公开(公告)号：EP2010452A2

公开(公告)日：2009-01-07

申请号：EP07735462.9

申请日：2007-04-11

Applicant: NXP B.V.

Inventor： WEEKAMP, Johannes, W. ,  SLOB, Cornelis ,  SCHEER, Jacob, M. ,  VAN STRATEN, Freerk, E.

IPC: B81C1/00

CPC classification number: B81C1/00833 ,  B81C1/00269 ,  B81C2203/035 ,  H05K3/341 ,  H05K2201/10371 ,  H05K2201/10477 ,  H05K2203/1147 ,  Y02P70/613 ,  Y10T29/49117

Abstract: The present invention relates to a method for manufacturing an electronic assembly (50) comprising an electronic component, a cavity and a substrate which method comprises; -providing an electronic component (10) having a first pattern with a substantially closed configuration; -providing a cover (18) on a surface of the electronic component, which cover together with said surface defines a cavity (20), the closed configuration of the first pattern substantially enclosing the cover at said surface; -providing a substrate (30) having a second pattern with a substantially closed configuration, which closed configuration at least partially corresponds to the closed configuration of the first pattern and comprises a solder pad; -disposing solder material at the solder pad; -positioning the electronic component and the substrate so as to align both the substantially closed configurations of the first and second pattern, while the substrate supports a top surface (28) of the cover; -reflow-soldering the solder material, therewith providing a soldered connection (52) between the first and second pattern. Furthermore the present invention relates to an electronic assembly (50), a cover (18) and a substrate (30).

公开(公告)号：EP1464211B8

公开(公告)日：2006-08-16

申请号：EP02790654.4

申请日：2002-12-06

Applicant: Marconi Communications GmbH

Inventor： SCHMITT, Reinhold ,  KONRATH, Willibald ,  SCHOLL, Klaus ,  MÜLLER, Ulf

IPC: H05K3/00 ,  H05K13/00 ,  H05K1/14

CPC classification number: H05K3/0061 ,  H01L25/50 ,  H01L2224/48227 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/3025 ,  H05K1/0237 ,  H05K1/0306 ,  H05K1/142 ,  H05K3/0097 ,  H05K3/303 ,  H05K2201/10371 ,  H05K2203/049 ,  H05K2203/1509 ,  Y10T29/49016 ,  Y10T29/49124 ,  Y10T29/49128

Abstract: In the assembly of an electronic circuit module having a baseplate (10) and circuit components (16, 19, 21) mounted on said baseplate in an automatic assembly line in which a boat is placed on a conveyor means and is conveyed between various assembly stations in order to place, fix and/or contact the circuit components (16, 19, 21) on the boat, the boat is used as the baseplate (10) of the circuit module. When the circuit module is finished, the boat thus becomes part of a device where the module is built in.

公开(公告)号：EP0932178B1

公开(公告)日：2005-06-22

申请号：EP99100446.6

申请日：1999-01-11

Applicant: Matsushita Electric Works, Ltd.

Inventor： Nakahata, Atsushi ,  Okumura, Shigeyuki ,  Taguchi, Tomohiro

IPC: H01H50/10 ,  H01P1/12

CPC classification number: H05K1/0243 ,  H01H50/10 ,  H01P1/127 ,  H05K3/3447 ,  H05K2201/10303 ,  H05K2201/10371 ,  H05K2201/10969 ,  H05K2203/1147 ,  Y10T307/852

公开(公告)号：EP1446000A1

公开(公告)日：2004-08-11

申请号：EP03388026.1

申请日：2003-04-25

Applicant: Sony Ericsson Mobile Communications AB

Inventor： Fagrenius, Gustav ,  Bengtsson, Henrik ,  Andersson, Niklas ,  Palmqvist, Frederik

IPC: H05K9/00

CPC classification number: H05K9/0032 ,  H05K3/341 ,  H05K2201/09018 ,  H05K2201/1028 ,  H05K2201/10371 ,  H05K2201/10916 ,  Y02P70/613

Abstract: A shield can (1) for shielding electronic components on a PWB (printed wired board) (9) in an electronic device. The shield can (1) comprises substantially vertical side walls (3) with a lower rim (4). Vertically adjustable sections (5) are provided at the rim (4) of the side walls (3) of the shield can (1) in order to compensate for any non-planarity of the PWB (9).

Abstract translation: 屏蔽罩可以（1）用于屏蔽电子设备中的PWB（印刷电路板）（9）上的电子部件。 屏蔽罩（1）包括具有下边缘（4）的基本上垂直的侧壁（3）。 在屏蔽罐（1）的侧壁（3）的边缘（4）处设置垂直可调部分（5），以便补偿PWB（9）的任何非平面性。

公开(公告)号：EP1419679A1

公开(公告)日：2004-05-19

申请号：EP02766025.7

申请日：2002-08-16

Applicant: Raytheon Company

Inventor： DEARDEN, Timothy E.,Raytheon Company ,  STITT, Jeffrey J.,Raytheon Company ,  QUAN, Clifton,Raytheon Company

IPC: H05K1/18 ,  H05K3/32 ,  H01L23/66

CPC classification number: H05K1/0243 ,  H01L23/66 ,  H01L2223/6622 ,  H01L2224/16 ,  H01L2924/01079 ,  H01L2924/15312 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K3/305 ,  H05K3/306 ,  H05K3/325 ,  H05K2201/09472 ,  H05K2201/09809 ,  H05K2201/10348 ,  H05K2201/10371 ,  H05K2201/10575 ,  H05K2201/10689 ,  H05K2203/1147

Abstract: An RF interconnect is incorporated in RF module packages (50) for direct attachment onto a multi-layer PWB (100) using compressible center conductor (fuzz button) interconnects. The module has circuitry operating at microwave frequencies. The module package includes a metal housing (52) including a metal bottom wall structure (54). The module includes a plurality of RF interconnects, which provide RF interconnection between the package (50) and the PWB (100). Each interconnect includes a feedthrough center pin (72) protruding through an opening formed in the metal bottom wall, with isolation provided by a dielectric feedthrough insulator (74). The center pin is surrounded with a ring of shield pins (76) attached to the external surface of the bottom wall of the module housing. The pins are insertable in holes (116a, 116b) formed in the PWB (100), and make contact with fuzz button interconnects (130, 132) disposed in the holes (116a, 116b). Circuitry (148, 150) connects the fuzz button interconnects (130, 132) to appropriate levels (120, 122, 124) of the PWB signal conduction.

公开(公告)号：EP1411756A2

公开(公告)日：2004-04-21

申请号：EP03023519.6

申请日：2003-10-15

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Nakatsuji, Koji ,  Yamada, Hiroyuki ,  Asano, Hiromasa ,  Suzuki, Masanori ,  Terao, Atsuhito

IPC: H05K9/00

CPC classification number: H05K9/0037 ,  H05K1/0218 ,  H05K1/18 ,  H05K9/0039 ,  H05K2201/1003 ,  H05K2201/10371

Abstract: A radio frequency apparatus comprising a printed circuit board 20 mounting an electronic component 21 including a coil 23 as an inductance element, a metal frame body 26 covering this printed circuit board 20 and connected to the ground, a lid 27 formed integrally with the frame body 26 , covering the inductance element 23 mounting side of the frame body 26, and a leg 28 formed by cutting and bending from the lid 27 , having a width nearly same as the width of the coil 23 , in which the leg 28 is disposed closely to the coil 23.

Abstract translation: 电感线圈安装的印刷电路板（20）用一体式盖（27）和框架（26）封闭。 从盖弯曲的框架腿（28）布置得更靠近电感线圈。

公开(公告)号：EP1168898A2

公开(公告)日：2002-01-02

申请号：EP01115955.5

申请日：2001-06-29

Applicant: TDK Corporation

Inventor： Seawright, Stephen ,  Nakai, Shinya

IPC: H05K1/18

CPC classification number: H03F3/602 ,  H01L27/0207 ,  H03B5/1847 ,  H03F1/22 ,  H03F1/565 ,  H03F3/60 ,  H03F2200/372 ,  H05K1/0237 ,  H05K1/0298 ,  H05K1/141 ,  H05K1/181 ,  H05K2201/10166 ,  H05K2201/10371 ,  Y02P70/611

Abstract: To provide a mobile communications device power amplifier module, mobile communications device terminal equipment and mobile communications device base station structured in such a manner that the mounting area of mounted parts on a mother substrate can be reduced. By the elements mounted on the multilayer substrate 56 or housed in it, the transmission voltage controlled oscillator 2B and the power amplifier 17 are structured and integrated on the same substrate.

Abstract translation: 提供一种移动通信设备的功率放大器模块，移动通信设备的终端设备和移动通信设备的基站中的方式构造寻求DASS管芯安装在母基板安装部件的面积可以减小。 通过安装在多层衬底56或在它容纳在元件中，发送压控振荡器2B和功率放大器17的结构和集成在同一基底上。

公开(公告)号：EP0932178A3

公开(公告)日：2000-04-05

申请号：EP99100446.6

申请日：1999-01-11

Applicant: Matsushita Electric Works, Ltd.

Inventor： Nakahata, Atsushi ,  Okumura, Shigeyuki ,  Taguchi, Tomohiro

IPC: H01H50/10 ,  H01P1/12

CPC classification number: H05K1/0243 ,  H01H50/10 ,  H01P1/127 ,  H05K3/3447 ,  H05K2201/10303 ,  H05K2201/10371 ,  H05K2201/10969 ,  H05K2203/1147 ,  Y10T307/852

Abstract: A miniaturized high frequency switching device is capable of giving an optimum over-all impedance over the length of a signal path while compensating for inevitable impedance variation seen in a particular segment of the signal path. The switching device includes a contact block having fixed contacts and a movable contact. The fixed contacts and the movable contact are surrounded by an electromagnetic shield which is supported on a conductor base to be grounded therethrough for isolating the current path from a surrounding electromagnetic field. The fixed contacts are formed respectively on one ends of terminal pins provided for electrical connection to an external load circuit operating on high frequency signals. The terminal pin extends through an insulation ring fitted in the conductor base so as to be electrically insulated therefrom and form the signal path flowing a high frequency current. An impedance compensating structure is provided in the contact block for differentiating a first impedance at a first segment of a limited length along the terminal pin from a second impedance inherent to a second segment immediately adjacent the first segment so as to give a target over-all impedance, which is between the first and second impedance, over the full length of the terminal pin.

公开(公告)号：EP0933816A2

公开(公告)日：1999-08-04

申请号：EP99101533.0

申请日：1999-01-29

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Suzuki, Kazutaka ,  Narita, Naoto ,  Watanabe, Tohru ,  Kamiyama, Yoshiaki ,  Yagi, Kazuki

IPC: H01L25/07 ,  H01L23/34

CPC classification number: H05K1/141 ,  H01L23/36 ,  H01L23/49805 ,  H01L25/165 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/16152 ,  H01L2924/19106 ,  H01L2924/3025 ,  H05K1/0203 ,  H05K1/183 ,  H05K3/3442 ,  H05K3/368 ,  H05K2201/066 ,  H05K2201/10371 ,  H05K2201/10477 ,  H05K2201/10674

Abstract: In a hybrid module (10) which is mounted on a mother circuit board with a first surface (18) of a substrate (11) opposed to said mother circuit board, a cavity (19) is formed on said first surface (18), and a heat-generating circuit component (13) is facedown-bonded in said cavity (19). Heat generated in the circuit component (13) is radiated to the mother circuit board through a heat radiation plate (14).

Abstract translation: 在与母电路板上安装有与所述母电路板相对的基板（11）的第一表面（18）的混合模块（10）中，在所述第一表面（18）上形成空腔（19） 并且将发热电路部件（13）面对着接合在所述空腔（19）中。 在电路部件（13）中产生的热量通过散热板（14）辐射到母电路板。

公开(公告)号：EP0806892B1

公开(公告)日：1999-06-09

申请号：EP97302949.9

申请日：1997-04-30

Applicant: W.L. GORE & ASSOCIATES, INC.

Inventor： King, David Robert ,  Rowan, Joseph C. ,  Johnson, Daniel D. ,  Reis, Bradley E.

IPC: H05K9/00

CPC classification number: H05K9/0026 ,  H01L23/552 ,  H01L2924/0002 ,  H01L2924/16152 ,  H05K3/323 ,  H05K2201/10371 ,  H01L2924/00