公开(公告)号：EP2858100A4

公开(公告)日：2016-04-13

申请号：EP13797985

申请日：2013-05-27

申请人： NSK LTD

发明人： SUNAGA TAKASHI ,  KANEKO NOBORU ,  MIYOSHI OSAMU

IPC分类号： H01L21/60 ,  H01L23/48 ,  H01L25/07 ,  H01L25/18

CPC分类号： H01L24/43 ,  H01L23/3735 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/75 ,  H01L24/77 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L24/92 ,  H01L25/07 ,  H01L25/072 ,  H01L25/18 ,  H01L29/78 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/32227 ,  H01L2224/32238 ,  H01L2224/33181 ,  H01L2224/352 ,  H01L2224/35847 ,  H01L2224/3701 ,  H01L2224/37011 ,  H01L2224/37013 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40227 ,  H01L2224/40475 ,  H01L2224/40499 ,  H01L2224/4103 ,  H01L2224/4112 ,  H01L2224/41175 ,  H01L2224/43848 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/494 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/75272 ,  H01L2224/77272 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/84424 ,  H01L2224/84447 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/85 ,  H01L2224/85815 ,  H01L2224/9221 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15724 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2924/3701 ,  H05K1/181 ,  H05K2201/10166 ,  H05K2201/1031 ,  H05K2201/10409 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2224/33 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/48227

公开(公告)号：EP2916348A4

公开(公告)日：2016-01-27

申请号：EP13851001

申请日：2013-10-25

申请人： NSK LTD

发明人： SUNAGA TAKASHI ,  KANEKO NOBORU ,  MIYOSHI OSAMU

IPC分类号： H01L21/60 ,  B62D5/04 ,  H01L25/07 ,  H01L25/18

CPC分类号： H01L23/49551 ,  B62D5/0406 ,  H01L23/49524 ,  H01L23/49562 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L24/92 ,  H01L25/07 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/29101 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/352 ,  H01L2224/3701 ,  H01L2224/37011 ,  H01L2224/37013 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40106 ,  H01L2224/40159 ,  H01L2224/40225 ,  H01L2224/4103 ,  H01L2224/41175 ,  H01L2224/73263 ,  H01L2224/77272 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/84095 ,  H01L2224/84424 ,  H01L2224/84447 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/92246 ,  H01L2224/92247 ,  H01L2924/014 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/15724 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/1305 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A semiconductor module is provided for shortening a manufacturing tact time and reduce manufacturing costs and for ensuring reliability of a bonding portion. The semiconductor module includes a substrate (31) formed of a metal, an insulating layer (32) formed on the substrate (31), a plurality of wiring patterns (33a to 33d) formed on the insulating layer (32), a bare-chip transistor (35) mounted on one wiring pattern (33a) via a solder (34a), and copper connectors (36a, 36b) that connects electrodes (S, G) formed on the bear-chip transistor (35) and other wiring patterns (33b, 33c) via a solder (34b, 34c). The copper connectors (36a, 36b) has a bridge shape, has a width-reduced portion (36ag) formed in the vicinity of the bonding face (36af) to the electrodes (S, G), and has a stress-reducing portion (36ak) formed on the bonding face (36af) bonded to the electrode (S, G).

公开(公告)号：EP2858100A1

公开(公告)日：2015-04-08

申请号：EP13797985.2

申请日：2013-05-27

申请人： NSK Ltd.

发明人： SUNAGA, Takashi ,  KANEKO, Noboru ,  MIYOSHI, Osamu

IPC分类号： H01L21/60 ,  H01L23/48 ,  H01L25/07 ,  H01L25/18

CPC分类号： H01L24/43 ,  H01L23/3735 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/75 ,  H01L24/77 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L24/92 ,  H01L25/07 ,  H01L25/072 ,  H01L25/18 ,  H01L29/78 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/32227 ,  H01L2224/32238 ,  H01L2224/33181 ,  H01L2224/352 ,  H01L2224/35847 ,  H01L2224/3701 ,  H01L2224/37011 ,  H01L2224/37013 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40227 ,  H01L2224/40475 ,  H01L2224/40499 ,  H01L2224/4103 ,  H01L2224/4112 ,  H01L2224/41175 ,  H01L2224/43848 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/494 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/75272 ,  H01L2224/77272 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/84424 ,  H01L2224/84447 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/85 ,  H01L2224/85815 ,  H01L2224/9221 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15724 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2924/3701 ,  H05K1/181 ,  H05K2201/10166 ,  H05K2201/1031 ,  H05K2201/10409 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2224/33 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/48227

摘要： There is provided a semiconductor module and a method for manufacturing the same which make it possible to joint the electrode of the bare-chip transistor and the wiring pattern on the substrate by solder mounting operation, in the same process of solder mounting operation for mounting the bare-chip transistor or other surface mounting devices on the wiring patterns on the substrate A semiconductor module (30) includes: a plurality of wiring patterns (33a) to (33d) formed on an insulating layer (32); a bare-chip transistor (35) mounted on one wiring pattern (33a) out of the plurality of wiring patterns (33a) to (33d) via a solder (34a); and a copper connector (36a), (36b) constituted of a copper plate for jointing an electrode (S), (G) formed on a top surface of the bare-chip transistor (35) and another wiring pattern (33b), (33c) out of the plurality of wiring patterns (33a) to (33d) via a solder (34a), (34c).

摘要翻译： 提供了一种半导体模块及其制造方法，其可以通过焊接安装操作将裸芯片晶体管的电极和布线图案与基板上的布线图案相连接，在相同的焊接安装操作过程中， 裸片晶体管或其他表面安装器件在衬底上的布线图案上半导体模块（30）包括：形成在绝缘层（32）上的多个布线图案（33a）至（33d）; 经由焊料（34a）从所述多个布线图案（33a）〜（33d）中的一个布线图案（33a）上安装的裸芯片晶体管（35） 以及由形成在裸芯片晶体管（35）的上表面上的电极（S），（G）和另一布线图案（33b）构成的铜板构成的铜连接器（36a），（36b） （34a），（34c）中的多个布线图案（33a）〜（33d）中。