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    Printed circuit board for telecommunication modules
    82.
    发明公开
    Printed circuit board for telecommunication modules 审中-公开
    电信模块

    公开(公告)号：EP2410825A1

    公开(公告)日：2012-01-25

    申请号：EP10007538.1

    申请日：2010-07-21

    Applicant: 3M Innovative Properties Company

    Inventor： Szymanki, Guenter ,  Edelmann, Wolfgang ,  Hajok, Johann ,  Bund, Christine

    IPC: H05K1/11

    CPC classification number: H05K1/117 ,  H01R12/721 ,  H05K2201/09145 ,  H05K2201/09172 ,  H05K2201/10863

    Abstract: A board, for example a printed circuit board 10 for insertion into a telecommunication module in an insertion direction 100, the printed circuit board 10 comprising a substrate 20, having two major surfaces 92, 94, first and second conductive paths 30, arranged on a major surface of the substrate 20, for electrically contacting first and second resilient contact elements of a linearly-arranged row of resilient contact elements of the telecommunication module, wherein the first and second conductive paths 30 are arranged such that a contacting end 35 of each of the conductive paths 30 is located on a straight reference line 110 which is substantially perpendicular to the insertion direction 100, so that electrical connections between respective resilient contact elements and the respective conductive paths 30 are established at one single insertion depth. The substrate 20 is shaped such that mechanical engagement between parts 25 of the substrate 20 which are to engage mechanically with the first and second resilient contact elements, respectively, and respective resilient contact elements is completed at different insertion depths of the board into the telecommunication module.

    Abstract translation: 板，例如用于沿插入方向100插入电信模块的印刷电路板10，印刷电路板10包括基板20，基板20具有两个主表面92,94，第一和第二导电路径30，布置在基板20上 基板20的主表面，用于电接触电信模块的线性排列的弹性接触元件列的第一和第二弹性接触元件，其中第一和第二导电路径30被布置成使得每个的接触端35 导电路径30位于基本上垂直于插入方向100的直线参考线110上，使得相应的弹性接触元件和相应导电路径30之间的电连接在一个单个插入深度处建立。 基板20成形为使得基板20的分别与第一和第二弹性接触元件机械地接合的部件25与相应的弹性接触元件之间的机械接合在板的不同插入深度处完成到电信模块 。

    Low profile surface-mounted connector integrated into a PCB slot.
    88.
    发明公开
    Low profile surface-mounted connector integrated into a PCB slot. 有权
    Flachfer SMD Steckverbinder montiert在eine Leiterplattenaufnahme。

    公开(公告)号：EP2259382A1

    公开(公告)日：2010-12-08

    申请号：EP10174522.2

    申请日：2006-11-27

    Applicant: Nintendo Co., Ltd.

    Inventor： Sakiyama, Tomoyuki ,  Kuwahara, Masato ,  Nakai, Hitoshi

    IPC: H01R12/16

    CPC classification number: H05K1/117 ,  H01R12/7052 ,  H01R12/7076 ,  H01R12/721 ,  H05K2201/09145

    Abstract: A connector (21) surface-mounted on a substrate (22), wherein the substrate includes a first recessed portion (43) shaped so as to be open toward an outer periphery of the substrate, and a conductive pattern on an edge portion of the first recessed portion; the connector includes a body (31), and terminals (33) protruding from the body; the connector is mounted such that the body is disposed in the first recessed portion and a bottom of the terminals is positioned higher than a bottom (39) of the body and the bottom surface of the substrate is flush with the bottom surface of the connector; the first recessed portion includes second recessed portions (46); the connector includes projections (36) corresponding to the second recessed portions when the connector is mounted on the substrate so as to prevent the connector from moving sideways.

    Abstract translation: 1.一种表面安装在基板（22）上的连接器（21），其中，所述基板包括形成为朝向所述基板的外周开口的第一凹部（43），所述第一凹部 第一凹部 连接器包括主体（31）和从主体突出的端子（33）; 连接器被安装成使得主体设置在第一凹部中，并且端子的底部被定位成高于主体的底部（39），并且基板的底表面与连接器的底表面齐平; 第一凹部包括第二凹部（46）; 当连接器安装在基板上时，连接器包括对应于第二凹部的突起（36），以防止连接器侧向移动。

    PROCESS FOR PRODUCING MULTILAYER CERAMIC SUBSTRATE
    89.
    发明公开
    PROCESS FOR PRODUCING MULTILAYER CERAMIC SUBSTRATE 有权
    VERFAHREN ZUR HERSTELLUNG EINES MEHRSCHICHTIGEN KERAMIKSUBSTRATS

    公开(公告)号：EP1954111A1

    公开(公告)日：2008-08-06

    申请号：EP06821809.8

    申请日：2006-10-03

    Applicant: MURATA MANUFACTURING CO., LTD.

    Inventor： MURATA, Takaki ,  SUGIMOTO, Yasutaka

    IPC: H05K3/46

    CPC classification number: H05K3/0052 ,  H01L21/4807 ,  H01L23/13 ,  H01L23/49822 ,  H01L2924/09701 ,  H01L2924/15787 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09045 ,  H05K2201/0909 ,  H05K2201/09145 ,  H05K2203/308 ,  Y10T428/24917 ,  Y10T428/24926

    Abstract: To provide a method for manufacturing a multilayer ceramic board that can prevent a wiring conductor formed on the face of a multilayer ceramic board fabricated with non-contraction process from being damaged.
    On at least one principal face of a layered body, made up of a plurality of board ceramic green sheets 11 including ceramic material powder, contraction prevention green sheets 21 and 25 including inorganic material powder which is not sintered at the baking temperature of the board ceramic green sheet 11 are disposed such that along at least a part of the outer circumference of the principal face the part and the nearby portion thereof are exposed to form a compound layered body, the compound layered body is baked under a condition in which the ceramic material powder is sintered, and the inorganic material powder is not sintered, following which the contraction prevention green sheets 21 and 25 are removed. With a multilayer ceramic board 10t, protruding portions 12x and 12y are formed along at least a part of the outer circumference of a principal face 11t.

    Abstract translation: 提供一种可以防止形成在由非收缩工艺制造的多层陶瓷板的表面上形成的布线导体损坏的多层陶瓷板的制造方法。 在由包含陶瓷材料粉末的多个板状陶瓷生片11构成的层叠体的至少一个主面上，包含在基板陶瓷的烘烤温度下未烧结的无机材料粉末的收缩防止生片21,25 生片11被设置为使得沿着主面的外周的至少一部分暴露其部分和附近部分以形成复合层状体，在陶瓷材料的条件下烘烤该复合层叠体 粉末烧结，无机材料粉末不烧结，除去收缩防止生片21和25。 利用多层陶瓷板10t，沿着主面11t的外周的至少一部分形成突出部12x，12y。

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