公开(公告)号：EP1636845A4

公开(公告)日：2007-08-29

申请号：EP04776276

申请日：2004-06-04

申请人： SEMITOOL INC

发明人： HANSON KYLE ,  DOLECHEK KERT L ,  MCHUGH PAUL R ,  WILSON GREGORY J ,  DAVIS JEFFRY ALAN ,  HARRIS RANDY

IPC分类号： H01L25/00 ,  B65G49/07 ,  C12N15/31 ,  C25D5/08 ,  C25D7/12 ,  C25D17/00 ,  C25D17/06 ,  F26B5/04 ,  H01L20060101

CPC分类号： C25D17/00 ,  C25D5/08 ,  C25D7/12 ,  C25D17/001 ,  C25D17/004 ,  C25D17/008 ,  C25D17/06 ,  H01L21/6704 ,  H01L21/67173 ,  H01L21/67196

摘要： A wet chemical processing chamber comprising a fixed unit, a detachable unit releasably coupled to the fixed unit, a seal contacting the fixed unit and the detachable unit, and a processing component disposed in the fixed unit and/or the detachable unit. The fixed unit can have a first flow system configured to direct a processing fluid through the fixed unit and a mounting fixture for fixedly attaching the fixed unit to a platform or deck of an integrated processing tool. The detachable unit can include a second flow system configured to direct the processing fluid to and/or from the first flow system of the fixed unit. The seal has an orifice through which processing fluid can flow between the first and second flow systems, and the processing component can impart a property to the processing fluid for processing a surface on a microfeature workpiece having submicron microfeatures.

公开(公告)号：EP1159214A4

公开(公告)日：2007-06-27

申请号：EP99966152

申请日：1999-12-13

申请人： ASYST TECHNOLOGIES

发明人： BONORA ANTHONY C ,  GOULD RICHARD H

IPC分类号： B65G47/46 ,  B65G1/00 ,  B65G47/90 ,  B65G49/07 ,  H01L21/677 ,  B65G37/00

CPC分类号： H01L21/67775 ,  H01L21/67706 ,  H01L21/67727 ,  H01L21/6773 ,  H01L21/67733 ,  H01L21/67736 ,  H01L21/67763 ,  H01L21/67766 ,  H01L21/67769

摘要： A transfer system (10) for moving one or more articles (12) between a conveyor (14) and a station (16). The system (10) includes a transfer assembly (10) having a lifting mechanism (62) configured to engage the article (12) as it is carried by the conveyor (14), lift the article (12) to a raised position above the support (60) and lower the article (12) from the raised position to the conveyor (14). The assembly (10) also includes a displacement device (114) configured to move the article (12) from the raised position to a station (16), position the article (12) at the station (16), and return the article (12) from the station (16) to the raised position above the conveyor (14). The system (10) also includes the method of transferring an article (12) between a conveyor (14) having a pair of spaced rails (116) and a station (16) positioned to one side of the conveyor (14). The method includes engaging the underside of the article (12) between the rails (116) and lifting the article (12) to a raised position and moving the article (12) in a direction perpendicular to the conveyor (14) between the raised position and a position vicinal the station (16).

公开(公告)号：EP1638732A4

公开(公告)日：2007-06-06

申请号：EP04754300

申请日：2004-06-03

申请人： SEMITOOL INC

发明人： MCHUGH PAUL R ,  WILSON GREGORY J ,  WOODRUFF DANIEL J ,  ZIMMERMAN NOLAN ,  ERICKSON JAMES J

IPC分类号： B24B1/00 ,  B24B20060101 ,  B65G49/07 ,  C12N15/31 ,  C25D7/12 ,  C25D17/00 ,  H01L21/00

CPC分类号： C25D7/12 ,  C25D5/08 ,  C25D17/00 ,  C25D17/001 ,  C25D17/007 ,  C25D17/008 ,  C25D21/10 ,  H01L21/6719

摘要： Tools having mounting modules with registration systems are disclosed. The mounting includes positioning elements for precisely locating a reactor and a workpiece transport that moves workpieces to and for the reactor. The relative positions between positioning elements of the reactor are fixed so that the workpiece transport does not need to be recalibrated when the reactor is removed and replaced with another reactor. The reactor includes an agitator for agitating processing fluid at a process surface of the workpiece. The agitator, the reactor, and electrodes within the reactor are configured to reduce the likelihood for electrical shadowing created by the agitator at the surface of the workpiece, and to account for three-dimensional effects on the electrical field as the agitator and/or the workpiece reciprocate relative to each other.

公开(公告)号：EP1701378A3

公开(公告)日：2006-11-08

申请号：EP06251194.4

申请日：2006-03-07

申请人： KAWASAKI JUKOGYO KABUSHIKI KAISHA

发明人： Hashimoto, Yasuhiko

IPC分类号： H01L21/677 ,  B65G49/07

CPC分类号： H01L21/67778 ,  H01L21/67775 ,  Y10S414/137

摘要： An assembly method of assembling a substrate transfer device including: a transfer system unit forming step of fixing a robot and a substrate container retainer to a divided body which composes a part of the substrate transfer device and is formed separably on a main structural body as a residual part of the substrate transfer device, thereby forming a transfer system unit; an operation examination step of examining whether the robot fixed to the transfer system unit can operate as a part of the substrate transfer device or not; and a mounting step of mounting the transfer system unit on the main structural body of the substrate transfer device after the operation examination step.

公开(公告)号：EP1701378A2

公开(公告)日：2006-09-13

申请号：EP06251194.4

申请日：2006-03-07

申请人： KAWASAKI JUKOGYO KABUSHIKI KAISHA

发明人： Hashimoto, Yasuhiko

IPC分类号： H01L21/677 ,  B65G49/07

CPC分类号： H01L21/67778 ,  H01L21/67775 ,  Y10S414/137

摘要： An assembly method of assembling a substrate transfer device including: a transfer system unit forming step of fixing a robot and a substrate container retainer to a divided body which composes a part of the substrate transfer device and is formed separably on a main structural body as a residual part of the substrate transfer device, thereby forming a transfer system unit; an operation examination step of examining whether the robot fixed to the transfer system unit can operate as a part of the substrate transfer device or not; and a mounting step of mounting the transfer system unit on the main structural body of the substrate transfer device after the operation examination step.

摘要翻译： 一种组装基板输送装置的组装方法，包括：传送系统单元形成步骤，将机器人和基板容器保持器固定到构成基板传送装置的一部分的分割体上，并且可分离地形成在主结构体上，作为 残留部分的基板转印装置，由此形成转印系统单元; 检查固定到转印系统单元的机器人是否可以作为基板转印装置的一部分进行操作的操作检查步骤; 以及在操作检查步骤之后将传送系统单元安装在基板传送装置的主结构体上的安装步骤。

公开(公告)号：EP1540459A4

公开(公告)日：2006-03-01

申请号：EP03788279

申请日：2003-07-29

申请人： BROOKS AUTOMATION INC

发明人： BLATTNER JAKOB ,  FEDERICI RUDY ,  FOSNIGHT WILLIAM JOHN ,  HARIS CLINT

IPC分类号： G03F7/20 ,  B65G1/00 ,  B65G49/07 ,  G06F7/00 ,  H01L20060101

CPC分类号： G03F7/70925 ,  G03F7/70741 ,  H01L21/67359 ,  H01L21/67742 ,  H01L21/67769 ,  H01L21/68707 ,  Y10S414/139

摘要： A reticle manipulating device with an at least substantially closed housing for maintaining clean-room conditions inside the housing, an input/output station for introducing and discharging reticles in and out of the housing, and at least one functional unit arranged in the housing for impressing a predetermined function on the reticles. The device has a manipulating device also arranged inside the housing, for manipulating the reticles in the housing.

摘要翻译： 一种具有至少基本上闭合的壳体（2）的光罩操纵装置（1），用于保持壳体内的洁净室条件，输入/输出站（7），用于将光罩导入和导出壳体，以及至少 一个功能单元（71）布置在壳体中，用于在掩模版上施加预定的功能。 该装置具有也布置在壳体内的操纵装置（18），用于操纵壳体中的掩模版。

公开(公告)号：EP1624484A1

公开(公告)日：2006-02-08

申请号：EP03723344.2

申请日：2003-05-13

申请人： Mimasu Semiconductor Industry Company Limited

发明人： TSUCHIYA, Masato Mimasu Semiconductor Ind. Co.,Ltd ,  MASHIMO, Ikuo Mimasu Semiconductor Ind. Co., Ltd. ,  SAITO, Koichi Mimasu Semiconductor In. Co., Ltd.

IPC分类号： H01L21/68 ,  B65G49/06 ,  B65G49/07 ,  B65H3/08 ,  B65H3/48 ,  B65G59/04

CPC分类号： B65H3/0816 ,  B65H3/48 ,  H01L21/67092 ,  H01L21/6838

摘要： It is an object of the present invention to provide a wafer release method capable of releasing a wafer safely, simply and certainly and improving a wafer releasing rate, a wafer release apparatus and a wafer release transfer machine using the wafer release apparatus. A wafer release method of the present invention comprises the steps of: pressing the uppermost wafer along an axis direction (L-L') shifted by an angle in the range of from 15 to 75 degrees from a crystal habit line axis (A-A') or (B-B') of the uppermost wafer clockwise or counterclockwise; bending upwardly the peripheral portion of the uppermost wafer so as to cause a bending stress in the uppermost wafer in the axis direction (L-L') shifted by the angle; blowing a fluid into a clearance between the lower surface of the uppermost wafer and the upper surface of the lower wafer adjacent thereto; and raising the uppermost wafer for releasing.

摘要翻译： 本发明的一个目的是提供一种晶片释放方法，其能够简单且可靠地安全，简单且可靠地释放晶片并提高晶片释放速率，晶片释放装置和使用晶片释放装置的晶片释放传送机器。 本发明的晶片释放方法包括以下步骤：沿着从晶体习性线轴（A-A）偏移15度至75度范围内的角度的轴线方向（L-L'）按压最上面的晶片 '）或（B-B'）顺时针或逆时针旋转; 向上弯曲最上面的晶片的周边部分，以便使轴向上的最上面的晶片中的弯曲应力（L-L'）偏移该角度; 将流体吹入最上晶片的下表面和与其相邻的下晶片的上表面之间的间隙中; 并提升最上面的晶片以释放。

公开(公告)号：EP1569271A1

公开(公告)日：2005-08-31

申请号：EP03812264.4

申请日：2003-02-27

申请人： Kondoh Industries Ltd. ,  Cambridge Filter Japan, Ltd.

发明人： KISAKIBARU, Toshirou, Cambridge Filter Japan, Ltd. ,  KOUCHIYAMA, Shigeru, Cambridge Filter Japan, Ltd. ,  OKADA, Makoto, Cambridge Filter Japan, Ltd. ,  UENO, Kouta, Cambridge Filter Japan, Ltd.

IPC分类号： H01L21/68 ,  H01L21/02 ,  B65G49/07

CPC分类号： H01L21/67017 ,  H01L21/67772

摘要： In a semiconductor-fabrication equipment of a minienvironment system, ambient air is prevented from entering a gap between an opening of the semiconductor-fabrication equipment and a wafer gateway of a hermetic container to prevent dust entrained in the ambient air from adhering to wafers in the hermetic container. Clean air is injected from a clean-air injection device (1), which is connected to an air-supply device (2) through an air-supply tube (3), and which is provided with filter means (6a) in the from of rectangular frame formed with cylindrically-shaped filters connected to each other, to form an air curtain at the gap (96) between the gateway (74) of the hermetic container (71) through which wafers (73) are taken out of or put in the hermetic container (71) and the opening (98) of a loading part (78) attached to a front panel (77) of the semiconductor-fabrication equipment (76), thereby shutting off the ambient air that would otherwise enter the hermetic container (71) through the gap (96) between the gateway (74) of the hermetic container (71) and the opening (98) of the loading part (78) attached to the semiconductor-fabrication equipment (76) when a lid (75) of the hermetic container (71) is opened into the semiconductor-fabrication equipment (76).

摘要翻译： 在微环境系统的半导体制造设备中，防止环境空气进入半导体制造设备的开口和密封容器的晶片网关之间的间隙，以防止夹带在周围空气中的灰尘粘附到 密封容器。 清洁空气从清洁空气注入装置（1）注入，该清洁空气注入装置（1）通过供气管（3）连接到供气装置（2），并在其中设置有过滤装置（6a） 形成有彼此连接的圆柱形过滤器的矩形框架，以在密封容器（71）的网关（74）之间的间隙（96）处形成空气幕，通过该空隙将晶片（73）从其中取出或放置 在密封容器（71）和安装在半导体制造设备（76）的前面板（77）上的装载部分（78）的开口（98）中，从而切断否则将进入密封的环境空气 容器（71）通过密封容器（71）的网关（74）与附接到半导体制造设备（76）的装载部件（78）的开口（98）之间的间隙（96） 密封容器（71）的开口部（75）打开到半导体制造装置（76）。

公开(公告)号：EP1345828A4

公开(公告)日：2005-08-17

申请号：EP01998498

申请日：2001-11-16

申请人： ASYST TECHNOLOGIES

发明人： ROSENQUIST FREDERICK T

IPC分类号： H01L21/677 ,  B65G49/07 ,  H01L21/68

CPC分类号： H01L21/67775 ,  Y10S414/139

摘要： A front opening interface mechanical standard, or "FIMS", system is disclosed for ensuring proper registration of a pod door (22) against a port door (26) on a load port assembly without the use of guide pins on the port door (26). In a preferred embodiment, the load port assembly includes kinematic pins (27A, 27B) provided to mate within slots on the bottom of a FOUP to provide a fixed and repeatable position of the FOUP on the load port assembly. The load port assembly further includes a pair of latch keys (22) protruding outwardly from the outer surface of the port door (26) for mating within slots (33) of a door latch assembly within the pod door. The load port assembly may further include vacuum seals on the port door (26). In one embodiment, with the above constraints, the load port assembly may initially include removable alignment pins (40). The alignment pins (40) operate in conjunction with a calibration fixture to set the respective and collective heights of the kinematic pins (27A, 27B) on the load port assembly.

摘要翻译： 公开了一种前开口接口机械标准或“FIMS”系统，用于确保在不使用端口门上的引导销的情况下，将荚门正确对准装载端口组件上的端口门。 在优选实施例中，装载端口组件包括设置成配合在FOUP底部的槽内的运动销，以在装载口组件上提供FOUP的固定且可重复的位置。 装载端口组件还包括从端口门的外表面向外突出的一对闩锁键，用于在荚门内的门闩组件的槽内配合。 负载端口组件还可包括端口门或磁性组件上的真空密封件，以进一步便于端口门上的荚门的支撑。 在一个实施例中，通过上述约束，装载端口组件可以初始地包括可移除的对准销。 校准销与校准夹具一起工作，以设置负载端口组件上的运动销的相应和集中高度。 一旦调整了运动销，使得垂直板平行于端口门，并且垂直板中的开口在可移除的对准销钉上清洁地配合，则校准夹具可以被移除，并且对准销可以从或从后退到 港口门。 此后，可以将FOUP放置在舱前进板上并前进到门口。

公开(公告)号：EP1357589A4

公开(公告)日：2005-04-20

申请号：EP01272357

申请日：2001-12-27

申请人： TOKYO ELECTRON LTD

发明人： AKIYAMA SHUJI ,  IIJIMA TOSHIHIKO ,  HOSAKA HIROKI

IPC分类号： G05B19/00 ,  G05B19/418 ,  H01L21/00 ,  H01L21/68 ,  B65G49/07 ,  H01L21/02

CPC分类号： H01L21/6835 ,  G05B19/00 ,  G05B19/41815 ,  G05B2219/31002 ,  G05B2219/45031 ,  H01L21/67276 ,  Y02P90/08 ,  Y02P90/285 ,  Y02P90/60

摘要： A wafer (W) transfer system (E) comprises a host computer (1) for managing the production of semiconductor devices, probers (2) for checking electrical characteristics of the wafer (W) under control by this host computer (1), an AGV (3) for automatically transferring wafers (W) in a carrier to deliver the wafers (W) one by one to these probers (2) in response to the request of each of the probers (2), and an AGV controller (4) for controlling this AGV (3) under control by the host computer.

摘要翻译： 用于晶片W的输送系统E包括用于执行半导体器件的生产管理的主计算机1，用于在主计算机1的管理下检查晶片W的电特性的多个探测器2，AGV 3 用于在载体的块中自动输送晶片W，以便根据各自的要求将晶片W一个一个地传送到这些探测器2;以及AGV控制器4，用于在主计算机1的管理下控制AGV 3的操作 。