MIKROHEIZPLATTENVORRICHTUNG UND SENSOR MIT EINER MIKROHEIZPLATTENVORRICHTUNG
    3.
    发明公开
    MIKROHEIZPLATTENVORRICHTUNG UND SENSOR MIT EINER MIKROHEIZPLATTENVORRICHTUNG 审中-公开
    MIKROHEIZPLATTENVORRICHTUNG UND传感器MIT EINER MIKROHEIZPLATTENVORRICHTUNG

    公开(公告)号:EP3047262A1

    公开(公告)日:2016-07-27

    申请号:EP14741323.1

    申请日:2014-07-21

    申请人: Robert Bosch GmbH

    IPC分类号: G01N27/12

    摘要: The invention relates to a micro heating plate device having a membrane support unit (10), a membrane (12), which at least partially spans at least one cavity (14) formed in the membrane support unit (10), and having at least one heating line (16) arranged on and/or in the membrane (12). In addition, the micro heating plate device comprises at least one reflector element (18) arranged on the inner side (12a) of the membrane (12) oriented toward the cavity (14) such that by means of the at least one reflector element (18), a heat radiation emitted by the at least one heating line (16) and/or the membrane can be reflected back onto and/or into the membrane (12), at least partially. The invention further relates to a sensor having a micro heating plate device.

    摘要翻译: 微型加热板装置技术领域本发明涉及一种微型加热板装置,该微型加热板装置具有膜支撑单元(10),膜(12),膜(12)至少部分地跨越形成在膜支撑单元(10)中的至少一个空腔(14) 布置在膜(12)上和/或内部的一条加热线(16)。 此外,微型加热板装置包括布置在膜(12)的朝向空腔(14)定向的内侧(12a)上的至少一个反射器元件(18),使得借助于至少一个反射器元件( 18)中,至少部分地将由至少一条加热线(16)和/或膜发出的热辐射反射回到膜(12)上和/或内部。 本发明还涉及一种具有微型加热板装置的传感器。

    MIKROMECHANISCHE SENSORVORRICHTUNG UND ENTSPRECHENDES HERSTELLUNGSVERFAHREN
    5.
    发明公开

    公开(公告)号:EP2976608A1

    公开(公告)日:2016-01-27

    申请号:EP14709681.2

    申请日:2014-03-13

    申请人: Robert Bosch GmbH

    摘要: The invention relates to a micromechanical sensor device and a corresponding production method. The micromechanical sensor device comprises a substrate (1) having a front (VS) and a rear (RS), a plurality of pillars (S1, S2) being formed on the front (V) of the substrate (1). On each pillar a respective sensor element (P1, P2) is formed, which has a greater lateral extent than the associated pillar (S1, S2), a cavity (H) being provided laterally to the pillars (S1, S2) beneath the sensor elements (P1, P2). The sensor elements (P1, P2) are laterally spaced apart from each other by means of respective separating troughs (G1, G2) and make electrical contact with a respective associated rear contact (V6, E1; V7, E1) via the respective associated pillar (S1, S2).

    摘要翻译: 微机械传感器装置和相应的制造方法包括具有前后的基板和形成在基板的前面的多个支柱。 在每个支柱上,形成相应的传感器元件,其具有比相关联的支柱更大的横向延伸。 在传感器元件下面的柱子的侧面设置空腔。 传感器元件通过相应的分离槽横向间隔开并通过相应的相关柱与相应的相关联的后接触件电接触。

    MIKROMECHANISCHES SENSORELEMENT
    7.
    发明授权
    MIKROMECHANISCHES SENSORELEMENT 有权
    微机械传感器元件

    公开(公告)号:EP1966576B1

    公开(公告)日:2011-06-15

    申请号:EP06830059.9

    申请日:2006-11-21

    申请人: ROBERT BOSCH GMBH

    IPC分类号: G01L9/00

    CPC分类号: G01L9/0054 G01L9/0055

    摘要: Disclosed is a micromechanical sensor element (1) comprising a closed membrane (2) which is mounted within a frame (3). Said sensor element (1) is very sensitive and compact while being provided with great resistance to overload and allowing measured values to be detected in a piezoresistive manner. For this purpose, at least one support element (4) that is joined to the frame (3) via at least one connecting web (5) is embodied in the area of the membrane (2). Furthermore, piezo resistors (6) are disposed in the area of the connecting web (5) so as to detect a deformation.

    VERFAHREN ZUR HERSTELLUNG EINES BAUTEILS UND SENSORELEMENT
    8.
    发明公开
    VERFAHREN ZUR HERSTELLUNG EINES BAUTEILS UND SENSORELEMENT 有权
    用于测量相对压力和制造工艺的传感器元件

    公开(公告)号:EP2125607A1

    公开(公告)日:2009-12-02

    申请号:EP07847470.7

    申请日:2007-11-28

    申请人: Robert Bosch GmbH

    IPC分类号: B81C1/00 G01L9/00

    摘要: The present invention proposes a method for the production of a component (10), comprising at least one membrane (11) configured in the component surface, the membrane spanning a cavern (12), and further comprising at least one access opening (14) to the cavern (12) coming from the component rear, wherein at least one first membrane layer (2) and the cavern (12) are created in a monolithic semiconductor substrate (1) starting from the component surface, and wherein the access opening (14) starting from the substrate rear is created in a chronologically limited etching process. For this purpose, according to the invention the access opening (14) is disposed in a region in which the substrate material reaches the first membrane layer (2). Further, the etching process comprises at least one anisotropic etching step and at least one isotropic etching step for creating the access opening (14), wherein an etching channel (15) is created starting at the substrate rear in the anisotropic etching step, the channel ending beneath the first membrane layer (2) in the surrounding region of the cavern (12), and wherein at least the and region (16) of this etching channel (15) is widened in the isotropic etching step, until the etching channel (15) is connected to the cavern.

    VERFAHREN ZUR HERSTELLUNG EINES MIKROMECHANISCHEN BAUELEMENTS
    9.
    发明公开
    VERFAHREN ZUR HERSTELLUNG EINES MIKROMECHANISCHEN BAUELEMENTS 审中-公开
    用于生产微机械结构

    公开(公告)号:EP2008497A1

    公开(公告)日:2008-12-31

    申请号:EP07727181.5

    申请日:2007-03-21

    申请人: Robert Bosch GmbH

    IPC分类号: H04R19/00

    摘要: A method is proposed for production of a micromechanical component, with the component (10) being intended to have a membrane (11), a stationary plate (7) with at least one through-opening (9) through it and a cavity (12) between the membrane (11) and the plate (7). The membrane (11) is formed by a layer structure (2) on a substrate (1), and the plate (7) is structured from the substrate (1), with a cavern (6) being produced in the substrate (1) from the rear face of the component (10). The method according to the invention can be implemented easily and allows precise structuring of the openings (9) through the plate (7) independently of any openings through the membrane (11). For this purpose, at least the base of the cavern (6) which forms the rear face of the plate (7) is provided with at least one masking layer (8), which is structured in order to produce the at least one through-opening (9) through it. The substrate material is then removed in the area of the through-opening (9) through it, from the rear face of the plate (7).