公开(公告)号：EP3734657B1

公开(公告)日：2024-05-22

申请号：EP20167443.9

申请日：2020-03-31

IPC: H01L25/065 ,  H01L25/16 ,  H01L23/50 ,  H01L23/498 ,  H01L23/538 ,  H01L23/00 ,  H01L25/10

CPC classification number: H01L23/5389 ,  H01L23/49816 ,  H01L25/105 ,  H01L23/50 ,  H01L24/19 ,  H01L2224/7320420130101 ,  H01L2224/040120130101 ,  H01L2224/1623720130101 ,  H01L2224/4822720130101 ,  H01L2224/3214520130101 ,  H01L2224/3222520130101 ,  H01L25/0657 ,  H01L2225/065120130101 ,  H01L2225/0656220130101 ,  H01L25/16

公开(公告)号：EP4420122A1

公开(公告)日：2024-08-28

申请号：EP22884207.6

申请日：2022-05-10

Applicant: Sandisk Technologies, Inc.

Inventor： LI, Liang ,  YU, Yinfeng ,  TU, Loc

IPC: G11C5/04 ,  G06F3/06 ,  G11C16/14

CPC classification number: H01L25/18 ,  H01L2225/0656220130101 ,  H01L2225/0654120130101 ,  H01L2225/0650620130101 ,  H01L2225/065120130101 ,  H01L2225/0656520130101 ,  G11C5/04 ,  G11C16/0483 ,  G11C16/349 ,  G11C2029/040920130101 ,  G11C29/4401 ,  G06N20/10 ,  G06N20/20 ,  G06N5/01 ,  G06N3/086 ,  G06N3/0464 ,  G06N3/048 ,  G06N3/09 ,  G06F11/073 ,  G06F11/0751 ,  G06F11/0793 ,  G06F11/3037 ,  G06F11/3409 ,  G06F11/3447 ,  G06F11/3466

公开(公告)号：EP4397152A1

公开(公告)日：2024-07-10

申请号：EP22865235.0

申请日：2022-05-08

Applicant: SanDisk Technologies LLC

Inventor： YANG, Xiang ,  DUTTA, Deepanshu

IPC: H10B43/50 ,  H10B43/35 ,  H10B43/27 ,  G11C16/10 ,  G11C16/04 ,  G11C16/08 ,  G11C16/24

CPC classification number: G11C16/0483 ,  G11C16/08 ,  G11C16/10 ,  G11C16/3459 ,  G11C11/5628 ,  G11C2211/562120130101 ,  H01L25/18 ,  H01L25/0657 ,  H01L2225/065120130101 ,  H01L2225/0650620130101 ,  H01L2225/0651320130101 ,  H01L2225/0651720130101 ,  H01L2225/0654120130101 ,  H01L2225/0656220130101 ,  H10B43/27 ,  H10B43/10

公开(公告)号：EP4393013A1

公开(公告)日：2024-07-03

申请号：EP22748695.8

申请日：2022-07-01

Applicant: QUALCOMM INCORPORATED

Inventor： VEMURI, Krishna ,  KIM, Jinseong

IPC: H01L23/538 ,  H01L25/065 ,  H01L23/48 ,  H01L23/00 ,  H01L25/00 ,  H01L25/18

CPC classification number: H01L23/5383 ,  H01L23/5385 ,  H01L25/0657 ,  H01L25/50 ,  H01L2225/065120130101 ,  H01L2225/0651720130101 ,  H01L2225/065220130101 ,  H01L2225/0652420130101 ,  H01L2225/0654820130101 ,  H01L2225/0656220130101 ,  H01L24/16 ,  H01L25/18 ,  H01L2224/1622720130101 ,  H01L2224/4822720130101 ,  H01L2224/3214520130101 ,  H01L2224/7325320130101 ,  H01L2224/7326520130101 ,  H01L2924/1531120130101 ,  H01L2924/1519220130101 ,  H01L2224/9224720130101 ,  H01L2224/7321520130101 ,  H01L2224/4809120130101 ,  H01L2924/1420130101 ,  H01L2924/0001420130101 ,  H01L2224/1310120130101 ,  H01L24/13 ,  H01L24/48 ,  H01L2924/18120130101 ,  H01L2224/291920130101 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/838520130101 ,  H01L2224/8320320130101 ,  H01L24/73 ,  H01L24/32 ,  H01L23/49816

公开(公告)号：EP4439664A2

公开(公告)日：2024-10-02

申请号：EP24188644.9

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： HEPPNER, Joshua ,  MODI, Mitul

IPC: H01L25/065

CPC classification number: H01L23/48 ,  H01L23/552 ,  H01L2224/9720130101 ,  H01L2924/1910720130101 ,  H01L2225/0653720130101 ,  H01L25/0655 ,  H01L2225/065120130101 ,  H01L2225/0650620130101 ,  H01L25/0657

Abstract: An example of a microelectronics package (500, 600), comprises a substrate (503) having a substrate surface, the substrate surface having an electronic component (510, 615) provided thereon and one or more ground pads (505, 507, 509) disposed on the substrate surface; and a shielding structure (520, 620) electrically connected to the one or more ground pads and mounted on the substrate surface and at least partially enclosing the electronic component, the shielding structure comprising a plurality of wires or a plurality of ribbons, wherein end portions of pairs of adjacent bond wires or ribbons of the shielding structure are connected to individual ground pads of the one or more ground pads and overlap one another in a circumferential direction around the electronic component.

公开(公告)号：EP4423814A1

公开(公告)日：2024-09-04

申请号：EP22888403.7

申请日：2022-10-21

Applicant: Adeia Semiconductor Bonding Technologies Inc.

Inventor： GAO, Guilian ,  FOUNTAIN, Gaius, Gillman, Jr. ,  HABA, Belgacem

IPC: H01L25/065 ,  H01L25/18 ,  H01L25/16 ,  H01L25/00 ,  H01L23/528

CPC classification number: H01L25/18 ,  H01L25/16 ,  H01L25/0657 ,  H01L2225/0654120130101 ,  H01L2225/0658920130101 ,  H01L24/16 ,  H01L24/08 ,  H01L2225/0652420130101 ,  H01L2225/065120130101 ,  H01L2225/0656520130101 ,  H01L24/48 ,  H01L23/5286 ,  H01L24/17 ,  H01L24/05 ,  H01L24/13 ,  H01L24/06 ,  H01L23/481

公开(公告)号：EP3923325B1

公开(公告)日：2024-06-19

申请号：EP20892133.8

申请日：2020-08-06

IPC: G11C5/02 ,  H01L23/485 ,  H01L23/49 ,  H01L25/065 ,  G11C5/06

CPC classification number: H01L23/488 ,  H01L23/31 ,  H01L25/0657 ,  H01L2225/065120130101 ,  H01L2225/0650620130101 ,  G11C5/063 ,  H01L24/06 ,  H01L24/49 ,  G11C5/025 ,  H01L2225/0656220130101 ,  H01L2225/0652720130101 ,  H01L2224/4911320130101 ,  H01L2924/0001420130101 ,  H01L2224/4822720130101 ,  H01L2924/18120130101 ,  H01L2924/1531120130101 ,  H01L24/48 ,  H01L2924/143420130101 ,  H01L2224/0555320130101 ,  H01L2224/0404220130101

公开(公告)号：EP4434033A1

公开(公告)日：2024-09-25

申请号：EP22896265.0

申请日：2022-05-14

Applicant: SanDisk Technologies LLC

Inventor： YANG, Xiang ,  WU, Fanqi ,  GUO, Jiacen ,  YUAN, Jiahui

IPC: G11C16/08 ,  G11C16/24 ,  G11C16/30 ,  G11C8/14 ,  G11C16/04

CPC classification number: G11C16/3459 ,  G11C11/5628 ,  G11C16/32 ,  G11C16/0483 ,  G11C16/08 ,  G11C16/24 ,  G11C16/10 ,  G11C16/3427 ,  H01L23/66 ,  H01L25/0657 ,  H01L2225/0656520130101 ,  H01L2225/0654120130101 ,  H01L2225/0651720130101 ,  H01L2225/0651320130101 ,  H01L2225/0650620130101 ,  H01L2225/065120130101 ,  H10B43/27

公开(公告)号：EP4425548A2

公开(公告)日：2024-09-04

申请号：EP24190007.5

申请日：2020-02-06

Applicant: Micron Technology, Inc

Inventor： GANS, Dean, D.

IPC: H01L25/065

CPC classification number: G06F13/1668 ,  G11C2207/10520130101 ,  G11C5/025 ,  G11C5/04 ,  G11C5/063 ,  G11C7/1015 ,  G11C2207/10720130101 ,  H01L2224/4822720130101 ,  H01L2224/1614520130101 ,  H01L2225/0651320130101 ,  H01L2225/065120130101 ,  H01L2924/1531120130101 ,  H01L2225/0654120130101 ,  H01L25/0657 ,  H01L2224/4814520130101 ,  H01L2225/0650620130101 ,  G06F12/0862 ,  G06F2212/602820130101 ,  G06F2212/602620130101 ,  G06F12/0607 ,  G06F13/4247 ,  Y02D10/00

Abstract: Methods, systems, and devices for stacked memory dice and combined access operations are described. A device may include multiple memory dice. One die may be configured as a master, and another may be configured as a slave. The master may communicate with a host device. A slave may be coupled with the master but not the host device. The device may include a first die (e.g., master) and a second die (e.g., slave ). The first die may be coupled with a host device and configured to output a set of data in response to a read command. The first die may supply a first subset of the data and obtain a second subset of the data from the second die. In some cases, the first die may select, based on a data rate, a modulation scheme (e.g., PAM4, NRZ, etc.) and output the data using the selected modulation scheme.

公开(公告)号：EP3154083B1

公开(公告)日：2024-08-07

申请号：EP16186286.7

申请日：2016-08-30

IPC: H01L23/498 ,  H01L25/10

CPC classification number: H01L23/49816 ,  H01L23/49833 ,  H01L23/5389 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/040120130101 ,  H01L2224/13120130101 ,  H01L2224/1314720130101 ,  H01L2224/1622720130101 ,  H01L2224/3214520130101 ,  H01L2224/3222520130101 ,  H01L2224/4809120130101 ,  H01L2224/4822720130101 ,  H01L2224/7320420130101 ,  H01L2224/7325320130101 ,  H01L2224/7326520130101 ,  H01L2225/065120130101 ,  H01L2225/103520130101 ,  H01L2924/1531120130101 ,  H01L2924/1533120130101 ,  H01L2225/0656820130101 ,  H01L2924/351120130101 ,  H01L25/105 ,  H01L2225/104120130101 ,  H01L2225/105820130101 ,  H01L2225/109420130101 ,  H01L2924/18120130101 ,  H01L2224/1622520130101 ,  H01L2224/9212520130101