公开(公告)号：EP2866534A1

公开(公告)日：2015-04-29

申请号：EP13807421.6

申请日：2013-06-21

申请人： Kyocera Corporation

发明人： OHASHI,Yoshio ,  SHIKATA,Kunihide

IPC分类号： H05K3/38 ,  H05K1/09 ,  H05K3/12

CPC分类号： H05K1/181 ,  C04B37/025 ,  C04B2237/10 ,  C04B2237/343 ,  C04B2237/407 ,  C04B2237/55 ,  C04B2237/59 ,  C04B2237/86 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/111 ,  H05K3/388 ,  H05K2201/10462 ,  H05K2201/2063 ,  Y02P70/611 ,  H01L2924/00014

摘要： [Object] To provide a highly reliable circuit board which can be used for a long period of time and an electronic apparatus including this circuit board and an electronic component mounted thereon.
[Solution] The circuit board includes a ceramic sintered body (11) and a metal wiring layer (13) provided on at least one primary surface (11a) thereof with a glass layer (12) interposed therebetween, and when the cross section of the circuit board perpendicular to the primary surface (11a) of the ceramic sintered body (11) is viewed, the ratio of the length of an interface (15) between the glass layer (12) and the metal wiring layer (13) to a length (12a) of the glass layer (12) in a direction along the primary surface (11a) is 1.25 to 1.80. As a result, good heat dissipation characteristics can be obtained, and the metal wiring layer (13) is not likely to be peeled away from the ceramic sintered body (11) due to operation of an electronic component (21) and/or cooling/heating cycles performed by repeated on-off operations thereof, so that a highly reliable circuit board which can be used for a long period of time can be provided.

摘要翻译： 本发明的目的在于提供一种能够长期使用的高可靠性的电路基板以及搭载该电路基板和电子部件的电子设备。 该电路板包括陶瓷烧结体（11）和设置在其至少一个主表面（11a）上的金属布线层（13），其间插入玻璃层（12），并且当 观察垂直于陶瓷烧结体（11）的主表面（11a）的电路板，玻璃层（12）和金属布线层（13）之间的界面（15）的长度与长度 所述玻璃层（12）的沿着所述主面（11a）的方向的宽度（12a）为1.25〜1.80。 结果，可以获得良好的散热特性，并且由于电子部件（21）的操作和/或冷却/冷却，金属布线层（13）不容易从陶瓷烧结体（11） 通过反复开关操作进行加热循环，从而可以提供可长期使用的高度可靠的电路板。

公开(公告)号：EP2402485A4

公开(公告)日：2012-09-19

申请号：EP10746116

申请日：2010-02-17

申请人： JX NIPPON MINING & METALS CORP

发明人： YOSHIDA TAKU

IPC分类号： C23C28/02 ,  B32B15/088 ,  C23C18/20 ,  C25D5/56 ,  H05K3/24 ,  H05K3/38

CPC分类号： H05K3/388 ,  C23C18/1651 ,  C23C18/2006 ,  C23C18/204 ,  C23C18/24 ,  C25D5/56 ,  H05K1/0346 ,  H05K3/181 ,  H05K3/381 ,  H05K2201/0154 ,  H05K2201/0344 ,  H05K2201/2063 ,  Y10T428/12535 ,  Y10T428/31721

公开(公告)号：EP0187706A2

公开(公告)日：1986-07-16

申请号：EP86300070.9

申请日：1986-01-07

申请人： International Business Machines Corporation

发明人： Ho, Paul Siu-Chung ,  Hahn, Peter Otto ,  Lefakis, Harry ,  Rubloff, Gary Wayne

IPC分类号： C23C14/02

CPC分类号： H01L23/145 ,  C23C14/20 ,  H01L21/4846 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/388 ,  H05K2201/2063 ,  H05K2203/1105 ,  H01L2924/00

摘要： In order to increase the adhesion between an organic substrate and a metal which normally bonds only weakly to the substrate, the substrate is heated to a temperature range , of about (0.6-0.8) T e , where T e is the curing temperature of the substrate, and then held within that temperature range while metal atoms are deposited on the substrate at such a rate that the arrival rate of the metal atoms at the surface of the substrate is comparable with or less than the rate of diffusion of metal atoms into the substrate. This provides optimum intermixing and maximum adhesion. Suitable metals include Ni, Cu, Al, Ag, Au, Ta, Pt, Ir, Rh, Pd, Zn, and Cd. Suitable organic substrates include mylar, polyimides, polyesters, polyethylene, epoxy and polystyrene. Enhanced adhesion occurs when intermixing between the depositing metal atoms and the substrate is optimized to a depth less than about 1000 angstroms (100 nm) into the substrate.

摘要翻译： 为了增加有机基板和通常仅与基板弱结合的金属之间的粘附性，将基板加热到约（0.6-0.8）Tc的温度范围，其中Tc是基板的固化温度，以及 然后保持在该温度范围内，同时金属原子以基板表面的金属原子的到达速率与金属原子扩散到基底中的速度相当的速度沉积在基底上。 这提供了最佳的混合和最大的附着力。 合适的金属包括Ni，Cu，Al，Ag，Au，Ta，Pt，Ir，Rh，Pd，Zn和Cd。 合适的有机底物包括聚酯薄片，聚酰亚胺，聚酯，聚乙烯，环氧树脂和聚苯乙烯。 当沉积金属原子和衬底之间的混合被优化到小于约1000埃（100nm）的深度的衬底中时，发生增强的粘附。

公开(公告)号：EP1801823A1

公开(公告)日：2007-06-27

申请号：EP06026321.7

申请日：2006-12-19

申请人： TDK Corporation

发明人： Katoh, Tomohiko ,  Horino, Kenji ,  Saya, Yuko

IPC分类号： H01G4/008

CPC分类号： H01G4/33 ,  H01G4/008 ,  H01L27/016 ,  H05K1/162 ,  H05K3/38 ,  H05K2201/0175 ,  H05K2201/0355 ,  H05K2201/2063 ,  H05K2203/1105 ,  Y10T29/49126 ,  Y10T29/49163 ,  Y10T29/49204 ,  Y10T29/49213

摘要： A multilayer structure (10) which comprises a first metal conductor (12), a dielectric (14) provided on the first conductor, and an intermediate region (16) positioned between the first conductor (12) and the dielectric (14). The intermediate region is obtained by a thermal process and corresponds to an additive element different from the element of the first conductor and the dielectric. The additive is mixed with the first conductor and forms with the conductor and the dielectric an intermediate region (16). The additive contains at least one element selected from the group consisting of Si, Al, P, Mg, Mn, Y, V, Mo, Co, Nb, Fe, and Gr, or an oxide of these elements.

公开(公告)号：EP1644555A2

公开(公告)日：2006-04-12

申请号：EP04748136.1

申请日：2004-07-22

申请人： Toyota Jidosha Kabushiki Kaisha

发明人： HIRAOKA, Motoki ,  YOSHINAGA, Fumitaka ,  DAIZA, Setsuto ,  BESSHO, Takeshi

IPC分类号： C23C18/31 ,  C23C18/28

CPC分类号： H05K3/38 ,  C23C18/08 ,  C23C18/2033 ,  C23C18/2086 ,  C23C18/31 ,  H05K3/181 ,  H05K2201/2063 ,  H05K2203/1152 ,  Y10T428/25 ,  Y10T428/26 ,  Y10T428/31504 ,  Y10T428/31678

摘要： A resin-metal composite layer is formed by modifying a surface of a resin substrate to a modified layer, contacting the modified layer with a metal compound solution, and adsorbing at least either metal colloids or ions are adsorbed to the polar group, so that metal particles are dispersed into the modified layer. Because of the fineness of the metal particles in the resin-metal composite layer, high transparent can be achieved. The resin-metal composite layer functions as a transparent conductive layer and the like.

公开(公告)号：EP0564693A1

公开(公告)日：1993-10-13

申请号：EP92109568.3

申请日：1992-06-05

申请人： NISSIN ELECTRIC COMPANY, LIMITED

发明人： Ebe, Akinori, c/o Nissin Electric Co., Ltd. ,  Ogata, Kiyoshi, c/o Nissin Electric Co., Ltd. ,  Nishiyama, Satoshi, c/o Nissin Electric Co., Ltd.

IPC分类号： H01L21/48

CPC分类号： H05K3/388 ,  H01L21/4846 ,  H05K1/0393 ,  H05K3/022 ,  H05K2201/2063

摘要： A film carrier type substrate (20) includes a film (21) made of organic high molecular substance, a metal layer (23) formed over the film by depositing metal vapor and irradiating nitrogen gas ions on the film and a mixing layer (22) made of a mixture of the materials of both the metal layer and the film formed in the interface between the metal layer and the film. Prior to forming the metal layer, inert gas ions and/or nitrogen gas ions may be irradiated on the film in advance.

摘要翻译： 薄膜载体型基板（20）包括由有机高分子物质制成的膜（21），通过沉积金属蒸气并在膜上照射氮气离子在该膜上形成的金属层（23）和混合层（22） 由金属层和形成在金属层和膜之间的界面中的膜的材料的混合物制成。 在形成金属层之前，预先将惰性气体离子和/或氮气离子照射在膜上。

公开(公告)号：EP1801823B1

公开(公告)日：2016-05-25

申请号：EP06026321.7

申请日：2006-12-19

申请人： TDK Corporation

发明人： Katoh, Tomohiko ,  Horino, Kenji ,  Saya, Yuko

IPC分类号： H01G4/33 ,  H05K3/38

CPC分类号： H01G4/33 ,  H01G4/008 ,  H01L27/016 ,  H05K1/162 ,  H05K3/38 ,  H05K2201/0175 ,  H05K2201/0355 ,  H05K2201/2063 ,  H05K2203/1105 ,  Y10T29/49126 ,  Y10T29/49163 ,  Y10T29/49204 ,  Y10T29/49213

公开(公告)号：EP2244542A1

公开(公告)日：2010-10-27

申请号：EP09158711.3

申请日：2009-04-24

申请人： ATOTECH Deutschland GmbH

发明人： Sparing, Christian ,  Huelsmann, Thomas ,  Brooks, Patrick ,  Clicque, Arno

IPC分类号： H05K3/38

CPC分类号： H05K3/389 ,  H05K3/385 ,  H05K2201/2063 ,  H05K2203/0315

摘要： The present invention relates to a process for manufacture of multilayer printed circuit boards and articles formed thereby, especially IC substrates. The inventtive process utilizes in individual process steps inorganic silicates and organosilane bonding mixtures to provide adhesion between layers of copper and dielectric materials. Said process leads to an enhanced adhesive strength, improved mechanical and thermal stress resistance as well as humidity resistance of multilayer printed circuit boards and IC substrates.

摘要翻译： 本发明涉及一种用于制造由此形成的多层印刷电路板和制品的方法，特别是IC基板。 本发明方法在单独的工艺步骤中利用无机硅酸盐和有机硅烷键合混合物来提供铜层和电介质材料层之间的粘附。 所述方法提高了多层印刷电路板和IC基片的粘合强度，改善的机械和热应力阻抗以及耐湿性。

公开(公告)号：EP0187706B1

公开(公告)日：1989-12-13

申请号：EP86300070.9

申请日：1986-01-07

申请人： International Business Machines Corporation

发明人： Ho, Paul Siu-Chung ,  Hahn, Peter Otto ,  Lefakis, Harry ,  Rubloff, Gary Wayne

IPC分类号： C23C14/02

CPC分类号： H01L23/145 ,  C23C14/20 ,  H01L21/4846 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/388 ,  H05K2201/2063 ,  H05K2203/1105 ,  H01L2924/00

公开(公告)号：EP2866534A4

公开(公告)日：2016-01-20

申请号：EP13807421

申请日：2013-06-21

申请人： KYOCERA CORP

发明人： OHASHI YOSHIO ,  SHIKATA KUNIHIDE

IPC分类号： H05K3/38 ,  C04B37/00 ,  C04B37/02 ,  C04B41/50 ,  C04B41/51 ,  C04B41/52 ,  C04B41/53 ,  C04B41/90 ,  H05K1/03 ,  H05K1/09 ,  H05K1/18 ,  H05K3/12

CPC分类号： H05K1/181 ,  C04B37/025 ,  C04B2237/10 ,  C04B2237/343 ,  C04B2237/407 ,  C04B2237/55 ,  C04B2237/59 ,  C04B2237/86 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/111 ,  H05K3/388 ,  H05K2201/10462 ,  H05K2201/2063 ,  Y02P70/611 ,  H01L2924/00014

摘要： [Object] To provide a highly reliable circuit board which can be used for a long period of time and an electronic apparatus including this circuit board and an electronic component mounted thereon. [Solution] The circuit board includes a ceramic sintered body (11) and a metal wiring layer (13) provided on at least one primary surface (11a) thereof with a glass layer (12) interposed therebetween, and when the cross section of the circuit board perpendicular to the primary surface (11a) of the ceramic sintered body (11) is viewed, the ratio of the length of an interface (15) between the glass layer (12) and the metal wiring layer (13) to a length (12a) of the glass layer (12) in a direction along the primary surface (11a) is 1.25 to 1.80. As a result, good heat dissipation characteristics can be obtained, and the metal wiring layer (13) is not likely to be peeled away from the ceramic sintered body (11) due to operation of an electronic component (21) and/or cooling/heating cycles performed by repeated on-off operations thereof, so that a highly reliable circuit board which can be used for a long period of time can be provided.