公开(公告)号：EP1925027A2

公开(公告)日：2008-05-28

申请号：EP06801800.1

申请日：2006-08-15

申请人： Texas Instruments Incorporated

发明人： LANGE, Bernhard, P.

IPC分类号： H01L23/495

CPC分类号： H01L23/49541 ,  H01L23/49548 ,  H01L23/645 ,  H01L23/66 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L2223/6611 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/49431 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/0665 ,  H01L2924/07025 ,  H01L2924/2065 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012

摘要： A device comprising a semiconductor chip (110) having a side edge (111) and a plurality of metal bond pads (120, 121) near the edge; the pads are aligned to form rows (130, 131) parallel to the edge. The device further includes a leadframe (100) having leads oriented with one end towards the chip edge and spaced from it by a gap (150); the chip is attached to the leadframe. Ends of selected leads are connected by a metal cross bar (160) parallel to the chip edge. Substantially parallel bond wires (170) are crossing the gap to connect each chip pad either to the crossbar or to a non-selected lead end. In a preferred lead arrangement, the selected leads alternate with non-selected leads.

公开(公告)号：EP1938382B1

公开(公告)日：2016-06-29

申请号：EP06801590.8

申请日：2006-08-16

申请人： Texas Instruments Incorporated

发明人： COYLE, Anthony, L. ,  LANGE, Bernhard, P.

IPC分类号： H01L29/40 ,  H01L23/31 ,  H01L23/495 ,  H01L23/433 ,  H01L23/498 ,  H01L23/00

CPC分类号： H01L23/49562 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/4951 ,  H01L23/49838 ,  H01L24/14 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/051 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/136 ,  H01L2224/13609 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00014

公开(公告)号：EP1904264B1

公开(公告)日：2011-08-10

申请号：EP06772731.3

申请日：2006-06-09

申请人： Texas Instruments Incorporated

发明人： LANGE, Bernhard, P. ,  KUMMERL, Steven, Alfred

IPC分类号： B23K37/00 ,  B23K1/06 ,  B23K20/00 ,  B23K20/10

CPC分类号： B23K20/005 ,  B23K20/004 ,  B23K20/106 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4847 ,  H01L2224/78313 ,  H01L2224/78318 ,  H01L2224/85205 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/2076 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

摘要： An apparatus (100) and method for bonding a wire, such as a flat rectangular cross sectioned ribbon wire (104), to a workpiece (106) in semiconductor device fabrication. The wire is fed through a passageway (116) of an ultrasonic bond capillary (102) and clamped against an engagement surface (120) of the bond capillary via a clamping jaw (118) operably coupled to the bond capillary. The wire is bonded to the workpiece along a bonding surface (112) of the bond capillary and penetrated, at least partially, between the bonding surface and the engagement surface of the bond capillary by a cutting tool (124). The cutting tool may comprise an elongate member (126) positioned between the bonding surface and engagement surface, and may have a cutting blade (128) positioned at a distal end (130) thereof. The cutting tool may further comprise a ring cutter, wherein the ribbon wire passes through a ring having a cutting surface defined about an inner diameter thereof.

公开(公告)号：EP1938382A2

公开(公告)日：2008-07-02

申请号：EP06801590.8

申请日：2006-08-16

申请人： Texas Instruments Incorporated

发明人： COYLE, Anthony, L. ,  LANGE, Bernhard, P.

IPC分类号： H01L29/40

CPC分类号： H01L23/49562 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/4951 ,  H01L23/49838 ,  H01L24/14 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/051 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/136 ,  H01L2224/13609 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00014

摘要： A high current semiconductor device (for example QFN for 30 to 70 A) with low resistance and low inductance is encapsulated by molding compound (401, height 402 about 0.9 mm) so that the second lead surfaces (110b) remain un-encapsulated. A copper heat slug (404) may be attached to chip surface (101b) using thermally conductive adhesive (403). Chip surface (101a), protected by an overcoat (103) has metallization traces (102). Copper-filled windows contact the traces and copper layers (105) parallel to traces. Copper bumps (108) are formed on each line in an orderly and repetitive arrangement so that the bumps of one line are positioned about midway between the bumps of the neighboring lines. A substrate has elongated leads (110) oriented at right angles to the lines; the leads connect the corresponding bumps of alternating lines.

公开(公告)号：EP1932173A2

公开(公告)日：2008-06-18

申请号：EP06814056.5

申请日：2006-08-31

申请人： Texas Instruments Incorporated

发明人： LANGE, Bernhard, P. ,  COYLE, Anthony, L. ,  MAI, Quang, X.

IPC分类号： H01L21/44

CPC分类号： H01L23/53238 ,  H01L23/3121 ,  H01L23/3192 ,  H01L23/528 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/81 ,  H01L24/94 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/02331 ,  H01L2224/0235 ,  H01L2224/02375 ,  H01L2224/0239 ,  H01L2224/0345 ,  H01L2224/0361 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05024 ,  H01L2224/05073 ,  H01L2224/05166 ,  H01L2224/05647 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11912 ,  H01L2224/13013 ,  H01L2224/13082 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/14133 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/81191 ,  H01L2224/81424 ,  H01L2224/81447 ,  H01L2224/8146 ,  H01L2224/81815 ,  H01L2224/94 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3841 ,  H01L2924/00014 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2924/01028 ,  H01L2224/05193 ,  H01L2924/013 ,  H01L2924/00

摘要： A method for fabricating a low resistance, low inductance device for high current semiconductor flip-chip products. A structure is produced, which comprises a semiconductor chip (101) with metallization traces (102), copper lines in contact with the traces, and copper bumps located in an orderly and repetitive arrangement on each line so that the bumps of one line are positioned about midway between the corresponding bumps of the neighboring lines. A substrate is provided which has elongated copper leads with first and second surfaces, the leads oriented at right angles to the lines. The first surface of each lead is connected to the corresponding bumps of alternating lines using solder elements.- Finally, the assembly is encapsulated in molding compound so that the second lead surfaces remain un-encapsulated.

公开(公告)号：EP1904264A1

公开(公告)日：2008-04-02

申请号：EP06772731.3

申请日：2006-06-09

申请人： Texas Instruments Incorporated

发明人： LANGE, Bernhard, P. ,  KUMMERL, Steven, Alfred

IPC分类号： B23K37/00 ,  B23K1/06

CPC分类号： B23K20/005 ,  B23K20/004 ,  B23K20/106 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4847 ,  H01L2224/78313 ,  H01L2224/78318 ,  H01L2224/85205 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/2076 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

摘要： An apparatus (100) and method for bonding a wire, such as a flat rectangular cross sectioned ribbon wire (104), to a workpiece (106) in semiconductor device fabrication. The wire is fed through a passageway (116) of an ultrasonic bond capillary (102) and clamped against an engagement surface (120) of the bond capillary via a clamping jaw (118) operably coupled to the bond capillary. The wire is bonded to the workpiece along a bonding surface (112) of the bond capillary and penetrated, at least partially, between the bonding surface and the engagement surface of the bond capillary by a cutting tool (124). The cutting tool may comprise an elongate member (126) positioned between the bonding surface and engagement surface, and may have a cutting blade (128) positioned at a distal end (130) thereof. The cutting tool may further comprise a ring cutter, wherein the ribbon wire passes through a ring having a cutting surface defined about an inner diameter thereof.

摘要翻译： 一种用于在半导体器件制造中将诸如扁平矩形横截面带状导线（104）的导线接合到工件（106）的设备（100）和方法。 通过超声波接合毛细管（102）的通路（116）供给金属丝，并通过可操作地联接到接合毛细管的夹爪（118）将金属丝夹紧在接合毛细管的接合表面（120）上。 导线沿着结合毛细管的结合表面（112）结合到工件并且通过切割工具（124）至少部分地穿透结合毛细管的结合表面和结合表面之间。 切割工具可以包括定位在结合表面和接合表面之间的细长构件（126），并且可以具有定位在其远端（130）处的切割刀片（128）。 切割工具可以进一步包括环形切割器，其中带状线穿过具有围绕其内径限定的切割表面的环。