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公开(公告)号：EP3734657B1
公开(公告)日：2024-05-22
申请号：EP20167443.9
申请日：2020-03-31
IPC分类号： H01L25/065 , H01L25/16 , H01L23/50 , H01L23/498 , H01L23/538 , H01L23/00 , H01L25/10
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公开(公告)号：EP4420122A1
公开(公告)日：2024-08-28
申请号：EP22884207.6
申请日：2022-05-10
发明人： LI, Liang , YU, Yinfeng , TU, Loc
CPC分类号： H01L25/18 , H01L2225/0656220130101 , H01L2225/0654120130101 , H01L2225/0650620130101 , H01L2225/065120130101 , H01L2225/0656520130101 , G11C5/04 , G11C16/0483 , G11C16/349 , G11C2029/040920130101 , G11C29/4401 , G06N20/10 , G06N20/20 , G06N5/01 , G06N3/086 , G06N3/0464 , G06N3/048 , G06N3/09 , G06F11/073 , G06F11/0751 , G06F11/0793 , G06F11/3037 , G06F11/3409 , G06F11/3447 , G06F11/3466
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公开(公告)号：EP4397152A1
公开(公告)日：2024-07-10
申请号：EP22865235.0
申请日：2022-05-08
发明人： YANG, Xiang , DUTTA, Deepanshu
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公开(公告)号：EP4393013A1
公开(公告)日：2024-07-03
申请号：EP22748695.8
申请日：2022-07-01
发明人： VEMURI, Krishna , KIM, Jinseong
IPC分类号： H01L23/538 , H01L25/065 , H01L23/48 , H01L23/00 , H01L25/00 , H01L25/18
CPC分类号： H01L23/5383 , H01L23/5385 , H01L25/0657 , H01L25/50 , H01L2225/065120130101 , H01L2225/0651720130101 , H01L2225/065220130101 , H01L2225/0652420130101 , H01L2225/0654820130101 , H01L2225/0656220130101 , H01L24/16 , H01L25/18 , H01L2224/1622720130101 , H01L2224/4822720130101 , H01L2224/3214520130101 , H01L2224/7325320130101 , H01L2224/7326520130101 , H01L2924/1531120130101 , H01L2924/1519220130101 , H01L2224/9224720130101 , H01L2224/7321520130101 , H01L2224/4809120130101 , H01L2924/1420130101 , H01L2924/0001420130101 , H01L2224/1310120130101 , H01L24/13 , H01L24/48 , H01L2924/18120130101 , H01L2224/291920130101 , H01L24/29 , H01L24/83 , H01L2224/838520130101 , H01L2224/8320320130101 , H01L24/73 , H01L24/32 , H01L23/49816
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公开(公告)号：EP4439664A2
公开(公告)日：2024-10-02
申请号：EP24188644.9
申请日：2016-04-01
申请人： Intel Corporation
发明人： HEPPNER, Joshua , MODI, Mitul
IPC分类号： H01L25/065
CPC分类号： H01L23/48 , H01L23/552 , H01L2224/9720130101 , H01L2924/1910720130101 , H01L2225/0653720130101 , H01L25/0655 , H01L2225/065120130101 , H01L2225/0650620130101 , H01L25/0657
摘要： An example of a microelectronics package (500, 600), comprises a substrate (503) having a substrate surface, the substrate surface having an electronic component (510, 615) provided thereon and one or more ground pads (505, 507, 509) disposed on the substrate surface; and a shielding structure (520, 620) electrically connected to the one or more ground pads and mounted on the substrate surface and at least partially enclosing the electronic component, the shielding structure comprising a plurality of wires or a plurality of ribbons, wherein end portions of pairs of adjacent bond wires or ribbons of the shielding structure are connected to individual ground pads of the one or more ground pads and overlap one another in a circumferential direction around the electronic component.
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公开(公告)号：EP4423814A1
公开(公告)日：2024-09-04
申请号：EP22888403.7
申请日：2022-10-21
IPC分类号： H01L25/065 , H01L25/18 , H01L25/16 , H01L25/00 , H01L23/528
CPC分类号： H01L25/18 , H01L25/16 , H01L25/0657 , H01L2225/0654120130101 , H01L2225/0658920130101 , H01L24/16 , H01L24/08 , H01L2225/0652420130101 , H01L2225/065120130101 , H01L2225/0656520130101 , H01L24/48 , H01L23/5286 , H01L24/17 , H01L24/05 , H01L24/13 , H01L24/06 , H01L23/481
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公开(公告)号：EP3923325B1
公开(公告)日：2024-06-19
申请号：EP20892133.8
申请日：2020-08-06
IPC分类号： G11C5/02 , H01L23/485 , H01L23/49 , H01L25/065 , G11C5/06
CPC分类号： H01L23/488 , H01L23/31 , H01L25/0657 , H01L2225/065120130101 , H01L2225/0650620130101 , G11C5/063 , H01L24/06 , H01L24/49 , G11C5/025 , H01L2225/0656220130101 , H01L2225/0652720130101 , H01L2224/4911320130101 , H01L2924/0001420130101 , H01L2224/4822720130101 , H01L2924/18120130101 , H01L2924/1531120130101 , H01L24/48 , H01L2924/143420130101 , H01L2224/0555320130101 , H01L2224/0404220130101
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公开(公告)号：EP4434033A1
公开(公告)日：2024-09-25
申请号：EP22896265.0
申请日：2022-05-14
发明人： YANG, Xiang , WU, Fanqi , GUO, Jiacen , YUAN, Jiahui
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公开(公告)号：EP4425548A2
公开(公告)日：2024-09-04
申请号：EP24190007.5
申请日：2020-02-06
发明人： GANS, Dean, D.
IPC分类号： H01L25/065
CPC分类号： G06F13/1668 , G11C2207/10520130101 , G11C5/025 , G11C5/04 , G11C5/063 , G11C7/1015 , G11C2207/10720130101 , H01L2224/4822720130101 , H01L2224/1614520130101 , H01L2225/0651320130101 , H01L2225/065120130101 , H01L2924/1531120130101 , H01L2225/0654120130101 , H01L25/0657 , H01L2224/4814520130101 , H01L2225/0650620130101 , G06F12/0862 , G06F2212/602820130101 , G06F2212/602620130101 , G06F12/0607 , G06F13/4247 , Y02D10/00
摘要： Methods, systems, and devices for stacked memory dice and combined access operations are described. A device may include multiple memory dice. One die may be configured as a master, and another may be configured as a slave. The master may communicate with a host device. A slave may be coupled with the master but not the host device. The device may include a first die (e.g., master) and a second die (e.g., slave ). The first die may be coupled with a host device and configured to output a set of data in response to a read command. The first die may supply a first subset of the data and obtain a second subset of the data from the second die. In some cases, the first die may select, based on a data rate, a modulation scheme (e.g., PAM4, NRZ, etc.) and output the data using the selected modulation scheme.
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公开(公告)号：EP3154083B1
公开(公告)日：2024-08-07
申请号：EP16186286.7
申请日：2016-08-30
IPC分类号： H01L23/498 , H01L25/10
CPC分类号： H01L23/49816 , H01L23/49833 , H01L23/5389 , H01L25/0657 , H01L25/50 , H01L2224/040120130101 , H01L2224/13120130101 , H01L2224/1314720130101 , H01L2224/1622720130101 , H01L2224/3214520130101 , H01L2224/3222520130101 , H01L2224/4809120130101 , H01L2224/4822720130101 , H01L2224/7320420130101 , H01L2224/7325320130101 , H01L2224/7326520130101 , H01L2225/065120130101 , H01L2225/103520130101 , H01L2924/1531120130101 , H01L2924/1533120130101 , H01L2225/0656820130101 , H01L2924/351120130101 , H01L25/105 , H01L2225/104120130101 , H01L2225/105820130101 , H01L2225/109420130101 , H01L2924/18120130101 , H01L2224/1622520130101 , H01L2224/9212520130101
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