公开(公告)号：EP3396441A1

公开(公告)日：2018-10-31

申请号：EP16875284.8

申请日：2016-11-08

Applicant: Omron Corporation

Inventor： KAWAI, Wakahiro ,  BESSHO, Takafumi

IPC: G02F1/1333 ,  G02F1/13 ,  G02F1/1345 ,  G09F9/00 ,  H01L25/16

CPC classification number: G02F1/13452 ,  G02F1/13 ,  G02F1/1333 ,  G02F1/1345 ,  H01L21/565 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/16227 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15323 ,  H01L2924/16251 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/092 ,  H05K1/181 ,  H05K1/185 ,  H05K3/12 ,  H05K3/284 ,  H05K3/32 ,  H05K2201/09118 ,  H05K2201/09236 ,  H05K2201/10128 ,  H05K2201/10136 ,  H05K2201/10371 ,  H05K2201/10507 ,  H05K2203/1316 ,  H05K2203/1327 ,  H05K2203/1469

Abstract: Provided are an electronic device and a manufacturing method therefor such that, when connecting a first electronic component configured to have a step near an external connection terminal to a second electronic component via wiring, the size increase of a manufacturing device can be avoided, wiring can be carried out at a low-cost, and the reliability of the wiring connections can be improved. An LCD (10) and an IC (20) are embedded and exposed in a resin molding (30) in such a manner that a connection electrode (13a) of the LCD (10) and an electrode of the IC (20) are positioned on the same plane.

公开(公告)号：EP3148297A4

公开(公告)日：2018-01-17

申请号：EP14892372

申请日：2014-05-22

Applicant: MITSUBISHI ELECTRIC CORP

Inventor： ARAKI REI ,  KAWANO YU ,  ASAO YOSHIHITO

IPC: H05K1/02 ,  H02K11/00 ,  H05K1/11

CPC classification number: H02K5/24 ,  H02K11/21 ,  H02K11/25 ,  H02K11/33 ,  H05K1/0201 ,  H05K1/0216 ,  H05K1/115 ,  H05K1/181 ,  H05K2201/062 ,  H05K2201/09063 ,  H05K2201/09972 ,  H05K2201/1009 ,  H05K2201/10507

Abstract: A board (100) includes a separating zone (30) in an area closer to the edge than to the center of the board (100), the separating zone (30) including one elongated through hole (31). A first group of electronic components (10) that is a source of heat or electric noise is placed in a first area (101) on the center side with respect to the separating zone (30) of the board (100). On the other hand, a second group of electronic components (20) from which influence of heat or electric noise from other components needs to be eliminated to a maximum extent is placed in a second area (102) on the edge side with respect to the separating zone (30) of the board (100).

公开(公告)号：EP2849545A2

公开(公告)日：2015-03-18

申请号：EP14183876.3

申请日：2014-09-08

Applicant: Samsung Electronics Co., Ltd

Inventor： Rhee, Bongjae

IPC: H05K1/02 ,  H05K7/20 ,  H01M10/66

CPC classification number: H05K7/2039 ,  H01M2/1022 ,  H01M2/1066 ,  H01M10/425 ,  H01M10/615 ,  H01M10/623 ,  H01M10/667 ,  H01M2200/00 ,  H01M2220/30 ,  H04M1/0262 ,  H05K1/0203 ,  H05K1/0209 ,  H05K1/0296 ,  H05K1/181 ,  H05K2201/066 ,  H05K2201/10037 ,  H05K2201/10507

Abstract: A portable electronic device 100 and a battery pack 130 for the portable electronic device are provided. The portable electronic device includes a Printed Circuit Board (PCB) 113 in which at least one electronic component 114 is disposed, and a battery pack including a heat conductor 115 separately disposed at a gap from the PCB and that transfers heat generated in the electronic component to a battery cell.

Abstract translation: 提供了用于便携式电子设备的便携式电子设备100和电池组130。 便携式电子装置包括其中设置至少一个电子部件114的印刷电路板（PCB）113和包括热导体115的电池组，热导体115分开地设置在与PCB的间隙处，并且将电子部件中产生的热量 到电池单元。

公开(公告)号：EP2719267B1

公开(公告)日：2016-05-18

申请号：EP12796666.1

申请日：2012-06-07

Applicant: Moncrieff, Scott

Inventor： Moncrieff, Scott

IPC: H05K7/02

CPC classification number: H05K5/0017 ,  B29C45/14467 ,  B29C45/14639 ,  B29C45/14688 ,  B29C2045/14532 ,  D06F39/005 ,  G02B6/0001 ,  H05K1/0298 ,  H05K1/16 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/12 ,  H05K3/284 ,  H05K3/30 ,  H05K5/0243 ,  H05K2201/09818 ,  H05K2201/10507 ,  Y10T29/49004

公开(公告)号：EP2894714A4

公开(公告)日：2016-04-20

申请号：EP13833774

申请日：2013-06-20

Applicant: DENSO CORP ,  NIPPON SOKEN

Inventor： YUKIZAKI YASUMUNE ,  SUZUKI TADAO ,  KATAOKA RYOHEI ,  SUGIMOTO YUJI

IPC: H01Q1/32 ,  H01Q1/02 ,  H01Q1/22

CPC classification number: H01Q1/3275 ,  H01Q1/02 ,  H01Q1/241 ,  H01Q1/42 ,  H01Q9/42 ,  H05K1/181 ,  H05K5/003 ,  H05K2201/10098 ,  H05K2201/10507

Abstract: A vehicle-mounted antenna device (20) includes a base (22), a board (24), a circuit section (30), and a housing (32). The base is mountable on a roof (11) of a vehicle (10). The board has an antenna element section (26) and is stood on a surface (22a) of the base. The circuit section serves as at least part of a wireless communication circuit electrically connected to the antenna element section. The housing is made of a resin material and forms a projection of a vehicle outer shape. The board and the circuit section are located in space formed by the base and the housing. The board is stood on the surface of the base so that a first direction perpendicular to the surface of the base differs from a second direction equal to a thickness direction of the board. The circuit section is implemented on the board at a position away from the base in the first direction.

公开(公告)号：EP2719267A4

公开(公告)日：2015-03-18

申请号：EP12796666

申请日：2012-06-07

Applicant: MONCRIEFF SCOTT

Inventor： MONCRIEFF SCOTT

IPC: H05K7/02

CPC classification number: H05K5/0017 ,  B29C45/14467 ,  B29C45/14639 ,  B29C45/14688 ,  B29C2045/14532 ,  D06F39/005 ,  G02B6/0001 ,  H05K1/0298 ,  H05K1/16 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/12 ,  H05K3/284 ,  H05K3/30 ,  H05K5/0243 ,  H05K2201/09818 ,  H05K2201/10507 ,  Y10T29/49004

公开(公告)号：EP2286644A1

公开(公告)日：2011-02-23

申请号：EP09753314.5

申请日：2009-05-29

Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： WEICHSLBERGER, Günther ,  KRIECHBAUM, Arno ,  MORIANZ, Mike ,  HASLEBNER, Nikolai ,  STAHR, Johannes ,  HARING, Fritz ,  FREYDL, Gerhard ,  KOERTVELYESSY, Andrea ,  BEESLEY, Mark ,  ZLUC, Andreas ,  SCHRITTWIESER, Wolfgang

IPC: H05K1/18

CPC classification number: H05K1/183 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L2224/24137 ,  H01L2224/2518 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/351 ,  H05K1/0206 ,  H05K1/185 ,  H05K3/305 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/09845 ,  H05K2201/10507 ,  H05K2201/10674 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  H01L2924/00

Abstract: In a method for integrating at least one electronic component into a printed circuit board, the following steps are provided: providing a layer (4) of a printed circuit board for supporting the electronic component (1, 2, 3), applying an adhesive (5) to a surface of the layer (4), fixing the electronic component (1, 2, 3) on the layer (4) by means of the adhesive (5), applying or arranging at least one electrically conductive layer (8) on or at the component (1, 2, 3) at the side or surface remote from the adhesive (5), and patterning the electrically conductive layer (8) in accordance with the contacts (7) of the electronic component (1, 2, 3) and/or in accordance with conductor tracts to be formed on the printed circuit board. A printed circuit board produced in accordance with this method is furthermore provided.

公开(公告)号：EP2820929A4

公开(公告)日：2015-09-30

申请号：EP12869733

申请日：2012-03-01

Applicant: AUTOLIV DEV

Inventor： CACLARD LAURENT

IPC: H05K9/00 ,  H05K1/02 ,  H05K5/00

CPC classification number: H05K9/0039 ,  H05K1/0215 ,  H05K1/0218 ,  H05K5/0047 ,  H05K7/1427 ,  H05K2201/0723 ,  H05K2201/0919 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10371 ,  H05K2201/10507

Abstract: An electronic unit (1) having a circuit board, PCB, (2) arranged to be mounted in a main housing (6, 7 and having a first housing part (6) and a second housing part (7), where the first housing part (6) is at least partly electrically conducting. The PCB (2) having a first outer layer (3), a second outer layer (4), and a ground plane (5). The first outer layer (3) faces the first housing part (6) and the second outer layer (4) faces the second housing part (7) The ground plane (5) is in electrical contact with the first housing part (6) forming a first chamber (29), facing the first outer layer (3), and a second chamber (30), facing the second outer layer (4). The chambers (29, 30) are separated by the ground plane (5), providing electromagnetic shielding between the chambers (29, 30).

公开(公告)号：EP2894714A1

公开(公告)日：2015-07-15

申请号：EP13833774.6

申请日：2013-06-20

Applicant: Denso Corporation ,  Nippon Soken, Inc.

Inventor： YUKIZAKI, Yasumune ,  SUZUKI, Tadao ,  KATAOKA, Ryohei ,  SUGIMOTO, Yuji

IPC: H01Q1/32 ,  H01Q1/22

CPC classification number: H01Q1/3275 ,  H01Q1/02 ,  H01Q1/241 ,  H01Q1/42 ,  H01Q9/42 ,  H05K1/181 ,  H05K5/003 ,  H05K2201/10098 ,  H05K2201/10507

Abstract: A vehicle-mounted antenna device (20) includes a base (22), a board (24), a circuit section (30), and a housing (32). The base is mountable on a roof (11) of a vehicle (10). The board has an antenna element section (26) and is stood on a surface (22a) of the base. The circuit section serves as at least part of a wireless communication circuit electrically connected to the antenna element section. The housing is made of a resin material and forms a projection of a vehicle outer shape. The board and the circuit section are located in space formed by the base and the housing. The board is stood on the surface of the base so that a first direction perpendicular to the surface of the base differs from a second direction equal to a thickness direction of the board. The circuit section is implemented on the board at a position away from the base in the first direction.

Abstract translation: 车载天线装置（20）包括基座（22），电路板（24），电路部分（30）和壳体（32）。 基座可安装在车辆（10）的屋顶（11）上。 板具有天线元件部分（26）并且站在基座的表面（22a）上。 电路部分用作电连接到天线元件部分的无线通信电路的至少一部分。 壳体由树脂材料制成并形成车辆外形的突起。 板和电路部分位于由基座和壳体形成的空间中。 板位于基座的表面上，使得垂直于基座表面的第一方向与等于板的厚度方向的第二方向不同。 电路部分在板上在第一方向远离基座的位置上实现。

公开(公告)号：EP2719267A2

公开(公告)日：2014-04-16

申请号：EP12796666.1

申请日：2012-06-07

Applicant: Moncrieff, Scott

Inventor： Moncrieff, Scott

IPC: H05K7/02

CPC classification number: H05K5/0017 ,  B29C45/14467 ,  B29C45/14639 ,  B29C45/14688 ,  B29C2045/14532 ,  D06F39/005 ,  G02B6/0001 ,  H05K1/0298 ,  H05K1/16 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/12 ,  H05K3/284 ,  H05K3/30 ,  H05K5/0243 ,  H05K2201/09818 ,  H05K2201/10507 ,  Y10T29/49004

Abstract: Provided are systems and methods for a control assembly including: a first film that is in-molded that includes decorative graphics, a front surface and a rear surface; and a second film molded to the rear surface of the first film having a printed circuit that includes sensors, control circuits and interconnects and a front and rear surface; and an internal connector.

Abstract translation: 提供了用于控制组件，其包括系统和方法：第一电影并在模制做包括装饰图形，前表面和后表面; 和第二薄膜成型，具有印刷电路做了包括传感器和控制电路，互连和一个前部和后部表面的第一部电影的后表面; 和内部连接器。