84 , H01L29/42376 , H01L2924/0002 , H01L2924/00
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72.EXHAUSTIVE DIAGNOSIS OF BRIDGING DEFECTS IN AN INTEGRATED CIRCUIT 审中-公开
Title translation: 桥接缺陷的集成电路中的综合诊断公开(公告)号:EP2035979A4
公开(公告)日:2011-04-13
申请号:EP07798506
申请日:2007-06-13
Applicant: IBM
Inventor: HEABERLIN DOUGLAS C
CPC classification number: G01R31/2853 , G01R31/3008
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73.VALIDATION FRAMEWORK FOR SERVICE ORIENTED ARCHITECTURE (SOA) APPLICATION ADOPTION 审中-公开
Title translation: 验证框架使用面向服务的架构中的应用(SOA)公开(公告)号:EP2255327A4
公开(公告)日:2011-03-02
申请号:EP08869804
申请日:2008-10-10
Applicant: IBM
Inventor: LEUNG HUMIE
CPC classification number: G06Q10/04
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74.METHOD FOR FORMING SUSPENDED TRANSMISSION LINE STRUCTURES IN BACK END OF LINE PROCESSING 审中-公开
Title translation: 方法悬空传输线结构在后卫线上END加工成型公开(公告)号:EP1756862A4
公开(公告)日:2011-03-02
申请号:EP05741890
申请日:2005-04-28
Applicant: IBM
Inventor: CHINTHAKINDI ANIL K , GROVES ROBERT A , TRETIAKOV YOURI V , VAED KUNAL , VOLANT RICHARD P
IPC: H01L23/522 , H01L21/4763 , H01L21/768 , H01L23/532 , H01P11/00
CPC classification number: H01P11/003 , H01L21/7682 , H01L21/76838 , H01L23/5222 , H01L23/5225 , H01L23/53238 , H01L2223/6622 , H01L2223/6627 , H01L2924/0002 , H01L2924/1903 , H01L2924/3011 , H01L2924/00
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75.
公开(公告)号:EP1665334A4
公开(公告)日:2011-02-23
申请号:EP04756338
申请日:2004-06-29
Applicant: IBM
Inventor: PARK HEEMYOUNG , AGNELLO PAUL D , GILBERT PERCY V , LEE BYOUNG H , O'NEIL PATRICIA A , SHAHIDI GHAVAM G , WELSER JEFFREY J
IPC: H01L21/8234 , H01L21/336 , H01L21/425 , H01L21/4763 , H01L21/84 , H01L27/12 , H01L29/423 , H01L29/45 , H01L29/49 , H01L29/786
CPC classification number: H01L29/66772 , H01L21/84 , H01L29/458 , H01L29/6653 , H01L29/6656 , H01L29/66628 , H01L29/78621
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76.METHOD OF FORMING STRAINED SILICON MATERIALS WITH IMPROVED THERMAL CONDUCTIVITY 审中-公开
Title translation: 方法来与改进的热传导劲性,教育的硅材料公开(公告)号:EP1790003A4
公开(公告)日:2011-01-12
申请号:EP05784302
申请日:2005-08-04
Applicant: IBM
Inventor: BEDELL STEPHEN W , CHEN HUAJIE , FOGEL KEITH , MITCHELL RYAN M , SADANA DEVENDRA K
IPC: H01L21/36 , H01L21/02 , H01L21/20 , H01L31/117
CPC classification number: H01L29/1054 , H01L21/02381 , H01L21/0245 , H01L21/02507 , H01L21/02532
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公开(公告)号:EP1692530A4
公开(公告)日:2011-01-05
申请号:EP03768917
申请日:2003-11-12
Applicant: IBM
Inventor: CLINE CHRISTOPHER W , YARMCHUK EDWARD J , ARENA VINCENT A , MERTE DONALD A , PICUNKO THOMAS , WOJSZYNSKI BRIAN J , HENDRICKS CHARLES J , SCAMA MICHAEL E , OLYHA JR ROBERT S , HALPERIN ARNOLD
IPC: G01R31/06 , G01R19/00 , G01R31/02 , G01R31/28 , G01R31/302 , G01R31/305 , G03G15/00
CPC classification number: G01R31/2805 , G01R19/0061 , G01R31/302
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公开(公告)号:EP1602113A4
公开(公告)日:2010-12-29
申请号:EP03781593
申请日:2003-10-28
Applicant: IBM
Inventor: VOLANT RICHARD P , FLORKEY JOHN E , GROVES ROBERT A
CPC classification number: H03K17/965 , H01F7/066 , H01F7/14 , H01F2007/068 , H01H59/0009
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79.METHOD AND APPARATUS FOR DYNAMIC SYSTEM-LEVEL FREQUENCY SCALING 审中-公开
Title translation: FOR动态频率的方法和装置扩大系统级公开(公告)号:EP1685507A4
公开(公告)日:2010-12-22
申请号:EP03768555
申请日:2003-10-31
Applicant: IBM
Inventor: HILGENDORF ROLF , LICHTENAU CEDRIC , PFLUEGER THOMAS , RECKTENWALD MARTIN , SANDON PETER A
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80.USAGE OF PERSISTENT INFORMATION UNIT PACING PROTOCOL IN FIBRE CHANNEL COMMUNICATIONS 有权
Title translation: 持久信息单元在光纤通道通信中的PACING协议的使用公开(公告)号:EP2220820A4
公开(公告)日:2010-11-17
申请号:EP08854460
申请日:2008-11-14
Applicant: IBM
Inventor: HATHORN ROGER GREGORY , HOLLEY BRET WAYNE , KALOS MATTHEW JOSEPH
CPC classification number: G06F13/387
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