Abstract:
A fill system (1200) and methodology for the manufacture of fluid storage and dispensing vessels (1202) containing sorbent material for holding a sorbable fluid, for on-demand dispensing of the fluid in the use of the vessel. The fill system (1200) and methodology are directed to minimizing the processing time required to dissipate the heat of sorption incident to the loading of the sorbable fluid onto the sorbent material, so that thermal equilibration time in the manufacture of the vessels (1202) is substantially reduced in relation to the use of only ambient convective air cooling for dissipation of the heat of sorption from the fluid-filled vessel (1202).
Abstract:
Carbonaceous materials are described, having utility for fluid storage/dispensing. The carbonaceous material in one implementation is a nanoporous carbon composite having porosity that is at least partially filled with material imparting to the composite an enhanced character. Another implementation utilizes porous carbon material as a storage medium for chlorine gas. A further implementation utilizes porous carbon material as a hydrogen storage mediu e g, for hydrogen fuel cells. In another implementation, porous carbon material is employed as a sorbent medium in a fluid storage and dispensing system, in an arrangement of multiple porous carbon articles, and positional stabilization structure is employed to restrain the arrangement against movement. An arrangement in which carbon adsorbent is desorbed of residual fluid by resistive and/or inductive heating of the adsorbent is described.
Abstract:
An apparatus for storage and dispensing of a gas, comprising a gas storage and dispensing vessel holding a physical sorbent medium and gas adsorbed on the physical sorbent medium, wherein a carrier gas, e.g., helium, hydrogen, argon, etc., is flowed through the vessel to effect desorption of the sorbate gas and entrainment of the desorbed gas in the carrier gas stream. The storage and dispensing system of the invention may be employed to provide the dispensed sorbate gas to a downstream locus of use in applications such as epitaxial film formation and ion implantation, in the manufacture of semiconductor devices.
Abstract:
A fluid storage and dispensing system (200) includes a storage and dispensing vessel (204) containing a solid-phase physical sorbent material (206) for holding a sorbable fluid, and a motive transport assembly associated with the storage and dispensing vessel. The storage and dispensing vessel is arranged for selectively flowing fluid into the vessel for storage, and out of the vessel for dispensing. The sorbable fluid physically adsorbed on the solid-phase physical sorbent medium may be selectively desorbed by pressure differential desorption and/or thermal desorption, to dispense gas when the vessel is in motive transport and/or when the vessel is at rest.
Abstract:
A sorbent-based gas storage and dispensing system includes a storage and dispensing vessel (10) containing a solid-phase physical sorbent medium (17) having a sorbate gas physically adsorbed thereon. A chemisorbent material (138) is provided in the vessel (10) to chemisorb impurities for gas phase removal thereof. Desorbed sorbate gas is discharged from the vessel (10) by a dispensing manifold (12) coupled thereto. The chemisorbent material (138) may be provided in a capsule including an impurity-permeable, but sorbate gas-impermeable membrane (136), and installed in the vessel (10) at the time of the loading of the sorbent medium (17). Semiconductor manufacturing processes and products manufactured by such processes are also described.
Abstract:
A gas supply system including a gas cabinet (402) defining an enclosure including therein a gas dispensing manifold (426) and one or more adsorbent-based gas storage and dispensing vessels (433),(460),(462) mounted in the enclosure and joined in gas flow communication with the gas dispensing manifold (426). The enclosure may be maintained under low or negative pressure conditions for enhanced safety in the event of leakage of gas from the gas storage and dispensing vessels (433),(460),(462) in the enclosure. The gas supply system may be coupled to a gas-consuming unit in a semiconductor manufacturing facility, e.g., an ion implanter, an etch chamber, or a chemical vapor deposition reactor.