摘要:
Disclosed is a method of storing data in a stuck-cell memory page of a memory array, the stuck-cell memory page having a cell at a stuck-cell-identifier cell of the memory page stuck at a stuck-cell-value, the method comprising: identifying a match between a first dataset and the stuck-cell memory page; and storing the dataset in the stuck-cell memory page; wherein the identifying a match comprises identifying that the at least one bit of the dataset which corresponds to the stuck-cell-identifier of the memory cell has a value which is equal to the stuck-cell value. A memory system configured for the above method is further disclosed
摘要:
An address generation circuit generates a target address to be tested in a memory. A test data generation circuit generates write data for the address and expected value data for read data from the address. A judgment circuit compares matching/non-matching of the read data and the expected value data, for each address, judges that error correction is possible when the number of non-matching bits is within a range of numbers of bits to be error-corrected by an ECC circuit, and judges that error correction is not possible when the number is not within the range.
摘要:
A system and method for configuring fault tolerance in nonvolatile memory (NVM) are operative to set a first threshold value, declare one or more portions of NVM invalid based on an error criterion, track the number of declared invalid NVM portions, determine if the tracked number exceeds the first threshold value, and if the tracked number exceeds the first threshold value, perform one or more remediation actions, such as issue a warning or prevent backup of volatile memory data in a hybrid memory system. In the event of backup failure, an extent of the backup can still be assessed by determining the amount of erased NVM that has remained erased after the backup, or by comparing a predicted backup end point with an actual endpoint.
摘要:
Memory devices and methods are described that include a stack of memory dies and a logic die. Method and devices described include those that provide for repartitioning the stack of memory dies and storing the new partitions in a memory map. Repartitioning in selected configurations allows portions of memory to be removed from use without affecting the rest of the memory device. Additional devices, systems, and methods are disclosed.
摘要:
A memory device with background built-in self-testing (BBIST) includes a plurality of memory blocks; a memory buffer to offload data from one of the plurality of memory blocks temporarily; and a memory block stress controller to control a stress test applied to the one of the memory blocks when the data is temporarily offloaded on the memory buffer. The stress test tests for errors in the one of the plurality of the memory blocks.
摘要:
The present disclosure provides semiconductor devices and methods, systems, and apparatus for testing and operating the same. A semiconductor memory device includes data storage elements and a repair circuit. The data storage elements include primary data storage elements and one or more redundant data storage elements, the primary data storage elements having respective addresses for memory access operations. The repair circuit is programmable by another semiconductor device separate from the memory device to recognize a malfunctioning address of the primary data storage elements and the programmed repair circuit is configured to reroute memory access from a primary data storage element having the recognized malfunctioning address to a corresponding redundant data storage element.
摘要:
A built-in self-test and self-repair structure (BISR) of memory arrays embedded in an integrated device, including at least a test block (BIST) programmable to execute on a respective memory array of the device any of a certain number of predefined test algorithms, and a self-repair block that includes a column address generator processing the faulty addresses information for allocating redundant resources of the tested memory array, a redundancy register on which final redundancy information are loaded at each power-on of the device and a control logic for managing data transfer from external circuitry to the built-in self-test and self-repair structure (BISR) and vice versa, utilizes a single built-in self-test (BIST) structure serves any number of embedded memory arrays even of different type and size. The built-in self-test and self-repair (BISR) structure further includes nonvolatile storage means containing information on addresses and data bus sizes of the device architecture, aspect ratio, capacity, multiplexing and scrambling parameters and relative test algorithm instructions for each of said embedded memory arrays and on which redundance column addresses are permanently stored and a multiple frequency clock generator for selecting the maximum operating clock frequency of the type of embedded memory array to be accessed. Two distinct selectable test flows of an embedded random access memory array are selectable by programming. A first two-step test flow, each step of which includes the execution of a complete BIST check on the array, and a second three-step test flow, each step of which includes the execution of a complete BIST check on the array, the third BIST check revealing a possible failed programming of the redundance column addresses in said nonvolatile storage means.